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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services (EMS) segments. The Packaging segment offers packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, and IC wirebonding packages, including lead frame-based package types, such as quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, and advanced QFN; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire and silver bonding solutions, as well as module assembly services, and interconnect materials. The Testing segment provides a range of semiconductor testing services, including front-end test engineering testing, wafer probing, logic/mixed-signal/RF/module system-in-package/discrete final testing services, other test related services, and drop shipment services. The EMS segment offers electronics manufacturing services in relation to computers, peripherals, communications, industrial, automotive electronics, and storage and server applications. It serves information, communications, consumer electronics, automotive electronics, medical treatment, industrial applications, aviation, navigation, national defense, and transportation industries. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

68,599 Employees
Last Reported Date: 04/30/15
Founded in 1984

advanced semiconductor engr (2311) Top Compensated Officers

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advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. Proposes Dividend

Advanced Semiconductor Engineering Inc. proposed a dividend of TWD 2 per share, total of TWD 15,589,825,292, all of which will be distributed in cash at the AGM to be held on June 23, 2015.

Advanced Semiconductor Engineering Inc. to Establish A Joint Venture Company with TDK Corporation for Embedded Substrate Manufacturing Business

Advanced Semiconductor Engineering Inc. that ASE will enter into a Joint Venture Agreement with TDK Corporation to establish a joint venture company (the JV Company) in Taiwan which is expected to manufacture IC embedded substrates utilizing TDK's SESUB technology. Pursuant to the Joint Venture Agreement and other supplementary agreements, the JV Company may provide part of TDK's production capacity for IC embedded substrates under certain specific circumstances. The JV company's indicative name is 'ASE Embedded Electronics Inc.' and its initial paid-in capital amount will be the equivalent in NT dollars of USD 39,490,000. ASE will inject USD 20,140,000 into the JV company for 51% shareholding, and TDK will inject USD 19,350,000 into the JV company for 49% shareholding. After the JV company obtains agreement from ASE and TDK to commence construction of its first manufacturing line, the JV company will pay USD 19,350,000 as a down payment for the royalty fees for the SESUB technology license granted by TDK. It is planned that the JV company's factory and manufacturing facility will be located in the Nantze Export Processing Zone, Kaohsiung City, Taiwan. The proposed establishment of and capital injection into the joint venture company is subject to various regulatory approvals or consents (including but not limited to the approvals by the Taiwan Fair Trade Commission and the Export Processing Zone Administration).

Advanced Semiconductor Engineering Inc., Board Meeting, May 08, 2015

Advanced Semiconductor Engineering Inc., Board Meeting, May 08, 2015. Agenda: To approve the investment in the shares of the joint venture company, ASE Embedded Electronics Inc.


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