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toppan printing co ltd (7911) Snapshot

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toppan printing co ltd (7911) Details

Toppan Printing Co., Ltd. primarily provides printing technologies and related services worldwide. The company operates through three segments: Information & Communication, Living Environment, and Material Solutions. It manufactures and sells small-and medium-sized TFT LCDs and organic EL display products, calendars, plastic products, lithium-ion battery packaging materials, printing inks and chemical products, corrugated fiberboard products, surface treatment films, packaging products, and plastic containers. The company also engages in filling alcoholic beverages; clinical art-related and clinical art instructor-related businesses, as well as the development and sale of art-related goods; environmental development planning, display design, and planning and producing visual and other media products; the consulting and sale of small-scale computing equipment, network devices, software, and supplies; and character sales and licensing business. In addition, it offers smart card issuance-related services; Internet-based solutions, business process support, business system development, data center operation, etc.; labels, magnetic media, industrial materials, and IC-related services; large scale integration (LSI) design, system development, and LSI turnkey services; printing of business forms and data printing services; shipping and warehousing services; event planning and insurance services; education and consultation services; sales and intermediary services for publishing and newspaper content; and contract gene analysis and diagnosis reagent services. Further, the company provides travel, human resources, and advertising services; manufactures functional and energy-related, display-related, and semiconductor-related products, as well as decorative sheets; imports and sells furniture and other products; and operates e-book store and e-book distribution platform. Toppan Printing Co., Ltd. was founded in 1900 and is headquartered in Tokyo, Japan.

48,999 Employees
Last Reported Date: 06/26/15
Founded in 1900

toppan printing co ltd (7911) Top Compensated Officers

President and Representative Director
Total Annual Compensation: ¥159.0M
Compensation as of Fiscal Year 2015.

toppan printing co ltd (7911) Key Developments

Toppan Printing Co., Ltd. Starts Up Cutting-Edge FC-BGA substrate line at its Niigata Plant

Toppan Printing Co., Ltd. installed new production equipment for FC-BGA (Flip Chip-Ball Grid Array) substrates at its Niigata Plant (Shibata, Niigata, Japan) in late 2014 and will begin sample shipments of products manufactured on this line in late June, with a target to commence mass production during 2015. Demand for FC-BGA substrates is currently increasing in response to miniaturization and further enhancements to the performance of LSI. Features of the new manufacturing line: Reduction in thickness due to use of thin core material, Due to the use of a core material with thickness reduced from 0.8 mm to 0.2 mm, FC-BGA substrates produced on the new line enable LSI to be miniaturized with enhanced transmission performance. High productivity line for coreless FC-BGA substrates, cutting-edge coreless FC-BGA substrates use no core material and therefore enable further miniaturization, higher density, weight reduction, and high-speed transmission. The production efficiency for coreless FC-BGA substrates on the new line is significantly higher than on previous lines, making it possible to respond to further increases in demand. Narrow pitch wiring Conventional FC-BGA substrates have a line/space of 15µm (1 micrometer=1/1,000 millimeter). In line with the miniaturization of LSI, the new line can handle pitches of 10µm and under, making it possible to form fine wiring for LSI. Management of quality data in real time due to the introduction of an IT system. Sensors on devices installed on the new manufacturing line collect data, which is then analyzed to ascertain the status of the equipment in real time and monitor equipment information through the automated recording of manufacturing process conditions and results, making it possible to prevent quality problems and reduce the time needed to identify the causes of defects.

Toppan Printing Co., Ltd., Annual General Meeting, Jun 26, 2015

Toppan Printing Co., Ltd., Annual General Meeting, Jun 26, 2015.

Toppan Printing Co., Ltd. Develops Copper Touch Panel Module

Toppan Printing Co., Ltd. has developed a copper touch panel module with which the use of copper wiring and a high-rigidity plastic cover resistant to bending and impacts has enabled a significant decrease in weight and an ultra-narrow bezel. This means that the product can be smaller, maintaining the same screen size while enhancing the possibilities for innovative design. Sample shipments will begin in mid-July 2015, predominantly targeting use in tablets and notebook PCs. With this product, the adoption of low-resistance copper for the touch sensor film electrode material has made single routing possible and drastically reduced the number of wires required. Toppan’s cutting-edge etching technologies have also enabled a finer wiring pitch. In addition, cover glass has been replaced with a high-rigidity plastic cover, which is resistant to bending and impacts, enabling a weight reduction of about 40% when compared to glass of the same size (area, thickness). During SID Display Week 2015 (May 31 to June 5), this product will be exhibited and demonstrated from June 2 to 4 at the Toppan Printing and Ortus Technology booth (#1546) at the San Jose Convention Center, California, USA. There is always demand for smaller and lighter tablets and notebook PCs. ITO (Indium Tin Oxide) is used as the electrode material for the cover glass in the touch panels of the majority of such devices, but its high resistance means that lead wiring is required on both sides, and it has therefore been difficult to make the bezel narrower. To address this issue, Toppan Printing utilizes copper, which has low resistance. This has made single routing possible, significantly reducing the number of wires, and enabled a copper touch panel with an ultra-narrow bezel to be developed by employing cutting-edge etching techniques. The narrower bezel contributes to making the product casing more compact, and a drastic weight reduction is also achieved by using a high-rigidity plastic cover. As exterior parts and the touch panel module can be integrated into a single body in any form due to the use of the in-mold method, high-quality design is possible, especially for tablets and notebook PCs. Features of the copper touch panel with ultra-narrow bezel: Reduction of casing size enabled by ultra-narrow bezel. Single routing is achieved and the number of wires has been reduced significantly by using copper, which has low electrical resistance, as the electrode material. A finer wiring pitch has enabled the development of an unprecedentedly narrow bezel and contributed to a reduction in the size of the product casing. A minimum bezel width of approximately 3.4 mm is possible for mid-scale models of more than 10 inches. Weight reduction made possible by high-rigidity plastic cover. The use of a plastic cover with high rigidity enables a weight reduction of approximately 40% compared to glass of the same size (area, thickness). Safety is also ensured by laminating the plastic cover and copper touch sensor film together to make the cover shatterproof. Exterior parts and touch panel module integrated into a single body using in-mold forming method. In addition to the reductions in size and weight, exterior parts and the touch panel module can be integrated into a single body, something made possible with technical assistance from Wonder Future Corporation. This feature enables innovative design. Sectional view of the product. Specifications of copper touch panel module with ultra-narrow bezel; Touch panel type: Projected capacitive; Dimensions 1: 10.1 inches; Minimum bezel width 2: Approximately 3.4 mm; Structure: High-rigidity plastic cover(with copper touch sensor film) + IC controller.


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7911 Competitors

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Dai Nippon Printing Co Ltd ¥1,331 JPY -2.00
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Valuation 7911 Industry Range
Price/Earnings 32.0x
Price/Sales 0.4x
Price/Book 0.7x
Price/Cash Flow 31.3x
TEV/Sales NM Not Meaningful

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