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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions. It also provides advanced packages, including wafer level chip scale, flip-chip (FC) chip scale, FC package in, FC BGA/HF FCBGA, FC and wire bonding, and integrated passive device packages; IC wire bonding packages, including lead frame-based package types, such as lead frame-based packages and substrate-based packages; system-in-package (SiP) products, as well as module assembly services; and interconnect materials. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/ MEMS/discrete final testing, and test-related services, as well as drop shipment services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

Founded in 1984

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advanced semiconductor engr
Advanced Semiconductor Engineering, Inc. Announces Unaudited Consolidated Revenue Results for the Month and Fourth Quarter Ended December 2016

Advanced Semiconductor Engineering, Inc. announced unaudited consolidated revenue results for the month and fourth quarter ended December 2016. For the month, the company reported net revenues of TWD 25,271 million against TWD 21,529 million a year ago. For the fourth quarter, the company reported net revenues of TWD 2,439 million against TWD 2,321 million a year ago.

Advanced Semiconductor Engineering, Inc. Presents at Nomura@CES 2017, Jan-04-2017

Advanced Semiconductor Engineering, Inc. Presents at Nomura@CES 2017, Jan-04-2017 . Venue: Bellagio Hotel, Las Vegas, Nevada, United States. Speakers: Michelle Jao, Manager, Investor Relations and Business Planning.

Advanced Semiconductor Engineering Inc. Announces Loan Funds

Advanced Semiconductor Engineering Inc. announced subsidiaries ASE (Korea) Inc. loan funds to Advanced Semiconductor Engineering Inc. Ceiling on the loan amounts: TWD 66,429,285,000; Originally extended loans amount: TWD 46,976,023,000; Current additional loans amount: TWD 2,389,500,000; Total extended amount of loans: TWD 49,365,523,000. Reason for the current additional loans: Operation needs.

 

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2311

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Valuation 2311 Industry Range
Price/Earnings 15.2x
Price/Sales 0.9x
Price/Book 1.7x
Price/Cash Flow 14.6x
TEV/Sales 0.4x
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