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powertech technology inc (6239) Details

Powertech Technology Inc. provides IC backend services worldwide. Its services include IC chip probing, packaging, final testing, and burn in to end products. The company provides Quad Flat No lead package services for electrical interconnection in handheld devices, such as cellular phones, PDAs, MP3s, game consoles, and other portable products; redistribution layer services for au or cu wire bonding; copper pillar and lead-free bumping services; chip scale package and chip on wafer for packaging CMOS image sensors; FBGA(BOC) packages; and FBGA packages for smart phones, tablets, and SSD products. It also offers thin small outline packages for various devices, including ROM, NOR, NAND Flash, SDRAM, and DDR; packaging and testing services for the memory card-micro SD Cards; Multi-Chip Packages for various handheld or data storage devices, such as cellular phones, PDAs, mobile game platforms, digital consumer devices, removable memory cards, USB drives, etc.; and System-in-Packages for graphics processor, CPU, digital mobile TV, GPS, Wi-Fi, Wimax, Bluetooth, baseband, air bag detector, tire pressure gauge, keyless products, etc. In addition, the company provides Package-on-Package/Package-in-Package services for space savings, enhanced wafer thinning technology, control on warpage, and eliminated die cracks; FCBGA packages for chipsets and microprocessors; and FCCSP packages for graphic memory products and cellular phones. Powertech Technology Inc. was founded in 1997 and is headquartered in Hsinchu, Taiwan.

Founded in 1997

powertech technology inc (6239) Top Compensated Officers

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powertech technology inc (6239) Key Developments

Powertech Technology Inc., Q4 2014 Operating Results Call, Jan 27, 2015

Powertech Technology Inc., Q4 2014 Operating Results Call, Jan 27, 2015

Powertech Technology Inc. to Report January,2015 Sales/Trading Statement Results on Feb 06, 2015

Powertech Technology Inc. announced that they will report January, 2015 sales/trading statement results on Feb 06, 2015

Powertech Technology Inc. and Micron Technology, Inc. Enter into Agreement for Assembly and Packaging Services

Powertech Technology Inc. and Micron Technology Inc. have entered into a series of agreements forming the basis of a long-term strategic relationship for assembly and packaging services in Xi'an, China. Under the agreements, Micron will complement its existing test and module manufacturing operations in the Xi'an High Tech Zone through the construction of a new assembly and packaging facility. Upon its completion, PTI will occupy the assembly facility and provide Micron with assembly and packaging services for a period of several years.

 

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6239:TT 54.90 TWD +0.40

6239 Competitors

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Company Last Change
Chipbond Technology Corp 63.00 TWD +1.00
ChipMOS TECHNOLOGIES Bermuda Ltd $23.55 USD +0.13
King Yuan Electronics Co Ltd 29.60 TWD +0.45
STATS ChipPAC Ltd $0.49 SGD -0.005
Unisem M Bhd 2.10 MYR -0.03
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6239

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Valuation 6239 Industry Range
Price/Earnings NM Not Meaningful
Price/Sales 1.0x
Price/Book 1.3x
Price/Cash Flow NM Not Meaningful
TEV/Sales NM Not Meaningful
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