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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions. It also provides advanced packages, including wafer level chip scale, flip-chip (FC) chip scale, FC package in, FC BGA/HF FCBGA, FC and wire bonding, and integrated passive device packages; IC wire bonding packages, including lead frame-based package types, such as lead frame-based packages and substrate-based packages; system-in-package (SiP) products, as well as module assembly services; and interconnect materials. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/ MEMS/discrete final testing, and test-related services, as well as drop shipment services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

Founded in 1984

advanced semiconductor engr (2311) Top Compensated Officers

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advanced semiconductor engr (2311) Key Developments

Lime Micro, and ASE Group to Introduce New Radio Chip for LimeSDR Developers

Lime Micro has reported a manufacturing partnership for the LimeSDR product line with Advanced Semiconductor Engineering. As part of the agreement, all the LimeSDR boards pledged during the recent successful crowdfunding campaign and any boards bought up before the end of September, will have a customized 'I backed LimeSDR on Crowd Supply' logo on the recently released LMS7002M Lime chip. Lime Micro said that the LimeSDR, recently successfully funded on the Crowd Supply crowdfunding platform, is a low cost application-enabled software defined radio (SDR) platform that can be programmed to support virtually any type of wireless standard. From Wi-Fi, ZigBee and Bluetooth through to cellular standards such as UMTS, LTE and GSM and to the emerging IoT communication protocols such as LoRa, the platform offers endless wireless connectivity opportunities.

Advanced Semiconductor Engineering Inc. Reports Unaudited Consolidated Revenue Results for the Month Ended August 2016

Advanced Semiconductor Engineering Inc. reported unaudited consolidated revenue results for the month ended August 2016. For the month, the company reported net revenues of TWD 23,916 million against TWD 22,920 million a year ago.

Advanced Semiconductor Engineering Inc., Annual General Meeting, Aug 26, 2016

Advanced Semiconductor Engineering Inc., Annual General Meeting, Aug 26, 2016. Agenda: To consider 2015 financial statements and reports; to consider 2015 the auditor's remuneration for services; to consider Mr. Chang Chien Shen be re-appointed as a director; and to consider the directors be and hereby authorised to issue.

 

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Valuation 2311 Industry Range
Price/Earnings 16.3x
Price/Sales 1.1x
Price/Book 2.0x
Price/Cash Flow 15.3x
TEV/Sales 0.5x
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