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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions. It also provides advanced packages, including wafer level chip scale, flip-chip (FC) chip scale, FC package in, FC BGA/HF FCBGA, FC and wire bonding, and integrated passive device packages; IC wire bonding packages, including lead frame-based package types, such as lead frame-based packages and substrate-based packages; system-in-package (SiP) products, as well as module assembly services; and interconnect materials. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/ MEMS/discrete final testing, and test-related services, as well as drop shipment services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

Founded in 1984

advanced semiconductor engr (2311) Top Compensated Officers

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advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. Reports Unaudited Consolidated Revenues Results for the Month and Third Quarter Ended September 2016

Advanced Semiconductor Engineering Inc. reported unaudited consolidated revenues results for the month and third quarter ended September 2016. For the month, the company reported net revenues of TWD 27,281 million compared to TWD 28,281 million a year ago. For the quarter, the company reported net revenues of TWD 72,784 million compared to TWD 72,870 million a year ago.

Advanced Semiconductor Engineering Inc. Announces Opening of New Green Building in Kaohsiung

Advanced Semiconductor Engineering Inc. announced opening of a new green building at the site of its K24 building in the Nantze Export Processing Phase 2 Zone in Kaohsiung, Taiwan. The building is part of ASE’s continued expansion plans for its research and development, and manufacturing campus in Taiwan. The 66,120 square meter K24 building will be the latest green building in ASE that incorporates green design in its construction with permeable pavement, stormwater management, earthquake proofing, energy-efficient lighting and ergonomically constructed workspaces. K24 will be the benchmark for ASE’s future building and office designs and will promote a comfortable and more productive working environment for its employees. The K24 facility will be one of ASE’s and the packaging industry’s core center of advanced development in IC packaging focusing on its leadership in system-in-package, 3D IC, fan-out wafer level packaging, system design and manufacturing technologies.

Advanced Semiconductor Engineering Inc. Presents at Asia Corporate Forum in Boston, Sep-28-2016

Advanced Semiconductor Engineering Inc. Presents at Asia Corporate Forum in Boston, Sep-28-2016 . Venue: Boston Harbor Hotel, Boston, United States. Speakers: Kenneth Hsiang, General Manager of ISE Labs Inc, Michelle Jao, manager of investor relations and business planning.


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Valuation 2311 Industry Range
Price/Earnings 16.1x
Price/Sales 1.1x
Price/Book 2.0x
Price/Cash Flow 15.0x
TEV/Sales 0.5x

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