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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services (EMS) segments. The Packaging segment offers packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, and IC wirebonding packages, including lead frame-based package types, such as quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, and advanced QFN; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire and silver bonding solutions, as well as module assembly services, and interconnect materials. The Testing segment provides a range of semiconductor testing services, including front-end test engineering testing, wafer probing, logic/mixed-signal/RF/module system-in-package/discrete final testing services, other test related services, and drop shipment services. The EMS segment offers electronics manufacturing services in relation to computers, peripherals, communications, industrial, automotive electronics, and storage and server applications. It serves information, communications, consumer electronics, automotive electronics, medical treatment, industrial applications, aviation, navigation, national defense, and transportation industries. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

68,100 Employees
Last Reported Date: 03/27/15
Founded in 1984

advanced semiconductor engr (2311) Top Compensated Officers

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advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. Announces Unaudited Consolidated Earnings Results for the Month and First Quarter Ended March 2015

Advanced Semiconductor Engineering Inc. announced unaudited consolidated earnings results for the month and first quarter ended March 2015. For the month, net revenues were TWD 22,325 million against TWD 19,867 million for the same period a year ago. For the quarter, net revenues were TWD 64,662 million against TWD 54,700 million for the same period a year ago.

Advanced Semiconductor Engineering Inc. Proposes Amendments to the Articles of Incorporation

Advanced Semiconductor Engineering Inc. will discuss the amendments to the Articles of Incorporation, at the AGM to be held on June 23, 2015.

ASE Inc. Reports Consolidated Earnings for the Year Ended December 31, 2014

ASE Inc. reported consolidated earnings for the year ended December 31, 2014. Under Taiwan IFRS, the company reported its consolidated profit attributable to owners of the company of TWD 23,592,667,000, consolidated profit attributable to non-controlling interests of TWD 629,419,000, total comprehensive income attributable to owners of the Company of TWD 28,730,614,000, total comprehensive income attributable to non-controlling interests of TWD 966,675,000, basic earnings per share of TWD 3.07, diluted earnings per share of TWD 2.95 in 2014. Under IFRS, the company reported its consolidated profit attributable to owners of the company of TWD 22,228,602,000, consolidated profit attributable to non-controlling interests of TWD 640,499,000, total comprehensive income attributable to owners of the company of TWD 27,394,362,000, total comprehensive income attributable to non-controlling interests of TWD 979,177,000, basic earnings per share of TWD 2.89, diluted earnings per share of TWD 2.79 in 2014.

 

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2311

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Valuation 2311 Industry Range
Price/Earnings 15.2x
Price/Sales 1.3x
Price/Book 2.2x
Price/Cash Flow 14.5x
TEV/Sales 0.7x
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