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apacer technology inc (8271) Details

Apacer Technology Inc. provides memory modules, and digital storage hardware and software products in Taiwan. It offers DRAM memory modules; and industrial SSD solutions to replace traditional hard drives. The company also provides digital consumer products, including USBs, memory cards, card readers, solid state drives, portable HDs, multimedia projectors, wireless mouse, presentation makers, hubs, etc., as well as offers USB power chargers, presenters, USB flash drives, wireless speakers, and mobile accessories. Its products are used in military/aerospace, networking/server, interactive devices, medical, and personal computing applications. The company was founded in 1997 and is headquartered in New Taipei, Taiwan.

Founded in 1997

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apacer technology inc (8271) Key Developments

Apacer Technology, Inc. Makes A Foray into DDR4 Wide Temperature Memory Module Market

Apacer Technology, with the full support of its strategic partner Samsung Electronics Co., Ltd, has launched its first DDR4 wide temperature memory module series. Using industrial-grade chips, the memory module series provides a rugged solution for industrial equipments operating under extreme temperatures for long hours. Enhanced with underfill and industrial-grade wide temperature components, Apacer DDR4 wide temperature memory module series is cold-resistant, heat-resistant and highly reliable. In combination with its vibration and thermal shock resistance, the scope of applications for wide temperature memory products is expanded, meeting the requirements of industrial products operating in harsh environments. All industrial-grade components further reinforce stability under low/high temperature environments. In order to maintain highly stable operating performance in harsh environments, Apacer DDR4 memory module series not only uses original Samsung industrial-grade wide temperature chips, its passive components are also upgraded to full industrial grade. The wide temperature memory series adopts industrial-grade capacitors and resistors. Capacitors with maximum thermal resistance of 125°C ensures more stable supply voltage in a high-temperature environment, while industrial-grade precision resistors have lower tolerance (±1%) and more matching specifications, significantly increasing circuit stability and durability. Furthermore, to prevent instability of signal transmission in harsh environments, DDR4 wide temperature memory module utilizes 30µ thicker golden finger plating for its PCB. Underfill technique improves product reliability. Underfill technique is used under the BGA to reinforce the product's resistance against vibration and thermal shock. When subject to greater temperature changes, the difference in coefficient of thermal expansion between the silicon chip and the PCB substrate often causes relative shifts during thermal shock test, resulting in solder points falling off or fracturing. Underfill technique effectively strengthens the solder points between solder balls and circuit board, reducing thermal stress damage, increasing product reliability and thus increasing product lifespan. Apacer's new wide temperature DDR4 SODIMM for industrial use has a maximum capacity of 16GB and supports frequencies of up to 2,133/2,400MHz. Using high-quality DDR4 wide temperature chips and industrial-grade components, reinforced with underfill technique, it can adapt to extreme operating temperatures, providing impeccable durability for the system. Passing thermal shock test, which exposes a product to alternating extremes of high and low temperatures, it has been proven to operate within the temperature range of -40°C and 85°C, making it an applicable solution for industrial equipments, such as military, vehicular, outdoor and rugged computers. Apacer DDR4 Wide Temperature Spec: Module Type - DDR4 Wide Temperature SODIMM, Frequency – 2,400MHz /2,133MHz, Capacity - 8GB-16GB, Voltage - 1.2v, Pin count - 260-Pin, Width - 64-Bit, PCB Height - 1.181", Operation Temp. TC=-40°C to 85°C.

Apacer Technology, Inc.(TSEC:8271) added to S&P Global BMI Index

Apacer Technology, Inc.(TSEC:8271) added to S&P Global BMI Index

Apacer Technology, Inc. LaunchesVLP DDR4 Mini ECC UDIMM Series

Apacer Technology, Inc. has launched the VLP DDR4 mini ECC UDIMM which is especially designed for networking, telecom and industrial automation systems. Delivering advantages such as space-saving, high-speed data transmission and low power consumption, it is a perfect fit for network communication and embedded industrial automation equipment, optimizing high-performance cloud operating systems. Apacer VLP DDR4 mini ECC UDIMM memory modules are available in very low profile (VLP) and mini specifications. Measuring only 0.738-inch high and 80mm long, they effectively save over 60% space as compared to standard DDR4 ECC UDIMMs, and improve heat dissipation in products with space constraints, making them suitable for small-size industrial computers, microservers and networking equipment. A single-bit error could destroy data or crash the system. Apacer VLP DDR4 mini ECC UDIMM memory module is equipped with ECC function which helps to detect and correct memory error, preventing file damage or data loss from system crash. Its built-in thermal sensor also monitors memory temperature to increase product reliability. Operating at ultra-low voltage (1.2V), Apacer VLP DDR4 mini UDIMM memory module is up to 30% more energy efficient than previous-generation DDR3, reducing the costs of networking, server system and cloud enterprises. Apacer VLP DDR4 mini ECC UDIMM memory modules are available in two clock speeds, i.e. DDR4 2400 and 2133, and capacities ranging from 4-16GB. The memory modules are JEDEC-compliant, and manufactured to meet RoHS/Halogen Free environmental directives. Featuring small form factor and ECC/thermal sensor, they are highly stable and reliable, and are mainly used in industrial embedded, networking and server systems, meeting the requirements of low power consumption and equipment with space constraint.

 

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Valuation 8271 Industry Range
Price/Earnings 14.2x
Price/Sales 0.6x
Price/Book 1.6x
Price/Cash Flow 11.1x
TEV/Sales 0.4x
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