6762 On Other Exchanges
Symbol
Exchange
6762 is not on other exchanges.

tdk corp (6762) Snapshot

Open
--
Previous Close
--
Day High
--
Day Low
--
52 Week High
-- - --
52 Week Low
-- - --
Market Cap
--
Average Volume 10 Days
--
EPS TTM
--
Shares Outstanding
--
EX-Date
--
P/E TM
--
Dividend
--
Dividend Yield
--
Current Stock Chart for TDK CORP (6762)

Related News

No related news articles were found.

tdk corp (6762) Related Businessweek News

No Related Businessweek News Found

tdk corp (6762) Details

TDK Corporation, together with its subsidiaries, manufactures and sells electronic components in Japan, Europe, China, Asia, the Americas, and internationally. The company operates through Passive Components, Magnetic Application Products, Film Application Products, and Other segments. The Passive Components segment provides ceramic capacitors, aluminum electrolytic capacitors, film capacitors, high-frequency components, piezoelectric materials, circuit protection components, and sensors, as well as inductive devices, such as coils, ferrite cores, and transformers. The Magnetic Application Products segment offers recording devices, power supplies, and magnets. The Film Application Products segment provides energy devices, such as rechargeable batteries; and applied films. The Other segment provides mechatronics production equipment, and other products. TDK Corporation primarily serves electronics and automotive markets. The company was formerly known as Tokyo Denki Kagaku Kogyo K.K. and changed its name to TDK Corporation in 1983. TDK Corporation was founded in 1935 and is headquartered in Tokyo, Japan.

99,693 Employees
Last Reported Date: 06/29/17
Founded in 1935

tdk corp (6762) Top Compensated Officers

No compensation data is available at this time for the top officers at this company.

Executives, Board Directors

tdk corp
TDK Corporation Extends Range of PTC Inrush Current Limiters

TDK Corporation announced that it has extended the range of EPCOS PTC-based inrush current limiters. The four new versions of the B5921 J0130A020 series with plastic housing are designed for voltages from 280 V AC to 560 V AC, offer rated resistances from 22 ? to 100 ? at 25 degrees C and have a heat capacity of up to 2.3 J/K. They are UL approved and are qualified to AEC-Q200. The current protection devices are ideally suited for industrial and household electronics and automotive electronics. The B594 and B597 series of leaded disk components offer rated voltages of between 260 V AC and 560 V AC. Depending on the type, their rated resistances are between 25 ? and 1100 ?. Also type-dependent, these protection devices have been approved in accordance with UL, IECQ and VDE. All types of both series are RoHS-compatible. The advantage of PTC inrush current limiters is their intrinsic safety. Typical applications for PTC inrush current limiters include converters and power supplies for industrial and household electronics as well as in e-mobility applications. These include onboard charging circuits and the charging and discharging of DC link capacitors in the drives of hybrid and electric vehicles. Main applications: converters and power supply units for industrial and household electronics; onboard charging circuits and the charging and discharging of DC link capacitors in the drives of hybrid and electric vehicles. Main features and benefits: wide range of rated voltages and resistances; approvals compliant with UL, IECQ and VDE; and intrinsic safety.

TDK Corporation Introduces RWS1000B and RWS1500B Industrial AC-DC Power Supplies

TDK Corporation announced the introduction of the RWS1000B and RWS1500B Industrial AC-DC power supplies designed to provide solid performance at an economical price. The RWS-B series now has seven power levels ranging from 50 to 1500W. The 7-year warranty RWS-B series is ideally suited for industrial, test & measurement, broadcast, communications and LED signage equipment. These new 1000W and 1500W additions are available with 12, 15, 24, 36 and 48V outputs, adjustable from -15/+10% of nominal. All models accept an 85 to 265Vac input and can operate at full load in -20 to +50°C ambient temperatures, derating linearly to 60% load at +60°C. High operating efficiencies of up to 88% reduce internal waste heat and component temperatures, resulting in electrolytic capacitor service life predictions of at least ten years. To facilitate safe and easy installation, output cable connections are made to screw terminal blocks with covers rather than busbars. The terminal block can also be quickly configured for either a vertical or horizontal wiring orientation. The RWS1000B measures 127 x 63 x 198mm and the RWS1500B 127 x 63 x 261mm. The TDK-Lambda RWS-B 1000 and 1500W models are certified to the safety standards of UL/CSA/EN 60950-1 and are CE marked according to the Low Voltage and RoHS2 Directives. All models offer curve B conducted and radiated performance to EN55011/EN55032-B, meet EN 61000-3-2 harmonics, IEC 61000-4 immunity and SEMI F47 line dip standards.

TDK Corporation Announces New Features of AFM 15 Flip Chip GGI Die Bonder

TDK Corporation announced that it will showcase the latest features of model AFM 15 Flip Chip Gold to Gold Interconnect Die Bonder at Booth 5228 in the North Hall at the SEMICON West Conference 2017, July 11-13, in the Moscone Center, San Francisco, Calif. The TDK AFM 15 uses flip chip ultrasonic gold to gold interconnect (GGI), an alternative die attachment process to gold wire bonding to decrease package factor form and improve electrical performance. The gold wire stitch is replaced by a gold stud bump using a gold stud bumping process tool. TDK GGI Flip Chip has reduced device package size by 70% compared to gold wire bonding die packages. Die sizes as small as 0.2 mm2 can be assembled using TDK model AFM 15 process. The TDK GGI flip chip model AFM 15 includes new horn capability for die sizes up to 10 mm2. TDK horn design provides linear X-Y nozzle movement over a wide range of ultrasonic power settings. Z-axis movement has been reduced by 90% during the GGI bonding process. TDK AFM 15 GGI die bonder process uses heating below 250 degrees Celsius. Bond force is optimized in the AFM 15 ten step bond profile menu. GGI process provides low bond stress to the die and a superior monolithic metallization interconnect. TDK GGI AFM 15 flip chip attachment process is a clean, lead-free, precision back end assembly process with low cost of ownership and high productivity. The TDK AFM 15 can be used for die interconnect assembly of ASIC, CMOS, MEMS and Opto devices.

 

The information and data displayed in this profile are created and managed by S&P Global Market Intelligence, a division of S&P Global. Bloomberg.com does not create or control the content. For inquiries, please contact S&P Global Market Intelligence directly by clicking here.

Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup

6762 Competitors

Market data is delayed at least 15 minutes.

Company Last Change
No competitor information is available for 6762.
View Industry Companies
 

Industry Analysis

6762

Industry Average

Valuation 6762 Industry Range
Price/Earnings 6.8x
Price/Sales 0.8x
Price/Book 1.2x
Price/Cash Flow 6.9x
TEV/Sales 0.2x
 | 

Sponsored Financial Commentaries

Sponsored Links

Request Profile Update

Only a company representative may request an update for the company profile. Documentation will be required.

To contact TDK CORP, please visit www.tdk.co.jp. Company data is provided by S&P Global Market Intelligence. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at bwwebmaster@businessweek.com.