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united microelectronics corp (2303) Details

United Microelectronics Corporation provides semiconductor wafer foundry solutions. Its foundry solutions include silicon verification, libraries and IP, design verification, design for manufacturing, MM/RF foundry design kit and design support manual, and design flow reference, as well as mask services, such as mask inspection, IP protection and data preparation, and tape-out status tracking. The company also offers testing and packaging service, package solution development, and product yield management. It operates primarily in Taiwan, Japan, Korea, China, Singapore, Europe, and the United States. United Microelectronics Corporation was founded in 1980 and is headquartered in Hsinchu, Taiwan.

Founded in 1980

united microelectronics corp (2303) Top Compensated Officers

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united microelectronics corp (2303) Key Developments

United Microelectronics Corporation Reports Unaudited Consolidated Sales Results for the Month and Year to Date September 2015

United Microelectronics Corporation reported unaudited consolidated sales results for the month and year to date September 2015. For the month, the company reported net sales of TWD 10,425,056,000 compared to TWD 12,256,438,000 a year ago. For the year to date, the company reported net sales of TWD 110,981,039,000 compared to TWD 102,776,786,000 a year ago.

United Microelectronics Corporation to Report September,2015 Sales/Trading Statement Results on Oct 08, 2015

United Microelectronics Corporation announced that they will report September, 2015 sales/trading statement results on Oct 08, 2015

United Microelectronics Corporation Enters High Volume Touch IC Production Using Foundry First 0.11um eFlash Process

United Microelectronics Corporation announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process. The specialized technology, first introduced by UMC in late 2012 as the foundry first, true 12-volt aluminum back-end-of-line (BEoL) process, is developed for next generation touch controller IC and IoT applications. Compared to 0.18um, 0.11um provides smaller and faster logic devices for higher performance, while enabling the integration of higher density embedded Flash and SRAM for use in microcontrollers for touch-screen products of all sizes. UMC's 0.11um touch IC platform delivers more than three times the SNR improvement over widely used 3.3V solution, allowing IC designers to create a new generation of enhanced touch interface products. The foundry has extensive experience manufacturing touch controller ICs, with more than 30 touch customers in production at the foundry and over 40 million touch ICs shipped per month. The 0.11um process is developed on 8-inch manufacturing using the most aggressive aluminum BEoL technology, allowing touch IC designers to enjoy lower NRE and related costs to increase market competitiveness. UMC also provides in-house flash IP to speed time-to-market and facilitate customization to address evolving market trends. An ultra-low leakage (uLL) process is currently being developed to further reduce core current on devices and SRAM by up to four times.


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2303 Competitors

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Company Last Change
ON Semiconductor Corp $10.03 USD +0.14
Renesas Electronics Corp ¥695.00 JPY +1.00
Semiconductor Manufacturing International Corp $0.75 HKD -0.01
STMicroelectronics NV €6.30 EUR -0.079
Vanguard International Semiconductor Corp 42.05 TWD +0.35
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Valuation 2303 Industry Range
Price/Earnings 8.9x
Price/Sales 0.9x
Price/Book 0.6x
Price/Cash Flow 8.6x
TEV/Sales 0.1x

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