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disco corp (6146) Details

DISCO Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers wafer mounter, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation. The company also offers precision processing tools comprising dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, and frames and cassettes for cutting waters. In addition, it manufactures and sells precision diamond abrasive tools; and offers processing services. Further, the company is involved in the disassembly and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its products. Additionally, it leases precision machines; and purchases and sells used machines. The company was founded in 1937 and is headquartered in Tokyo, Japan.

2,891 Employees
Last Reported Date: 06/23/15
Founded in 1937

disco corp (6146) Top Compensated Officers

Chairman and Chief Executive Officer
Total Annual Compensation: ¥132.0M
President, Chief Operating Officer, Chief Inf...
Total Annual Compensation: ¥150.0M
Compensation as of Fiscal Year 2015.

disco corp (6146) Key Developments

Rudolph Technologies, Inc. and DISCO Corporation Partner to Improve Wafer Saw Process

Rudolph Technologies Inc. and DISCO Corporation announced a collaborative partnership to deliver hardware and software solutions to optimize the wafer saw unit processes. These comprehensive solutions will enable their customers to consistently improve the quality and productivity of their advanced packaging products. The complete wafer saw solution includes: DISCO's fully automatic dicing saw for high-throughput, dual-cut processing, DISCO's ablation laser saw and stealth dicing saw, Rudolph's NSX® inspection system for post-saw inspection, Rudolph's new Equipment Sentinel fault detection and classification (FDC) software for real time monitoring and feedback of DISCO's dicing tools, and Rudolph's Discover Enterprise yield management software for sophisticated wafer-to-process tool correlations. The evolution of semiconductor device materials for advanced packaging has resulted in more stringent dicing process requirements. Process deviations and excursions during die singulation can result in chips and cracks that impact the long-term reliability of devices. The agreement between DISCO and Rudolph, which took effect June 1, 2015, will drive a new level of innovation in saw processing, including improved kerf control, chipping minimization and overall cost-of-ownership enhancement resulting in solutions that will accelerate advanced packaging adoption.

Disco Corporation Reports Consolidated and Parent Earnings Results for the Full Year Ended March 31, 2015

Disco Corporation reported consolidated and parent earnings results for the full year ended March 31, 2015. For the year, on consolidated basis, the company reported sales of ¥125,920 million, operating income of ¥26,760 million, ordinary income of ¥26,489 million, income before income taxes and minority interests of ¥27,497 million and net income of ¥20,067 million. For the year, on parent basis, the company reported sales of ¥108,120 million, operating income of ¥20,681 million, ordinary income of ¥23,506 million, income before income taxes of ¥23,138 million and net income of ¥17,476 million.

Disco Corporation, Annual General Meeting, Jun 23, 2015

Disco Corporation, Annual General Meeting, Jun 23, 2015., at 14:00 Tokyo Standard Time. Location: DISCO Corporation Headquarters/R&D Center. Agenda: To consider business report, consolidated financial statements, and the audit reports from the accounting auditor and the board of corporate auditors on the consolidated financial statements for the 76th fiscal year (from April 1, 2014 to March 31, 2015); to consider the appropriation of retained earnings; to consider the election of six directors; to consider the election of three corporate auditors; and to consider the bonus payment to the board members.

 

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6146:JP ¥9,310.00 JPY -140.00

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Industry Analysis

6146

Industry Average

Valuation 6146 Industry Range
Price/Earnings 16.1x
Price/Sales 2.5x
Price/Book 2.1x
Price/Cash Flow 16.0x
TEV/Sales 2.1x
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