Bloomberg Anywhere Remote Login Bloomberg Terminal Request a Demo

Bloomberg

Connecting decision makers to a dynamic network of information, people and ideas, Bloomberg quickly and accurately delivers business and financial information, news and insight around the world.

Company

Financial Products

Enterprise Products

Media

Customer Support

  • Americas

    +1 212 318 2000

  • Europe, Middle East, & Africa

    +44 20 7330 7500

  • Asia Pacific

    +65 6212 1000

Communications

Industry Products

Media Services

Follow Us


Last --
Change Today 0.00 / 0.00%
Volume 0.0
2317 On Other Exchanges
Symbol
Exchange
2317 is not on other exchanges.
All times are local (Market data is delayed by at least 15 minutes).

hon hai precision industry (2317) Snapshot

Open
--
Previous Close
--
Day High
--
Day Low
--
52 Week High
-- - --
52 Week Low
-- - --
Market Cap
--
Average Volume 10 Days
0.0
EPS TTM
--
Shares Outstanding
0.0
EX-Date
--
P/E TM
--
Dividend
--
Dividend Yield
--
Current Stock Chart for HON HAI PRECISION INDUSTRY (2317)

Related News

No related news articles were found.

hon hai precision industry (2317) Details

Hon Hai Precision Industry Co., Ltd., together with its subsidiaries, engages in the manufacture, sale, and service of connectors, cases, thermal modules, wired/wireless communication products, optical products, power supply modules, and assemblies in Taiwan and internationally. It is also involved in the research and development, manufacture, and sale of computer cases, connectors, and components; and manufacture of automobile wires/electronic devices, electronic components, power supply modules, application modules, network cables assemblies, cellular phones and camera lens, sensors, and cameras, as well as provides planning, advisory, and business management services. In addition, the company engages in the development, manufacture, and sale of computer systems, machinery, and equipment; provision of software and electronic information application, logistics, export processing, and construction services; packaging of sensors; and retail of office machinery and equipment, electronic appliances, and information/software services. Hon Hai Precision Industry Co., Ltd. offers its products for use in the information technology, communications, automotive equipment, precision molding, automobile, and consumer electronics industries. The company was founded in 1974 and is based in New Taipei City, Taiwan.

Founded in 1974

hon hai precision industry (2317) Top Compensated Officers

No compensation data is available at this time for the top officers at this company.

Executives, Board Directors

hon hai precision industry (2317) Key Developments

Sharp Reportedly May Not Sell LCD Unit

Sharp Corporation (TSE:6753) may consider spinning off its LCD business into a joint venture with a third party, rather than selling the unit outright, people familiar with the matter said. Sharp is considering Innovation Network Corporation of Japan and Hon Hai Precision Industry Co., Ltd. (TSEC:2317) as the two leading candidates for partnership, according to the people.

Reverse Logistics In Talks With Hon Hai For A Merger

Reverse Logistics Company Private Limited is in talks with Hon Hai Precision Industry Co., Ltd. (TSEC:2317) over the deal, which is yet to be finalized. Hitendra Chaturvedi, Founder and Chief Executive Officer of Reverse Logistics, was quoted by the Hong Kong-based Economic Times as saying this news.

Hon Hai Precision Industry Co., Ltd. to Form Strategic Alliance with Siliconware Precision Industries Co. Ltd

Hon Hai Precision Industry Co., Ltd. and Siliconware Precision Industries Co., Ltd. signed a Letter of Intent, whereby the parties will form a strategic alliance through the exchange of shares in accordance with Article 156.8 of the Company Act. The alliance will provide customers with the best integrated service program through future collaboration on technology and business. Hon Hai has always committed itself to providing a high technology one-stop service provider to system brand customers through vertical integration. The development of microchip related integration services is also one of Hon Hai conglomerate's direction for development. SPIL is the world's third larger IC assembly and testing house, with wire bonding, flip-chip, wafer level packaging, bumping, multichip package and high-level assembly and testing technology. ShunSin, the subsidiary of Hon Hai, also owns the System-in-Package (SiP) technology. The trend of consumer electronics development has seen an increase in demand for smaller form factor, energy saving, and high performance for products such as smart phones, wearables which all require minimizing size, weight, and better thermal dissipation. In order to achieve the above, SiP and high level IC assembly technology must be adopted and through chip to system vertical integration, actual synergy will be achieved. Upon the formation of the strategic alliance, the parties will work together on the following items: Substrate design integration to manufacture competitive products, such as Embedded Substrate, Panel Size Fan-Out WLCSP, and etc.; future demands in smart phones, internet of things, wearables, etc., SPIL will provide IC wire bonding and wafer level packaging technology combined with Hon Hai's SMT and module assembly technology in order to develop the next generation of system level assembly products; Jointly develop ASIC chip, assembly, modules, etc., from the design approach, in order to accelerate the time-to-market, increase product performance and lower costs; Closely collaborate on SiP related technology to fully explore its inherent commercial opportunities; In order to maximize the synergy of the strategic alliance, the parties will also work together on the following: Hon Hai's precision mold, machinery manufacturing, and automation technology will enhance SPIL's industry competitiveness; Hon Hai's unique thermal dissipation technology can improve SPIL's thermal dissipation process in IC packaging; As future mobile devices will be equipped with more functional modules such as fingerprint recognition, MEMS application, and high resolution camera, the miniaturization of SiP will become the major trend of the next generation IC packaging. Hon Hai and SPIL will closely cooperate and seek for a win-win partnership.

 

Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup
Recently Viewed
2317:TT 83.00 TWD -0.90

2317 Competitors

Market data is delayed at least 15 minutes.

Company Last Change
Flextronics International Ltd $10.29 USD -0.22
Intel Corp $28.52 USD -0.56
Lenovo Group Ltd $6.32 HKD +0.19
Samsung C&T Corp 48,100 KRW 0.00
Sumitomo Electric Industries Ltd ¥1,552 JPY -26.50
View Industry Companies
 

Industry Analysis

2317

Industry Average

Valuation 2317 Industry Range
Price/Earnings 8.5x
Price/Sales 0.3x
Price/Book 1.4x
Price/Cash Flow 8.6x
TEV/Sales NM Not Meaningful
 | 

Sponsored Financial Commentaries

Sponsored Links

Report Data Issue

To contact HON HAI PRECISION INDUSTRY, please visit www.foxconn.com. Company data is provided by Capital IQ. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at bwwebmaster@businessweek.com.