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Last 42.65 TWD
Change Today -0.65 / -1.50%
Volume 30.3M
2311 On Other Exchanges
Symbol
Exchange
New York
Mexico
Frankfurt
As of 1:30 AM 06/3/15 All times are local (Market data is delayed by at least 15 minutes).

advanced semiconductor engr (2311) Snapshot

Open
43.00
Previous Close
43.30
Day High
43.10
Day Low
42.20
52 Week High
04/27/15 - 48.05
52 Week Low
10/21/14 - 33.75
Market Cap
336.4B
Average Volume 10 Days
22.3M
EPS TTM
3.20
Shares Outstanding
7.9B
EX-Date
--
P/E TM
13.3x
Dividend
2.00
Dividend Yield
3.02%
Current Stock Chart for ADVANCED SEMICONDUCTOR ENGR (2311)

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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services (EMS) segments. The Packaging segment offers packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, and IC wirebonding packages, including lead frame-based package types, such as quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, and advanced QFN; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire and silver bonding solutions, as well as module assembly services, and interconnect materials. The Testing segment provides a range of semiconductor testing services, including front-end test engineering testing, wafer probing, logic/mixed-signal/RF/module system-in-package/discrete final testing services, other test related services, and drop shipment services. The EMS segment offers electronics manufacturing services in relation to computers, peripherals, communications, industrial, automotive electronics, and storage and server applications. It serves information, communications, consumer electronics, automotive electronics, medical treatment, industrial applications, aviation, navigation, national defense, and transportation industries. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

68,599 Employees
Last Reported Date: 04/30/15
Founded in 1984

advanced semiconductor engr (2311) Top Compensated Officers

No compensation data is available at this time for the top officers at this company.

Executives, Board Directors

advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. to Showcase System-In-Package Applications at Computex 2015

Advanced Semiconductor Engineering Inc. announced it will be showcasing System in Package (SiP) solutions in consumer applications at Computex 2015, scheduled to take place in Taipei, Taiwan, over June 2-5, 2015. These SiP applications highlight the synergy between ASE’s IC packaging, material and test technologies, together with the strong expertise of Universal Scientific Industrial Shanghai Co Ltd. (USI; SHA: 601231) in module level manufacturing services to bring SiP into the realm of the Internet-of-Things (IoT). SiP technology enables multiple semiconductor chips and passive components to be integrated within a smaller and more compact module without compromising the functionality and performance of the entire package or module. Hence, SiP can be ideally applied to many of today’s consumer technologies that require heterogeneous integration of numerous IC functions such as RF, processor, memory, sensors, power management, multimedia, and more, within very tight space constraints. ASE’s developments in SiP also serve to protect the environment as it reduces the number of required manufacturing steps. Previously, each device function was developed onto individual IC chips, but with SiP technology, the ICs can be designed and directly embedded onto a substrate, then onto a module. The reduction in manufacturing steps results in less required materials as well as increased efficiency in logistics management during inventory shipment.

Advanced Semiconductor Engineering Inc. Presents at Bank of America Merrill Lynch 2015 Global Technology Conference, Jun-02-2015

Advanced Semiconductor Engineering Inc. Presents at Bank of America Merrill Lynch 2015 Global Technology Conference, Jun-02-2015 . Venue: The Ritz Carlton, 600 Stockton Street, San Francisco, California, United States. Speakers: Kenneth Hsiang, General Manager of ISE Labs.

Advanced Semiconductor Engineering Inc. Proposes Dividend

Advanced Semiconductor Engineering Inc. proposed a dividend of TWD 2 per share, total of TWD 15,589,825,292, all of which will be distributed in cash at the AGM to be held on June 23, 2015.

 

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Industry Analysis

2311

Industry Average

Valuation 2311 Industry Range
Price/Earnings 14.7x
Price/Sales 1.3x
Price/Book 2.3x
Price/Cash Flow 13.9x
TEV/Sales 0.7x
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