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taiwan ic packaging corp (3372) Snapshot

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taiwan ic packaging corp (3372) Details

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company’s products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package, such as LGA, VLGA, Micro SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.

1,341 Employees
Last Reported Date: 03/10/17
Founded in 1998

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Executives, Board Directors

taiwan ic packaging corp
Taiwan IC Packaging Corporation Announces Executive Changes

Taiwan IC Packaging Corporation announced Kuo, Jing-Mei, Manager, Internal Audit Officer of Taiwan IC Packaging Corporation in place of Cho, Chien-Bin, Director, Financial and Accounting Controller of Taiwan IC Packaging Corporation.

Taiwan IC Packaging Corporation, Annual General Meeting, Jun 15, 2017

Taiwan IC Packaging Corporation, Annual General Meeting, Jun 15, 2017. Location: North 1st Road.,K.E.P.Z Kaohsiung Taiwan Agenda: To consider the business report for the year 2016; to consider the audit committee report; to consider 2016 deficit compensation; to consider proposal to release the member of the Board of Directors from non-competition restrictions; to consider amendment to regulations governing the acquisition and Disposal of assets; and to re-elect member of the Board of Directors.

Taiwan IC Packaging Corporation Announces Board Changes, Effective August 10, 2016

Taiwan IC Packaging Corporation announced that LIN,BING-RONG, representative of juristic-person director of company was replaced by GUO,LONG-DE, Chief of global quaility control of FUSHENG CO.,LTD, effective August 10, 2016.


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Valuation 3372 Industry Range
Price/Earnings NM Not Meaningful
Price/Sales 1.5x
Price/Book 0.8x
Price/Cash Flow NM Not Meaningful
TEV/Sales 0.9x

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