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lasertec corp (6920) Snapshot

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lasertec corp (6920) Details

Lasertec Corporation develops, manufactures, sells, and services various inspection and metrology systems worldwide. The company provides wafer and mask inspection/measurement, and printed circuit board inspection systems for semiconductor industry; and flat panel display (FPD) mask inspection systems for FPD industry. It also offers hybrid and violet laser microscopes; and transparent wafer inspection, SiC wafer inspection, PV cell measurement, and LiB application systems for manufacturing of energy-efficient products. The company was formerly known as NJS Corporation and changed its name to Lasertec Corporation in 1986. Lasertec Corporation was founded in 1960 and is headquartered in Yokohama, Japan.

Founded in 1960

lasertec corp (6920) Top Compensated Officers

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lasertec corp (6920) Key Developments

ROHM Co., Ltd. Selects the Latest Model of Lasertec Corporation's SICA, SiC Wafer Inspection and Review System

Lasertec Corporation announced that ROHM Co. Ltd. selected the latest model of Lasertec's SICA, SiC wafer inspection and review system. ROHM provides various high-quality high-performance semiconductor devices that feature the process and design technologies for worldwide customers. Their corporate mission is "Quality is top priority." ROHM is a global leader in the manufacture of power devices, especially of silicon carbide or SiC devices. ROHM has decided to introduce the latest model of SICA as part of its efforts to further enhance SiC device quality and production infrastructure. Silicon carbide is a new material with properties suitable for power semiconductors and is viewed as a vitally important option for power device manufacturing. For mass production of SiC wafers and devices, further quality enhancement is expected. Amid various challenges, one of the critical factors in the mass production of high quality devices is to reduce defects that are commonly generated during grind and epitaxial processes. In this respect, it is extremely important to have a capability to accurately and quickly detect and categorize defects that affect device performance. Defects of interest (DOI) include not only scratches and epi-defects on wafer surface but also crystal-related defects such as basal plane dislocations (BPD) and stacking faults (SF) inside epi-layers. Eliminating these killer defects early in the process ensures high device yield in mass production. The latest model of SICA incorporates a photoluminescence-based technology that enables the simultaneous detection of both surface defects and crystal defects at a significantly higher throughput. Lasertec will continue to pursue the development and advancement of defect inspection technologies in order to facilitate the further enhancement of power device quality and productivity.

Lasertec Corporation Announces Dividend for the Year Ended June 30, 2015; Provides Dividend Guidance for the Year Ending June 30, 2016

Lasertec Corporation announced dividend for the year ended June 30, 2015. For the year, the company announced dividend of JPY 46.00 per share. For the year ending June 30, 2016, the company expects to pay a dividend of JPY 38 per share.

Lasertec Corporation Nominates Hirokazu Seki as New Director

Lasertec Corporation announced that the Board of Directors nominated Hirokazu Seki as new director on August 7, 2015. The nomination is subject to approval of shareholders at the Ordinary General Meeting of Shareholders scheduled for September 28, 2015. His current designation is General Manager, Technology Department 1 and, concurrently, General Manager, Solution Sales Department 1.

 

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Valuation 6920 Industry Range
Price/Earnings 9.6x
Price/Sales 1.9x
Price/Book 1.4x
Price/Cash Flow 10.0x
TEV/Sales 1.5x
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