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winbond electronics corp (2344) Details

Winbond Electronics Corporation, together with its subsidiaries, designs, develops, manufactures, and markets very large scale integration integrated circuits (ICs) used in various microelectronic applications. The company operates through DRAM IC product, Flash Memory product, and Logic IC product segments. Its product portfolio includes mobile RAM products comprising pseudo static random access memory, low power SDR SDRAM, low power DDR SDRAM, and low power DDR2 SDRAM; specialty DRAM products, including synchronous dynamic random access memory (SDRAM), double-data-rate (DDR) SDRAM, DDR2 SDRAM, DDR3 SDRAM, and KGD; and commodity DRAM. The company also provides graphics DRAM-GDDR for PC game console, and multimedia devices; a range of flash memory products, such as parallel flash, serial flash, and KGD type parallel and serial flash; and logic IC products, as well as offers memory product foundry service. In addition, it offers revision, testing, and technology consultation services on IC, system, and related software; computer software services; and computer and peripheral equipment, as well as is involved in the wholesale of software. Its products are used in automotive, mobile application, information electronics, and consumer electronics industries. Winbond Electronics Corporation markets its products and services through representatives and distributors worldwide. The company was founded in 1987 and is headquartered in Taichung City, Taiwan.

Founded in 1987

winbond electronics corp (2344) Top Compensated Officers

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Executives, Board Directors

winbond electronics corp (2344) Key Developments

Winbond Announces Executive Changes, Effective on April 01

Winbond Electronics Corporation announced that the board meeting passed a personnel proposal and appointed Ms. Jessica Chiou-Jii Huang as Vice President and CFO due to the retirement of current CFO and Spokesperson, Mr. James Wen. Ms. Huang will also be the Spokesperson. This personnel change will be effective on April 01, 2015. The newly-appointed CFO, Jessica Chiou Jii Huang served as Vice President at various international banks. She joined Winbond at the end of 2002 as the director of Finance Division, responsible for company finance planning and management until present.

Winbond Electronics Corporation Introduces 1Gb and 2Gb SpiFlash Memories in 8-Pin Package for Space-Limited Code-Storage Applications

Winbond Electronics Corporation announced a dramatic expansion of its Flash product portfolio with introduction of a new family of high-density SpiFlash® memories. The new family, the W25N Series, achieves both high-performance read of NOR Flash and the fast program-and-erase attributes of NAND Flash in a small 8-pin package. The new W25N Series also features the popular multi-IO SpiFlash interface and command set. To manage larger data more efficiently, the W25N Series features a page programming time of 250us and block-erase time of 2ms, which are 10 and 100 times faster, respectively, than those of conventional NOR Flash memories. As a result of faster program-and-erase operation, total power consumption for its completion is also reduced 10 and 100 times. Other features, such as embedded error-correction code and an on-chip bad-block management utility, improve the data integrity of the Flash memory and meet code-storage requirements. The W25N Serial flash series is available in densities starting at 1G-bit, with 8-pad WSON and 24-ball TFBGA packages.

Winbond Electronics Corp. Reports Consolidated Earnings Results for the Fourth Quarter and Year Ended December 2014

Winbond Electronics Corp. reported consolidated earnings results for the fourth quarter and year ended December 2014. On a consolidated basis including members of Winbond Electronics Corp. and Nuvoton Technology Corp. etc., net sales were TWD 9.565 billion, down 4% quarter on quarter. Net income for the fourth quarter was TWD 1.067 billion; earnings per share was TWD 0.28. Consolidated sales for January through December 2014 totaled TWD 37.990 billion; net income was TWD 3.211 billion.

 

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2344

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Valuation 2344 Industry Range
Price/Earnings 13.1x
Price/Sales 1.1x
Price/Book 1.1x
Price/Cash Flow 13.1x
TEV/Sales 0.3x
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