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hon hai precision industry (2317) Snapshot

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hon hai precision industry (2317) Details

Hon Hai Precision Industry Co., Ltd., together with its subsidiaries, engages in the manufacture, sale, and service of connectors, cases, thermal modules, wired/wireless communication products, optical products, power supply modules, and assemblies in Taiwan and internationally. It is also involved in the research and development, manufacture, and sale of computer cases, connectors, and components; and manufacture of automobile wires/electronic devices, electronic components, power supply modules, application modules, network cables assemblies, cellular phones and camera lens, sensors, and cameras, as well as provides planning, advisory, and business management services. In addition, the company engages in the development, manufacture, and sale of computer systems, machinery, and equipment; provision of software and electronic information application, logistics, export processing, and construction services; packaging of sensors; and retail of office machinery and equipment, electronic appliances, and information/software services. Hon Hai Precision Industry Co., Ltd. offers its products for use in the information technology, communications, automotive equipment, precision molding, automobile, and consumer electronics industries. The company was founded in 1974 and is based in New Taipei City, Taiwan.

Founded in 1974

hon hai precision industry (2317) Top Compensated Officers

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hon hai precision industry (2317) Key Developments

Hon Hai Precision Industry Co., Ltd. to Form Strategic Alliance with Siliconware Precision Industries Co. Ltd

Hon Hai Precision Industry Co., Ltd. and Siliconware Precision Industries Co., Ltd. signed a Letter of Intent, whereby the parties will form a strategic alliance through the exchange of shares in accordance with Article 156.8 of the Company Act. The alliance will provide customers with the best integrated service program through future collaboration on technology and business. Hon Hai has always committed itself to providing a high technology one-stop service provider to system brand customers through vertical integration. The development of microchip related integration services is also one of Hon Hai conglomerate's direction for development. SPIL is the world's third larger IC assembly and testing house, with wire bonding, flip-chip, wafer level packaging, bumping, multichip package and high-level assembly and testing technology. ShunSin, the subsidiary of Hon Hai, also owns the System-in-Package (SiP) technology. The trend of consumer electronics development has seen an increase in demand for smaller form factor, energy saving, and high performance for products such as smart phones, wearables which all require minimizing size, weight, and better thermal dissipation. In order to achieve the above, SiP and high level IC assembly technology must be adopted and through chip to system vertical integration, actual synergy will be achieved. Upon the formation of the strategic alliance, the parties will work together on the following items: Substrate design integration to manufacture competitive products, such as Embedded Substrate, Panel Size Fan-Out WLCSP, and etc.; future demands in smart phones, internet of things, wearables, etc., SPIL will provide IC wire bonding and wafer level packaging technology combined with Hon Hai's SMT and module assembly technology in order to develop the next generation of system level assembly products; Jointly develop ASIC chip, assembly, modules, etc., from the design approach, in order to accelerate the time-to-market, increase product performance and lower costs; Closely collaborate on SiP related technology to fully explore its inherent commercial opportunities; In order to maximize the synergy of the strategic alliance, the parties will also work together on the following: Hon Hai's precision mold, machinery manufacturing, and automation technology will enhance SPIL's industry competitiveness; Hon Hai's unique thermal dissipation technology can improve SPIL's thermal dissipation process in IC packaging; As future mobile devices will be equipped with more functional modules such as fingerprint recognition, MEMS application, and high resolution camera, the miniaturization of SiP will become the major trend of the next generation IC packaging. Hon Hai and SPIL will closely cooperate and seek for a win-win partnership.

Hon Hai Precision To Buy Stake In Siliconware Precision

Hon Hai Precision Industry Co. Ltd (SEC:2317) will buy 21% stake in Siliconware Precision Industries Co. Ltd. (TSEC:2325), both firms said. It did not disclose a value for the deal or say when it would close.

Cima NanoTech Announces Joint Venture with Foxconn to Manufacture Touch Modules for Large Format Projected Capacitive Touch Screens

Cima NanoTech announced that it has entered into a joint venture with Foxconn, to deliver the cost-competitive, projected capacitive (pro-cap) solution for large format touch screens. Both companies will sell SANTE® ProTouch™ modules through Cima Touch, the company formed under this joint venture. Foxconn’s expertise in the mass production of reliable, high-quality products, coupled with Cima NanoTech’s proprietary SANTE® self-assembling nanoparticle technology, delivers a cost-competitive solution for customers looking to shift from infrared (IR) touch technology to pro-cap multi-touch solutions and systems. SANTE® ProTouch™ modules provide users with ultra fast response for an intuitive multi-user, multi-touch experience, making it an ideal solution for interactive digital signage, interactive kiosks, interactive tabletops and interactive whiteboards. The overall design and product appeal of the touch system is also enhanced with edge-to-edge cover lens and narrow bezel. SANTE® ProTouch™ modules are available in sizes ranging from 40” to 85”. The non-moiré characteristic of SANTE® self-assembling nanoparticle technology makes it compatible with all LCD display models in the market; the highly customizable nature of SANTE® ProTouch™ modules also provides manufacturers and system integrators with the freedom to design features such as cover lens thickness, glass type and bezel width.


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