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Last CNY30.82 CNY
Change Today -1.16 / -3.63%
Volume 3.8M
002618 On Other Exchanges
As of 3:00 AM 07/30/15 All times are local (Market data is delayed by at least 15 minutes).

shenzhen danbond technolog-a (002618) Snapshot

Previous Close
Day High
Day Low
52 Week High
06/18/15 - CNY62.89
52 Week Low
12/30/14 - CNY24.45
Market Cap
Average Volume 10 Days
Shares Outstanding
Dividend Yield
Current Stock Chart for SHENZHEN DANBOND TECHNOLOG-A (002618)

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shenzhen danbond technolog-a (002618) Details

Shenzhen Danbond Technology Co., Ltd. is engaged in the research, development, manufacture, and sale of flexible circuits and its materials in primarily in China. The company offers FCCL single and double sides substrates used in LCD monitors, LCD TVs, cameras, mobile phones, netbooks, e-books, cars, etc.; COF flexible encapsulation substrates; COF products used in LCD TVs, smart 3G phones and laptop computers, and other products with LCD display drivers; and FPC flexible circuits. It also provides encapsulation-related heat curing adhesive and micro adhesive glue films. Shenzhen Danbond Technology Co., Ltd. was founded in 2001 and is based in Shenzhen, China.

Founded in 2001

shenzhen danbond technolog-a (002618) Top Compensated Officers

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Executives, Board Directors

shenzhen danbond technolog-a (002618) Key Developments

Shenzhen Danbond Technology Co., Ltd. to Implement Final Dividend for the Year 2014, Payable on June 30, 2015

Shenzhen Danbond Technology Co., Ltd. will implement cash dividend of CNY 0.50000000 per 10 A shares (tax included) under 2014 final distribution plan. The distribution will be payable on June 30, 2015 with the record date of June 29, 2015. Ex-date is June 30, 2015.

Shenzhen Danbond Technology Co., Ltd. Approves Amendments to the Company's Articles of Association

Shenzhen Danbond Technology Co., Ltd. approved amendments to the company's articles of association at its extraordinary general meeting of 2015 held on June 05, 2015.

Shenzhen Danbond Technology Co., Ltd. Announces Cash Dividend for 2015

Shenzhen Danbond Technology Co., Ltd. announced cash dividend of CNY 0.50000000 per 10 shares (tax included) for 2015 approved at the Annual General Meeting of 2014 on 15 May 2015.


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002618:CH CNY30.82 CNY -1.16

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Valuation 002618 Industry Range
Price/Earnings 61.9x
Price/Sales 10.8x
Price/Book 3.6x
Price/Cash Flow 62.2x
TEV/Sales 9.2x

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