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winbond electronics corp (2344) Details

Winbond Electronics Corporation, together with its subsidiaries, engages in the design, development, manufacture, and marketing of very large scale integration integrated circuits (ICs) used in microelectronic applications in Asia, the United States, Europe, and internationally. The company operates through DRAM IC Product, Flash Memory Product, and Logic IC Product segments. It provides mobile dynamic random access memory (DRAM) devices, such as pseudo static random access memory (SRAM), low power SDR synchronous dynamic random access memory (SDRAM), low power double-data-rate (DDR) SDRAM, and low power DDR2 SDRAM products; and specialty DRAM products, including SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and KGD products. The company also offers cloud storage flash memory products consisting of serial and parallel NOR, serial and SLC NAND, and TrustME secure flash memory products, as well as parallel flash and serial flash KGD products; and logic IC products. Its products are used in automotive, mobile/networking, computing, consumer, and industrial applications, as well as used in wearable devices and smart homes. The company markets its products through distributors/representatives. Winbond Electronics Corporation was founded in 1987 and is headquartered in Taichung City, Taiwan.

Founded in 1987

winbond electronics corp (2344) Top Compensated Officers

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winbond electronics corp (2344) Key Developments

Winbond Electronics Introduces New Low Density DDR3/3L SDRAM

Winbond Electronics Corporation has introduced new low density 512Mb DDR3/3L SDRAM. The latest 512Mb DDR3/3L SDRAM not only provide high-speed 1,600 Mbps performances, it also meet the industrial standard and can remain operating under extreme environment temperature ranged from-40C - 105C. With its strong experiences and knowledge accumulated over the past few decades, Winbond designed this new product with high compatible ability and stability. It can provide strong performance in various kind of applications including SSD, networking, printer, power equipment and other consumers or industrial platforms. This latest product has 2 kinds of I/O interface: x8 and x16. For packaging, it support FBGA-78 or FBGA-96. All packaging and its process follow the regulation of RoHS and JGPSSI. Additionally, Winbond also provides KGD services, all technical requests from customers when applying KGD in SiP process are already take under concern in the very beginning. As a result, the new product uses the "one side edge pad" design in order to make it easier to use for the customers, and also reduced the cost. Terminal systems are facing more and more different requests from different applications on the market, so it often has to be designed in very elastic way. What's more critical, the most compatible memory must be defined. Winbond has very complete product lines including specialty DRAM, mobile DRAM and Flash memory with different density, speed and operating voltage that can adapt to different applications. With the support of professional engineering team and a self-owned 12 inch FAB, Winbond's products are guaranteed with high quality & production capacity, and can provide all-around high competitive solutions to customers.

Winbond Electronics Corporation Announces Consolidated Earnings Results for the First Half of 2016

Winbond Electronics Corporation announced consolidated earnings results for the first half of 2016. On a consolidated basis including members of the company and Nuvoton Technology Corp. etc., net sales in the first half of 2016 were TWD 20.584 billion, up 8% year on year. Net income attributable to shareholders of the parent for the first half was TWD 1.419 billion; and earnings per share was TWD 0.40.

Winbond Electronics Corp., Nuvoton Technology Corporation, H1 2016 Earnings Call, Jul 28, 2016

Winbond Electronics Corp., Nuvoton Technology Corporation, H1 2016 Earnings Call, Jul 28, 2016


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Valuation 2344 Industry Range
Price/Earnings 12.3x
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