Last 2,050 KRW
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signetics corp (033170) Snapshot

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04/8/14 - 2,310
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11/4/14 - 1,210
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signetics corp (033170) Details

Signetics Corporation provides semiconductor assembly and testing services. It offers test program development, wafer probe, final test, burn in, and other test support services. The company provides various laminate packages for various applications in communications, consumer, and computing markets, as well as provides tape BGAs in EBGA and FBGA formats. It also offers lead frame packages for various applications, such as logic, analog, RF, controllers, and drivers. The company was founded in 1966 and is based in Paju, South Korea. Signetics Corporation is a subsidiary of Young Poong Corporation.

Founded in 1966

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signetics corp (033170) Key Developments

Signetics Korea Co., Ltd., Annual General Meeting, Mar 21, 2014

Signetics Korea Co., Ltd., Annual General Meeting, Mar 21, 2014., at 09:00 Korea Standard Time. Location: Paju-si, Gyeonggi-do 679-4 seongdongri. Agenda: To consider approval of financial statement; to consider appointment of corporate director hahumok; to consider appointment of three won half of inside directors; to consider appointment of outside directors jeongyeonho; to consider appointment of part-time audit gimmanuk; to consider approval of director remuneration; to consider date of board of directors' resolution; and to consider other references concerning investment decisions.

Signetics Corporation Introduces New MapBGA Package

Signetics Corporation introduced their new MapBGA package (Patent Pending) to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process. A one shot side gate map molding process is used to cover the entire substrate area, protecting the active traces and vias. This process allows for more efficient use of the substrate panels and strips with as much as 55% more units per panel verses a typical PBGA package. The process is very robust as it uses proven transfer molding equipment and the mold clamps only touch the non-active area of each strip. Also, the assembled devices are saw singulated, eliminating mechanical stress on the package from traditional punch methods of singulation. Finally, the map molding process allows the package to have a larger mold cap and in turn, accommodate a larger die. Signetics offers a broad range of ball grid array (BGA) packaging including flip chip, stacked die, multi-chip and thermally enhanced variations. Assembly partnerships with Tier 1 device manufacturers has helped drive Signetics to continue to develop these next generation BGA packages to create a dynamic portfolio of semiconductor assembly solutions.

Signetics Korea Co., Ltd., Annual General Meeting, Mar 22, 2013

Signetics Korea Co., Ltd., Annual General Meeting, Mar 22, 2013., at 11:30 Korea Standard Time. Location: Paju seongdongri 674-4 hotels Wiz basement floor conference hall. Agenda: To approve financial statements; to approve election of directors; to approve appointment of outside director; to approve directors' remuneration limit; and to approve some changes in articles of incorporation.


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