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advanced semiconductor engr (2311) Snapshot

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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions. It also provides advanced packages, including wafer level chip scale, flip-chip (FC) chip scale, FC package in, FC BGA/HF FCBGA, FC and wire bonding, and integrated passive device packages, as well as high-bandwidth, package on, fan-out wafer-level, and ultra-thin profile packages; IC wire bonding packages, including lead frame-based package types, such as lead frame-based packages and substrate-based packages; system-in-package (SiP) products, as well as module assembly services; and interconnect materials, as well as assembles automotive electronic products. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/ MEMS/discrete final testing, and test-related services, as well as drop shipment services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications. The company offers its packaging and testing for its customers in communication, computing, and consumer electronic/industrial/automotive sectors. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

Founded in 1984

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advanced semiconductor engr
ASE Test Inc. Announces Loan Funds to Advanced Semiconductor Engineering

ASE Test Inc. announced that Advanced Semiconductor Engineering, Inc., who receive the monetary loans, its relationship to the company who extend the loans, ceiling amount on the monetary loans extended, amount of loans originally extended, amount of the current additional loans, whether or not the board of directors authorize the chairperson to give loans for the borrowing counterparty; total extended amount of loans and the reason for loans as of the date of occurrence of the event. The ceiling on the loan amount is TWD 66,501,460,000 and originally extended loan amount is TWD 36,929,640,000 with current additional loan amount is TWD 2,100,000,000. The total extended loan amount is TWD 39,029,640,000.

Advanced Semiconductor Engineering, Inc. Announces Total Cash Dividend Payable on September 8, 2017

The board of directors of Advanced Semiconductor Engineering, Inc. has resolved on July 13, 2017 that total cash dividends to common share holders of TWD 11,415,197,564 payable on September 8, 2017 with ex-dividend date is August 9, 2017 and record date is August 15, 2017.

Advanced Semiconductor Engineering Inc. Reports Unaudited Consolidated Revenue Results for the Month and Second Quarter Ended June 2017

Advanced Semiconductor Engineering Inc. reported unaudited consolidated revenue results for the month and second quarter ended June 2017. For the month, net revenues were TWD 23,078 million against TWD 21,774 million for the same period prior year. ATM net revenues were TWD 13,410 million against TWD 13,262 million for the same period prior year. For the quarter, net revenues were TWD 66,026 million against TWD 62,601 million for the same period prior year. ATM net revenues were TWD 39,048 million against TWD 38,504 million for the same period prior year.


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Price/Earnings 16.2x
Price/Sales 1.1x
Price/Book 1.9x
Price/Cash Flow 16.3x
TEV/Sales 0.6x

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