Bloomberg Anywhere Login

Bloomberg

Connecting decision makers to a dynamic network of information, people and ideas, Bloomberg quickly and accurately delivers business and financial information, news and insight around the world.

Company

Financial Products

Enterprise Products

Media

Customer Support

  • Americas

    +1 212 318 2000

  • Europe, Middle East, & Africa

    +44 20 7330 7500

  • Asia Pacific

    +65 6212 1000

Communications

Industry Products

Media Services

Follow Us


Last CNY30.82 CNY
Change Today -1.16 / -3.63%
Volume 3.8M
002618 On Other Exchanges
Symbol
Exchange
Shenzhen
As of 3:00 AM 07/30/15 All times are local (Market data is delayed by at least 15 minutes).

shenzhen danbond technolog-a (002618) Snapshot

Open
CNY31.79
Previous Close
CNY31.98
Day High
CNY32.65
Day Low
CNY30.51
52 Week High
06/18/15 - CNY62.89
52 Week Low
12/30/14 - CNY24.45
Market Cap
5.6B
Average Volume 10 Days
6.0M
EPS TTM
CNY0.50
Shares Outstanding
182.6M
EX-Date
06/30/15
P/E TM
61.6x
Dividend
CNY0.05
Dividend Yield
0.16%
Current Stock Chart for SHENZHEN DANBOND TECHNOLOG-A (002618)

Related News

No related news articles were found.

shenzhen danbond technolog-a (002618) Related Businessweek News

No Related Businessweek News Found

shenzhen danbond technolog-a (002618) Details

Shenzhen Danbond Technology Co., Ltd. is engaged in the research, development, manufacture, and sale of flexible circuits and its materials in primarily in China. The company offers FCCL single and double sides substrates used in LCD monitors, LCD TVs, cameras, mobile phones, netbooks, e-books, cars, etc.; COF flexible encapsulation substrates; COF products used in LCD TVs, smart 3G phones and laptop computers, and other products with LCD display drivers; and FPC flexible circuits. It also provides encapsulation-related heat curing adhesive and micro adhesive glue films. Shenzhen Danbond Technology Co., Ltd. was founded in 2001 and is based in Shenzhen, China.

Founded in 2001

shenzhen danbond technolog-a (002618) Top Compensated Officers

No compensation data is available at this time for the top officers at this company.

Executives, Board Directors

shenzhen danbond technolog-a (002618) Key Developments

Shenzhen Danbond Technology Co., Ltd. to Implement Final Dividend for the Year 2014, Payable on June 30, 2015

Shenzhen Danbond Technology Co., Ltd. will implement cash dividend of CNY 0.50000000 per 10 A shares (tax included) under 2014 final distribution plan. The distribution will be payable on June 30, 2015 with the record date of June 29, 2015. Ex-date is June 30, 2015.

Shenzhen Danbond Technology Co., Ltd. Approves Amendments to the Company's Articles of Association

Shenzhen Danbond Technology Co., Ltd. approved amendments to the company's articles of association at its extraordinary general meeting of 2015 held on June 05, 2015.

Shenzhen Danbond Technology Co., Ltd. Announces Cash Dividend for 2015

Shenzhen Danbond Technology Co., Ltd. announced cash dividend of CNY 0.50000000 per 10 shares (tax included) for 2015 approved at the Annual General Meeting of 2014 on 15 May 2015.

 

Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup
Recently Viewed
002618:CH CNY30.82 CNY -1.16

002618 Competitors

Market data is delayed at least 15 minutes.

Company Last Change
No competitor information is available for 002618.
View Industry Companies
 

Industry Analysis

002618

Industry Average

Valuation 002618 Industry Range
Price/Earnings 61.9x
Price/Sales 10.8x
Price/Book 3.6x
Price/Cash Flow 62.2x
TEV/Sales 9.2x
 | 

Sponsored Financial Commentaries

Sponsored Links

Report Data Issue

To contact SHENZHEN DANBOND TECHNOLOG-A, please visit www.danbang.com/. Company data is provided by Capital IQ. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at bwwebmaster@businessweek.com.