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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services (EMS) segments. The Packaging segment offers packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, and IC wirebonding packages, including lead frame-based package types, such as quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, and advanced QFN; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire and silver bonding solutions, as well as module assembly services, and interconnect materials. The Testing segment provides a range of semiconductor testing services, including front-end test engineering testing, wafer probing, logic/mixed-signal/RF/module system-in-package/discrete final testing services, other test related services, and drop shipment services. The EMS segment offers electronics manufacturing services in relation to computers, peripherals, communications, industrial, automotive electronics, and storage and server applications. It serves information, communications, consumer electronics, automotive electronics, medical treatment, industrial applications, aviation, navigation, national defense, and transportation industries. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

68,100 Employees
Last Reported Date: 03/27/15
Founded in 1984

advanced semiconductor engr (2311) Top Compensated Officers

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advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. Reports Unaudited Consolidated Revenue Results for the Month Ended July 2015

Advanced Semiconductor Engineering Inc. reported unaudited consolidated revenue results for the month ended July 2015. For the month, the company reported net revenues of TWD 21,669 million against TWD 20,052 million a year ago.

Advanced Semiconductor Engineering Inc. Announces Unaudited Consolidated Earnings Results for the Second Quarter and Six Months Ended June 30, 2015

Advanced Semiconductor Engineering Inc. announced unaudited consolidated earnings results for the second quarter and six months ended June 30, 2015. For the quarter, total net revenues were TWD 70,222 million against TWD 58,615 million a year ago. Operating income was TWD 5,409 million against TWD 6,615 million a year ago. Income before tax was TWD 5,400 million against TWD 6,065 million a year ago. Income from continuing operations and before noncontrolling interest were TWD 3,804 million against TWD 5,244 million a year ago. Net income attributable to shareholders of the parent was TWD 3,652 million or TWD 0.43 per diluted share against TWD 5,106 million or TWD 0.65 per diluted share a year ago Capital expenditures totaled TWD 215 million. EBITDA was about TWD 434 million. The company had a positive cash flow. For the six months, total net revenues were TWD 134,884 million against TWD 113,315 million a year ago. Operating income was TWD 11,701 million against TWD 11,700 million a year ago. Income before tax was TWD 10,906 million against TWD 10,364 million a year ago. Income from continuing operations and before noncontrolling interest were TWD 8,454 million against TWD 8,813 million a year ago. Net income attributable to shareholders of the parent was TWD 8,121 million or TWD 1.02 per diluted share against TWD 8,556 million or TWD 1.08 per diluted share a year ago. Capital expenditures totaled TWD 353 million.

ASE Test Limited Funds Loan to Advanced Semiconductor Engineering, Inc

ASE Test Limited announced current additional loans amount of TWD 4,335,800,000 to Advanced Semiconductor Engineering Inc. Ceiling on the loan amounts is TWD 47,773,795,000. Originally extended loans amount was TWD 24,050,970,000. Total extended amount of loans is TWD 28,386,770,000. The reason for the current additional loan is for operation needs.

 

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Valuation 2311 Industry Range
Price/Earnings 10.7x
Price/Sales 0.8x
Price/Book 1.6x
Price/Cash Flow 10.1x
TEV/Sales 0.3x
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