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chipbond technology corp (6147) Snapshot

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chipbond technology corp (6147) Details

Chipbond Technology Corporation provides backend assembly processing of LCD driver ICs in Taiwan. It offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package services, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. The company was founded in 1997 and is based in Hsinchu City, Taiwan.

Founded in 1997

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chipbond technology corp
Chipbond Technology Corporation Reports Consolidated Sales Results for the Month and Ten Months Ended October 2016

Chipbond Technology Corporation reported consolidated sales results for the month and ten months ended October 2016. For the month consolidated revenue increased 0.5% on month to TWD 1.617 billion and hit 2 a single-month record high in history, and grew 14.1% when compared to the same period last year. For the ten months, revenue reached TWD 14.002 billion, and slid down 2.4% when compared to the same period last year.

Chipbond Technology Corporation, Board Meeting, Jun 30, 2016

Chipbond Technology Corporation, Board Meeting, Jun 30, 2016.

Chipbond Technology Corporation Presents at Citi Taiwan Corporate Day 2016 (Singapore), May-12-2016

Chipbond Technology Corporation Presents at Citi Taiwan Corporate Day 2016 (Singapore), May-12-2016 . Venue: Singapore. Speakers: Alan Cheng, IR Manager.


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Valuation 6147 Industry Range
Price/Earnings 20.3x
Price/Sales 1.9x
Price/Book 1.4x
Price/Cash Flow 20.1x
TEV/Sales 1.1x

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