6147 On Other Exchanges
6147 is not on other exchanges.

chipbond technology corp (6147) Snapshot

Previous Close
Day High
Day Low
52 Week High
-- - --
52 Week Low
-- - --
Market Cap
Average Volume 10 Days
Shares Outstanding
Dividend Yield
Current Stock Chart for CHIPBOND TECHNOLOGY CORP (6147)

Related News

No related news articles were found.

chipbond technology corp (6147) Related Businessweek News

No Related Businessweek News Found

chipbond technology corp (6147) Details

Chipbond Technology Corporation provides backend assembly processing of LCD driver ICs in Taiwan. It offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package services, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. The company was founded in 1997 and is based in Hsinchu City, Taiwan.

Founded in 1997

chipbond technology corp (6147) Top Compensated Officers

No compensation data is available at this time for the top officers at this company.

Executives, Board Directors

chipbond technology corp (6147) Key Developments

Chipbond Technology Corporation, Board Meeting, Jun 30, 2016

Chipbond Technology Corporation, Board Meeting, Jun 30, 2016.

Chipbond Technology Corporation Presents at Citi Taiwan Corporate Day 2016 (Singapore), May-12-2016

Chipbond Technology Corporation Presents at Citi Taiwan Corporate Day 2016 (Singapore), May-12-2016 . Venue: Singapore. Speakers: Alan Cheng, IR Manager.

Chipbond Technology Corporation Proposes Amendment to Articles of Incorporation

Chipbond Technology Corporation proposed amendment to Articles of Incorporation to be approve at the AGM to be held on June 15, 2016.


The information and data displayed in this profile are created and managed by S&P Global Market Intelligence, a division of S&P Global. Bloomberg.com does not create or control the content. For inquiries, please contact S&P Global Market Intelligence directly by clicking here.

Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup

6147 Competitors

Market data is delayed at least 15 minutes.

Company Last Change
No competitor information is available for 6147.
View Industry Companies

Industry Analysis


Industry Average

Valuation 6147 Industry Range
Price/Earnings 17.8x
Price/Sales 1.9x
Price/Book 1.3x
Price/Cash Flow 17.6x
TEV/Sales 0.9x

Sponsored Financial Commentaries

Sponsored Links

Request Profile Update

Only a company representative may request an update for the company profile. Documentation will be required.

To contact CHIPBOND TECHNOLOGY CORP, please visit www.chipbond.com.tw. Company data is provided by S&P Global Market Intelligence. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at bwwebmaster@businessweek.com.