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winbond electronics corp (2344) Details

Winbond Electronics Corporation, together with its subsidiaries, engages in the design, development, manufacture, and marketing of very large scale integration integrated circuits (ICs) used in microelectronic applications in Asia, the United States, Europe, and internationally. The company operates through DRAM IC Product, Flash Memory Product, and Logic IC Product segments. It provides mobile dynamic random access memory (DRAM) devices, such as pseudo static random access memory (SRAM), low power SDR synchronous dynamic random access memory (SDRAM), low power double-data-rate (DDR) SDRAM, and low power DDR2 SDRAM products; and specialty DRAM products, including SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and KGD products. The company also offers cloud storage flash memory products consisting of serial and parallel NOR, serial and SLC NAND, and TrustME secure flash memory products, as well as parallel flash and serial flash KGD products; and logic IC products. Its products are used in automotive, mobile/networking, computing, consumer, and industrial applications, as well as used in wearable devices and smart homes. The company markets its products through distributors/representatives. Winbond Electronics Corporation was founded in 1987 and is headquartered in Taichung City, Taiwan.

Founded in 1987

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winbond electronics corp (2344) Key Developments

Winbond Electronics Corporation Announces Consolidated Earnings Results for the First Half of 2016

Winbond Electronics Corporation announced consolidated earnings results for the first half of 2016. On a consolidated basis including members of the company and Nuvoton Technology Corp. etc., net sales in the first half of 2016 were TWD 20.584 billion, up 8% year on year. Net income attributable to shareholders of the parent for the first half was TWD 1.419 billion; and earnings per share was TWD 0.40.

Winbond Electronics Corp., Nuvoton Technology Corporation, H1 2016 Earnings Call, Jul 28, 2016

Winbond Electronics Corp., Nuvoton Technology Corporation, H1 2016 Earnings Call, Jul 28, 2016

Winbond Electronics Introduces New Family of Stackable SpiFlash Memories

Winbond Electronics Corporation has announced the introduction of a family of stackable SpiFlash memories. The new SpiStack W25M Series is Winbond's first to allow the "stacking" of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements. The W25M Series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set. SpiStack homogeneous memories are achieved by stacking SpiFlash dies - for example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory-in the industry-standard 8-pin 8x6mm WSON package. This stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory.

 

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Valuation 2344 Industry Range
Price/Earnings 13.0x
Price/Sales 0.9x
Price/Book 0.9x
Price/Cash Flow 12.9x
TEV/Sales 0.3x
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