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taiwan ic packaging corp (3372) Snapshot

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taiwan ic packaging corp (3372) Details

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company’s products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package, such as LGA, VLGA, Micro SD cards, and SD cards. The company is based in Kaohsiung, Taiwan.

1,415 Employees
Last Reported Date: 03/15/16

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Executives, Board Directors

taiwan ic packaging corp
Taiwan IC Packaging Corporation Announces Board Changes, Effective August 10, 2016

Taiwan IC Packaging Corporation announced that LIN,BING-RONG, representative of juristic-person director of company was replaced by GUO,LONG-DE, Chief of global quaility control of FUSHENG CO.,LTD, effective August 10, 2016.

Taiwan IC Packaging Corporation Announces Executive Changes

Taiwan IC Packaging Corporation announced that resignation of Mr. Simon Lin, Mr. Daniel Chang and Mr. EWEN CHEN as a Independent Director, with effect from June 03, 2016.

Taiwan IC Packaging Corporation Approves Amendments to its Articles of Association

Taiwan IC Packaging Corporation at the annual general meeting held on June 6, 2016, approved amendments to its articles of association.


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Valuation 3372 Industry Range
Price/Earnings NM Not Meaningful
Price/Sales 1.7x
Price/Book 0.9x
Price/Cash Flow NM Not Meaningful
TEV/Sales 0.9x

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