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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services (EMS) segments. The Packaging segment offers packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, and IC wirebonding packages, including lead frame-based package types, such as quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, and advanced QFN; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire and silver bonding solutions, as well as module assembly services, and interconnect materials. The Testing segment provides a range of semiconductor testing services, including front-end test engineering testing, wafer probing, logic/mixed-signal/RF/module system-in-package/discrete final testing services, other test related services, and drop shipment services. The EMS segment offers electronics manufacturing services in relation to computers, peripherals, communications, industrial, automotive electronics, and storage and server applications. It serves information, communications, consumer electronics, automotive electronics, medical treatment, industrial applications, aviation, navigation, national defense, and transportation industries. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

68,100 Employees
Last Reported Date: 03/27/15
Founded in 1984

advanced semiconductor engr (2311) Top Compensated Officers

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Executives, Board Directors

advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. Appoints Mei-Yueh Ho as Independent Director

Advanced Semiconductor Engineering Inc. appointed Mei-Yueh Ho, Former Minister of Economic Affairs, Republic of China as independent director, effective June 23, 2015.

Advanced Semiconductor Engineering Inc. Approves Cash Dividends

Advanced Semiconductor Engineering Inc. at its Annual General Meeting held on June 23, 2015, approved total of TWD 15,589,825,292 will be distributed as dividends to shareholders at TWD 2 per share, all of which will be distributed in cash. The above distribution of dividends to shareholders and the cash and stock dividend distribution rates are calculated based on the number (7,794,912,646) of shares recorded in the Register of Shareholders as of March 19, 2015 after treasury stocks that were already bought back by ASE were subtracted.

Advanced Semiconductor Engineering, Inc. Announces Unaudited Consolidated Net Revenues for May 2015

Advanced Semiconductor Engineering Inc. announced its unaudited consolidated net revenues for May 2015. Net revenues were $763 million compared to $668 million a year ago.

 

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Industry Analysis

2311

Industry Average

Valuation 2311 Industry Range
Price/Earnings 14.0x
Price/Sales 1.2x
Price/Book 2.2x
Price/Cash Flow 13.3x
TEV/Sales 0.6x
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