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lasertec corp (6920) Details

Lasertec Corporation develops, manufactures, sells, and services various inspection and metrology systems worldwide. The company provides wafer and mask inspection/measurement, and printed circuit board inspection systems for semiconductor industry; and flat panel display (FPD) mask inspection systems for FPD industry. It also offers hybrid and violet laser microscopes; and transparent wafer inspection, SiC wafer inspection, PV cell measurement, and LiB application systems for manufacturing of energy-efficient products. The company was formerly known as NJS Corporation and changed its name to Lasertec Corporation in 1986. Lasertec Corporation was founded in 1960 and is headquartered in Yokohama, Japan.

258 Employees
Last Reported Date: 09/29/15
Founded in 1960

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lasertec corp (6920) Key Developments

Lasertec Corporation Launches WASAVI Series SICA88

Lasertec Corporation announced that it has launched SICA88, the latest model of its SiC wafer inspection and review systems. Featuring both surface and hotoluminescence (PL) inspection capabilities in one body, SICA88 enables customers to concurrently inspect and analyze surface defects as well as crystallographic defects. SiC power devices are already being used in such applications as air conditioners, solar cells and railway cars and are beginning to capture additional markets. Expectations are high that they will be widely used on electric vehicles. Producing SiC power devices is technically demanding, however. Various problems remain unsolved, including crystallographic defects that occur in production process. Quality control and cost reduction are therefore posing major challenges. SiC wafer manufacturers find it necessary to enhance and maintain wafer quality while SiC device manufacturers are expected to keep higher yields and reduce production cost. SICA is an inspection tool that is designed to help overcome these challenges. Lasertec launched SICA61 in 2009 for R&D use and SICA6X in 2011 for production use. Since then, SICA has become renowned for its high sensitivity and accurate defect classification capability and widely adopted by many customers. SICA88 introduces a new platform that combines the PL inspection capability with the confocal DIC optics used in the previous generation SICA models for surface inspection. It now offers simultaneous detection and classification of not only scratches and Epi defects on wafer surface but also crystallographic defects such as basal plane dislocations (BPD) and stacking faults (SF) inside Epi layers, thereby assisting the detection and analysis of defects that cause device malfunctions. The throughput of SICA88 is twice as high as that of SICA6X and, furthermore, BPD inspection is possible without compromising the throughput performance. One of the best ways to utilize SICA88 is to use it as a process monitor in wafer production, Epi process and device-making process for assisting root cause analysis. It also offers a wafer grading capability that helps achieve process cost reductions and higher device yields. Lasertec will continue to pursue the development and advancement of defect inspection technologies in order to facilitate the further enhancement of power device quality and productivity. Key features: Concurrent inspection of various surface defects and Epi layer BPD/SF; High accuracy Automatic Defect Classification (ADC) by virtue of ultra-high; resolution review images; High throughput (20 WPH with 6 inch wafer in high throughput mode). Applications: Incoming and outgoing inspection of bare SiC wafers and SiC Epi wafers; Monitoring of SiC polishing and epitaxial growth processes; Management of SiC device manufacturing processes.

ROHM Co., Ltd. Selects the Latest Model of Lasertec Corporation's SICA, SiC Wafer Inspection and Review System

Lasertec Corporation announced that ROHM Co. Ltd. selected the latest model of Lasertec's SICA, SiC wafer inspection and review system. ROHM provides various high-quality high-performance semiconductor devices that feature the process and design technologies for worldwide customers. Their corporate mission is "Quality is top priority." ROHM is a global leader in the manufacture of power devices, especially of silicon carbide or SiC devices. ROHM has decided to introduce the latest model of SICA as part of its efforts to further enhance SiC device quality and production infrastructure. Silicon carbide is a new material with properties suitable for power semiconductors and is viewed as a vitally important option for power device manufacturing. For mass production of SiC wafers and devices, further quality enhancement is expected. Amid various challenges, one of the critical factors in the mass production of high quality devices is to reduce defects that are commonly generated during grind and epitaxial processes. In this respect, it is extremely important to have a capability to accurately and quickly detect and categorize defects that affect device performance. Defects of interest (DOI) include not only scratches and epi-defects on wafer surface but also crystal-related defects such as basal plane dislocations (BPD) and stacking faults (SF) inside epi-layers. Eliminating these killer defects early in the process ensures high device yield in mass production. The latest model of SICA incorporates a photoluminescence-based technology that enables the simultaneous detection of both surface defects and crystal defects at a significantly higher throughput. Lasertec will continue to pursue the development and advancement of defect inspection technologies in order to facilitate the further enhancement of power device quality and productivity.

Lasertec Corporation Announces Dividend for the Year Ended June 30, 2015; Provides Dividend Guidance for the Year Ending June 30, 2016

Lasertec Corporation announced dividend for the year ended June 30, 2015. For the year, the company announced dividend of JPY 46.00 per share. For the year ending June 30, 2016, the company expects to pay a dividend of JPY 38 per share.


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