January 20, 2017 4:10 PM ET

Semiconductors and Semiconductor Equipment


Company Overview

J-Devices Corporation, a semiconductor back-end manufacturing services company, offers wafer probing, package assembly, final testing, and package development services. It offers package solutions, such as analysis and simulation technologies. The company also provides wafer test and final test equipment, such as MCU, multimedia, mobile communication, and sensor devices. In addition, it offers panel level packaging products for automotive, mobile, analog/RF module, and memory applications. J-Devices Corporation was formerly known as Nakaya Microdevices Corporation and changed its name to J-Devices Corporation in October 2009. The company was founded in 1970 and is headquartered in Usuki, Jap...

1913-2 Takegashita


Usuki,  875-0053


Founded in 1970


81 50 3161 4938


81 9 7263 3160


Chief Executive Officer, President and Representative Director
Age: 50
Chief Financial Officer
Chief Operating Officer
Compensation as of Fiscal Year 2016.

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