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Last 37.20 TWD
Change Today +1.45 / 4.06%
Volume 37.2M
2311 On Other Exchanges
Symbol
Exchange
Taiwan
New York
Mexico
Frankfurt
As of 2:38 AM 07/28/15 All times are local (Market data is delayed by at least 15 minutes).

advanced semiconductor engr (2311) Snapshot

Open
36.00
Previous Close
35.75
Day High
37.70
Day Low
36.00
52 Week High
04/27/15 - 48.05
52 Week Low
10/21/14 - 33.75
Market Cap
293.6B
Average Volume 10 Days
31.8M
EPS TTM
3.20
Shares Outstanding
7.9B
EX-Date
08/10/15
P/E TM
11.6x
Dividend
2.00
Dividend Yield
3.48%
Current Stock Chart for ADVANCED SEMICONDUCTOR ENGR (2311)

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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services (EMS) segments. The Packaging segment offers packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, and IC wirebonding packages, including lead frame-based package types, such as quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, and advanced QFN; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire and silver bonding solutions, as well as module assembly services, and interconnect materials. The Testing segment provides a range of semiconductor testing services, including front-end test engineering testing, wafer probing, logic/mixed-signal/RF/module system-in-package/discrete final testing services, other test related services, and drop shipment services. The EMS segment offers electronics manufacturing services in relation to computers, peripherals, communications, industrial, automotive electronics, and storage and server applications. It serves information, communications, consumer electronics, automotive electronics, medical treatment, industrial applications, aviation, navigation, national defense, and transportation industries. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

68,100 Employees
Last Reported Date: 03/27/15
Founded in 1984

advanced semiconductor engr (2311) Top Compensated Officers

No compensation data is available at this time for the top officers at this company.

Executives, Board Directors

advanced semiconductor engr (2311) Key Developments

ASE Test Limited Funds Loan to Advanced Semiconductor Engineering, Inc

ASE Test Limited announced current additional loans amount of TWD 4,335,800,000 to Advanced Semiconductor Engineering Inc. Ceiling on the loan amounts is TWD 47,773,795,000. Originally extended loans amount was TWD 24,050,970,000. Total extended amount of loans is TWD 28,386,770,000. The reason for the current additional loan is for operation needs.

Advanced Semiconductor Engineering Inc. Approves Amendment of Articles of Incorporation

Advanced Semiconductor Engineering Inc. announced that at the annual shareholders’ meeting held on June 23, 2015, the company approved revision of Articles of Incorporation.

Advanced Semiconductor Engineering Inc. Reports Unaudited Consolidated Revenue Results for the Month and Second Quarter Ended June 30, 2015

Advanced Semiconductor Engineering Inc. reported unaudited consolidated revenue results for the month and second quarter ended June 30, 2015. For the month, the company reported net revenues of TWD 24,832 million against TWD 19,487 million a year ago. For the quarter, the company reported net revenues of TWD 70,222 million against TWD 58,615 million a year ago.

 

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Industry Analysis

2311

Industry Average

Valuation 2311 Industry Range
Price/Earnings 12.3x
Price/Sales 1.1x
Price/Book 1.9x
Price/Cash Flow 11.7x
TEV/Sales 0.5x
 | 

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