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disco corp (6146) Details

DISCO Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation. The company also offers precision processing tools comprising dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, as well as frames and cassettes, and additives for cutting waters. In addition, it manufactures and sells precision diamond abrasive tools; and offers processing services. Further, the company is involved in the disassembly and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its products. Additionally, it leases precision machines; and purchases and sells used machines. The company was founded in 1937 and is headquartered in Tokyo, Japan.

3,027 Employees
Last Reported Date: 06/24/16
Founded in 1937

disco corp (6146) Top Compensated Officers

Chairman and Chief Executive Officer
Total Annual Compensation: ¥141.0M
President, General Manager of Technical Devel...
Total Annual Compensation: ¥161.0M
Compensation as of Fiscal Year 2016.
disco corp
Disco Corp. To Be Deleted From Other OTC

Disco Corp.'s ordinary shares will be deleted from Other OTC, effective January 24, 2017. The deletion was due to inactive security.

Disco Corporation to Report Q3, 2017 Results on Feb 06, 2017

Disco Corporation announced that they will report Q3, 2017 results on Feb 06, 2017

DISCO Corporation Develops Panel Level Packaging Compatible Dicing Saw, DFD6310

DISCO Corporation developed DFD6310, a panel-level packaging compatible dicing saw that supports workpieces up to 720 x 610 mm. The equipment will be displayed at SEMICON Japan 2016 (December 14-16, Tokyo Big Site), equipped with the DISCO-developed UNITRAY transfer-unit specification, which transfers singulated packages to a UNITRAY. Development Background: As a technology that can realize significant progress in miniaturization, thinning, and higher integration compared to conventional packages, the need for FOWLP (fan-out wafer level packaging) is rising. Within this production process, there are an increasing number of cases where panel-level packaging is adopted, aimed at lowering costs. DFD6310, the panel-level packaging compatible dicing saw, was developed based on such production needs for FOWLP, which is gaining more use in mobile devices. Features: Supported workpiece size: up to 720 x 610 mm and 670 x 670; Cut stroke: 720 mm; Equipped with facing dual-spindles; Equipment size: 1,960 (W) x 2,280 (D) x 1,840 mm (H); (UNITRAY transfer unit specification: 3,560 (W) x 2,280 (D) x 1,930 (H) mm) UNITRAY Transfer-Unit (Developed by DISCO). The packages singulated by the dicing saw are stored in a JEDEC tray to be sent to the next process. The equipment used for storing the packages in the JEDEC tray (transfer unit) is usually the side of the dicing saw, but depending on the package size, a UPH gap between the dicing saw and transfer unit may occur. By attaching DISCO’s independently developed UNITRAY transfer-unit to the dicing saw, the singulated packages can be temporarily transferred to the UNITRAY and then stored into the JEDEC tray using a standalone JEDEC tray transfer-unit for more effective production without a UPH gap between the equipment and the transfer unit. As a result, the UPH balance of the dicing saw and standalone JEDEC tray can be maintained and multiple production lines can be arranged flexibly.

 

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Valuation 6146 Industry Range
Price/Earnings 29.0x
Price/Sales 5.0x
Price/Book 3.7x
Price/Cash Flow 28.8x
TEV/Sales 4.2x
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