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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, and Europe. The company offers packages, such as flip-chip ball grid array (BGA), flip-chip CSP, advanced chip scale packages, and IC wirebonding packages; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire bonding solutions, as well as module assembly services, and interconnect materials. Its testing services comprise front-end test engineering testing, wafer probing, logic/mixed-signal/RF/module SiP/discrete final testing services, memory final testing services, other test related services, and drop shipment services. The company also provides electronics manufacturing services for use in a range of end-use applications, such as computers, peripherals, communications, industrial applications, automotive electronics, and storage and server applications. It offers package and testing services for a range of products with end-use applications in the communications, computers, consumer electronics, industrial, and automotive sectors. The company was founded in 1984 and is based in Kaohsiung, Taiwan.

68,100 Employees
Last Reported Date: 02/6/15
Founded in 1984

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advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. Reports Unaudited Consolidated Revenue Results for the Month of January 2015

Advanced Semiconductor Engineering Inc. reported unaudited consolidated revenue results for the month of January 2015. For the month, the company reported net revenues of TWD 23,355 million against TWD 18,589 million a year ago.

Advanced Semiconductor Engineering Inc. Reports Unaudited Consolidated Earnings Results for the Fourth Quarter and Full Year December 31, 2014

Advanced Semiconductor Engineering Inc. reported unaudited consolidated earnings results for the fourth quarter and full year December 31, 2014. For the quarter, the company reported consolidated revenue grew about 15% to TWD 76.6 billion against TWD 64.164 billion a year ago. Net income was TWD 7.8 billion against TWD 5.208 billion a year ago. Diluted EPS for the quarter is TWD 0.99 against TWD 0.66 a year ago. EBITDA was TWD 17 billion, up 8.6% from the previous quarter. CapEx for the quarter was spent TWD 148 million out of a total EBITDA of TWD 563 million, so it remains to be cash flow positive. Operating income was TWD 9.82 billion against TWD 6.94 billion a year ago. Income before tax was TWD 9.55 billion against TWD 5.79 billion a year ago. For the full year, the company consolidated revenue reached almost TWD 257 billion, up by 17% from previous year. For the net income, the company reported total net income of TWD 23.6 billion, up 50% from previous year. Diluted EPS, was as TWD 2.95 against TWD 2.03 a year ago. Operating income was TWD 29.57 billion against TWD 22.04 billion a year ago. Income before tax was TWD 28.47 billion against TWD 19.36 billion a year ago. Total CapEx for the year last year is about TWD 1,054,000,000.

Advanced Semiconductor Engineering Inc., Q4 2014 Earnings Call, Feb 06, 2015

Advanced Semiconductor Engineering Inc., Q4 2014 Earnings Call, Feb 06, 2015

 

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2311

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Valuation 2311 Industry Range
Price/Earnings 15.4x
Price/Sales 1.3x
Price/Book 2.3x
Price/Cash Flow 14.7x
TEV/Sales 0.7x
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