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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions. It also provides advanced packages, including wafer level chip scale, flip-chip (FC) chip scale, FC package in, FC BGA/HF FCBGA, FC and wire bonding, and integrated passive device packages; IC wire bonding packages, including lead frame-based package types, such as lead frame-based packages and substrate-based packages; system-in-package (SiP) products, as well as module assembly services; and interconnect materials. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/ MEMS/discrete final testing, and test-related services, as well as drop shipment services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

Founded in 1984

advanced semiconductor engr (2311) Top Compensated Officers

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advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. Receive Monetary Loans

Advanced Semiconductor Engineering Inc. received monetary loans from its subsidiaries ASE Test Inc. etc. The final parent company ceiling on the loan amounts is TWD 66,998,166,000, originally extended loan amount is TWD 42,254,385,000 and current additional loans amount is TWD 10,203,650,000. Total extended amount of loans is TWD 52,458,035,000 and the current additional loans are for operation needs.

Advanced Semiconductor Engineering Inc. Reports Unaudited Consolidated Revenue Results for the Month Ended July 2016

Advanced Semiconductor Engineering Inc. reported unaudited consolidated revenue results for the month ended July 2016. For the month, the company reported net revenues of TWD 21,587 million against TWD 21,669 million a year ago.

Advanced Semiconductor Engineering Inc. Provides Revenue Guidance for the Third Quarter of 2016

Advanced Semiconductor Engineering Inc. provided revenue guidance for the third quarter of 2016. For the third quarter of 2016, the company expects revenues to be increase by 20%.

 

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2311

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Valuation 2311 Industry Range
Price/Earnings 16.8x
Price/Sales 1.1x
Price/Book 2.1x
Price/Cash Flow 15.7x
TEV/Sales 0.6x
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