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Last 15.30 TWD
Change Today +0.10 / 0.66%
Volume 35.5M
2303 On Other Exchanges
New York
As of 2:39 AM 03/30/15 All times are local (Market data is delayed by at least 15 minutes).

united microelectronics corp (2303) Snapshot

Previous Close
Day High
Day Low
52 Week High
07/14/14 - 16.30
52 Week Low
10/17/14 - 12.05
Market Cap
Average Volume 10 Days
Shares Outstanding
Dividend Yield
Current Stock Chart for UNITED MICROELECTRONICS CORP (2303)

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united microelectronics corp (2303) Details

United Microelectronics Corporation provides semiconductor wafer foundry solutions. Its foundry solutions include silicon verification, libraries and IP, design verification, design for manufacturing, MM/RF foundry design kit and design support manual, and design flow reference, as well as mask services, such as mask inspection, IP protection and data preparation, and tape-out status tracking. The company also offers testing and packaging service, package solution development, and product yield management. It operates primarily in Taiwan, Japan, Korea, China, Singapore, Europe, and the United States. United Microelectronics Corporation was founded in 1980 and is headquartered in Hsinchu, Taiwan.

Founded in 1980

united microelectronics corp (2303) Top Compensated Officers

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Executives, Board Directors

united microelectronics corp (2303) Key Developments

United Microelectronics Corporation Reports Consolidated Earnings Results for the Year Ended December 31, 2014

United Microelectronics Corporation reported consolidated earnings results for the fourth quarter and full year 2014. For the year, the company reported net operating revenue of TWD 140,012,076,000 against TWD 123,811,636,000 a year ago. Operating income was TWD 10,076,332,000 against TWD 4,032,120,000 a year ago. Income from continuing operations before tax was TWD 13,513,296,000 against TWD 14,361,794,000 a year ago. Net income attributable to stock holders of the company was TWD 12,141,341,000 against TWD 12,630,203,000 a year ago. Diluted earnings per share was TWD 0.96 against TWD 0.95 a year ago. Net cash provided by operating activities was TWD 44,788,252,000 against TWD 43,472,461,000 a year ago. Acquisition of property, plant and equipment was TWD 43,237,007,000 against TWD 32,911,352,000 a year ago. Acquisition of intangible assets was TWD 1,153,356,000 against TWD 2,881,754,000 a year ago.

United Microelectronics Corporation, Board Meeting, Mar 18, 2015

United Microelectronics Corporation, Board Meeting, Mar 18, 2015. Agenda: To approve 2014 business report and financial statements; to propose dividend distribution and employee bonus; to approve issuance of unsecured zero coupon euro convertible bonds; to approve to acquire shares of Best Elite International Limited; to approve round's capital budget execution of TWD 24,103 million towards capacity deployment; to approve termination of the issuance plan for private placement; to approve the proposal for private placement based on future operation needs and proposed to the 2015 AGM for discussion; to approve company’s donation of TWD 12 million, to UMC Science and Culture Foundation; and to approve to release the managerial officer from non-competition restrictions.

Faraday Technology Corporation and United Microelectronics Corporation Announces Complete Set of Low Power Consumption Fundamental Ips for UMC's 55nm Low Power (Lp) Embedded Flash Process

Faraday Technology Corporation and United Microelectronics Corporation announced the availability of a complete set of low power consumption fundamental IPs developed for UMC's 55nm Low Power (LP) embedded Flash process. These IPs are designed to simultaneously meet both low-power and high-density requirements to satisfy the demands of a broad range of applications including IoT (Internet of Things) and wearable products. Low-power is prioritized for always-on devices in order to extend battery life. To fulfill the requirement, Faraday's memory compilers greatly reduce power consumption in the standby mode by up to 70% through optimization of the low leakage memory periphery. The robust I/O cells are available for both digital and analog interfaces, with a high voltage I/O cell option available that is especially compatible with a 5.0V interface. These IO cells are designed by using HVT core device to reduce leakage power. Furthermore, the IP suite also includes a new low-power USB 2.0 OTG PHY with HVT core device, which significantly reduces power consumption in the idle mode by up to 65% over traditional USB 2.0 OTG PHY.


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Valuation 2303 Industry Range
Price/Earnings 16.5x
Price/Sales 1.4x
Price/Book 0.9x
Price/Cash Flow 16.3x
TEV/Sales 0.7x

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