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Last 14,300 KRW
Change Today -50.00 / -0.35%
Volume 745.7K
As of 2:29 AM 10/2/15 All times are local (Market data is delayed by at least 15 minutes).

seoul semiconductor co ltd (046890) Snapshot

Previous Close
Day High
Day Low
52 Week High
10/10/14 - 23,700
52 Week Low
08/24/15 - 12,500
Market Cap
Average Volume 10 Days
Shares Outstanding
Dividend Yield
Current Stock Chart for SEOUL SEMICONDUCTOR CO LTD (046890)

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seoul semiconductor co ltd (046890) Details

Seoul Semiconductor Co., Ltd. manufactures and sells LED products worldwide. It offers Acrich MJT, which allows operation at high voltage levels; Acrich2 17W module that enhances compatibility with phase cut dimmer and analog dimmer; and Acrich, a semiconductor light for residential and commercial lighting applications. The company also provides various types of LEDs for lighting, BLU, mobile, automotive, and customized module applications. Seoul Semiconductor Co., Ltd. sells its products in Africa, the Middle East, Europe, Asia, Australia, North America, and South America. The company was founded in 1987 and is headquartered in Ansan, South Korea.

Founded in 1987

seoul semiconductor co ltd (046890) Top Compensated Officers

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Executives, Board Directors

seoul semiconductor co ltd (046890) Key Developments

Seoul Semiconductor Announces Production of WICOP Based LEDs

Seoul Semiconductor Co., Ltd. has announced mass production of new wafer level integrated chip on PCB, or WICOP, light emitting diode, or LEDs. This technology does not need processes such as die bonding or wire bonding, which are necessary for conventional LED package production nor does it contain major LED package component parts such as lead-frame, or gold wire. WICOP (Wafer Level Integrated Chip on PCB) is a totally new concept for an LED product which has overcome the limits posed by the existing CSP (Chip Scale Package) solutions. As it is designed to directly connect the chip to PCB, there is no need for packaging processes, such as die bonding or wire bonding. In addition, as there is no intermediate substrate, the size of the chip and package is 100% the same. It is characterized by the super small size and high efficiency. It is also good for the high luminance and thermal conductivity. In the case of the widely available product TOP LED, a variety of equipment is required for the production such as die bonding machines to attach the chip to the lead frame, wire bonding machines to connect electrodes to the gold wire, as well as material in the product itself, such as lead frame, gold wire, and adhesives required in each process. Due to this packaging process a conventional LED results in a package size larger than the actual chip size, and so is space limited as the size of the chip could not be made smaller to meet specification requirements. Seoul Semiconductor were the first to introduce to the world a complete concept of WICOP products in which the size of the package (PKG) is the same as that of chip, and does not use other costly materials by directly attaching the chip to the PCB.

Seoul Semiconductor Co., Ltd., Special/Extraordinary Shareholders Meeting, Sep 11, 2015

Seoul Semiconductor Co., Ltd., Special/Extraordinary Shareholders Meeting, Sep 11, 2015., at 09:00 Korea Standard Time.

Seoul Semiconductor Co., Ltd., Q2 2015 Earnings Call, Jul 27, 2015

Seoul Semiconductor Co., Ltd., Q2 2015 Earnings Call, Jul 27, 2015


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046890:KS 14,300.00 KRW -50.00

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Valuation 046890 Industry Range
Price/Earnings NM Not Meaningful
Price/Sales 0.9x
Price/Book 1.4x
Price/Cash Flow NM Not Meaningful
TEV/Sales 0.4x

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