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tong hsing electronic indust (6271) Details

Tong Hsing Electronic Industries, Ltd. develops and manufactures micro modules and custom semiconductor packages in Taiwan. It provides semiconductor micro module assembly, and thick film and thin film substrate foundry services. The company also offers a range of microelectronic packaging technologies comprising assembly packaging services; backend technology and others; and RF testing services. In addition, it is involved in the contract manufacturing for microelectronic packaging and ceramic thick film/thin film substrate fabrication. The company’s products are used in IGBT, high-frequency switching power supply, automotive, aerospace, solar cell component, telecommunication power supply, laser system, high power led, microwave, semiconductor process equipment, hybrid electric vehicles, and sensor applications. Tong Hsing Electronic Industries, Ltd. was founded in 1974 and is headquartered in Taipei City, Taiwan.

Founded in 1974

tong hsing electronic indust (6271) Top Compensated Officers

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Executives, Board Directors

tong hsing electronic indust
Tong Hsing Electronic Industries, Ltd., Q2 2016 Operating Results Call, Aug 12, 2016

Tong Hsing Electronic Industries, Ltd., Q2 2016 Operating Results Call, Aug 12, 2016

Tong Hsing Electronic Industries, Ltd., Annual General Meeting, Jun 16, 2016

Tong Hsing Electronic Industries, Ltd., Annual General Meeting, Jun 16, 2016.

Tong Hsing Electronic Industries Signs Licensing Agreement with Invensas

Tong Hsing Electronic Industries, Ltd. has entered into a license agreement with Invensas Corporation for Invensas' Bond Via Array (TM) (BVA (R)) vertical interconnect technology.

 

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