October 19, 2017 11:28 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of 1366 Technologies, Inc.

Company Overview

1366 Technologies, Inc. develops and builds multi-crystalline solar wafers for photovoltaics industry. It develops Direct Wafer, a technology that forms a multi-crystalline wafer directly from molten silicon. The company was founded in 2007 and is based in Bedford, Massachusetts. It has a commercial solar wafer manufacturing facility in Genesee County, New York.

6-8 Preston Court

Bedford, MA 01730

United States

Founded in 2007





Key Executives for 1366 Technologies, Inc.

Co-Founder, Chief Executive Officer, President and Director
Chief Operating Officer
Director of Cell Technology
Compensation as of Fiscal Year 2017.

1366 Technologies, Inc. Key Developments

1366 Technologies Introduces '3D' Wafer Feature

1366 Technologies unveiled the first of a series of R&D achievements that have the potential to change the way the solar industry thinks about wafer features. The company’s proprietary Direct Wafer process has demonstrated the ability to grow a “three dimensional” wafer or a thin wafer with a thick border, an advancement impossible with conventional ingot-based production technologies. The 3D feature further reduces the amount of silicon required for each wafer without sacrificing strength, durability or performance. It also allows the dominant crystalline silicon PV supply chain to lower costs while leveraging its existing infrastructure. To decrease the amount of silicon used by photovoltaic wafers, manufacturers have long pursued methods to reduce wafer thickness. While wire sawing can be used to produce wafers thinner than the standard 180-200 micron thickness, these thin wafers have reduced mechanical integrity and break during cell fabrication, electrical interconnection and encapsulation in modules. As such, standard industry wafer thickness has remained between 180-200 microns. 1366’s Direct Wafer process has the unique ability to locally-control wafer thickness and provide standard 180-200 micron thickness in stress-critical areas such as wafer perimeter or ribs where busbar soldering will occur, while reducing thickness to 100-120 microns for the remainder of the wafer. The result cuts silicon consumption to 1.5 g/W and creates a strong, thin wafer able to withstand typical manufacturing stresses. 1366’s Direct Wafer technology is a transformative manufacturing process that offers significant advantages over traditional ingot-based wafer production technologies, including the ability to introduce new wafer features that reduce cost and increase efficiency. The process makes wafers in a single step, pulling them directly from molten silicon instead of today’s multi-step, energy- and capital-intensive approach, resulting in significant wafer production cost savings.

Hanwha Q CELLS and 1366 Technologies Enter into 5-year Supply Agreement

Hanwha Q CELLS Co. Ltd. and 1366 Technologies Inc. announced that they have entered into a supply agreement in which 1366 will supply up to 700 MW of wafers using 1366's proprietary Direct Wafer technology to Hanwha Q CELLS over a 5-year period. This deal follows a year-long strategic partnership and collaborative R&D efforts to commercialize 1366's Direct Wafer technology with Hanwha Q CELLS' Q.ANTUM cell technology. 1366 will supply the wafers from its planned US manufacturing facility in New York State, scheduled to be online in 2017. The agreement ensues months of intense technical collaboration between the two companies during which a series of performance records for the Direct Wafer technology were achieved. Hanwha Q CELLS and 1366 jointly reached a maximum efficiency of 19.1% using Direct Wafer products in Hanwha Q CELLS' Q.ANTUM cell, as independently verified by the Fraunhofer ISE. Provided that 1366 meets certain terms and conditions related to its wafer qualification and timing of delivery as agreed by both parties, Hanwha Q CELLS's commitment to purchase up to 700 MW of wafers over a period of 5 years will commence.

Hanwha Q CELLS Co., Ltd.'s Proprietary Q.ANTUM Cell Achieves 19.1% Efficiency Using 1366 Technologies's Direct Wafer Technology

Hanwha Q CELLS Co. Ltd. and 1366 Technologies announced to have jointly achieved cell efficiency gains of 1.4% using 1366's Direct Wafer products in only seven months' time. Both companies have formed a strategic partnership to collaborate on the development of 1366's proprietary Direct Wafer Technology in March 2015. Starting from efficiencies of 17.7% in March, both companies reached a maximum efficiency of 19.1% using 1366's wafers in October 2015, as was independently confirmed by the Fraunhofer ISE institute. This significant efficiency gain of 1.4% in only seven months strongly shows the potential that lies in combining the unique technologies from both companies. Based on 1366 Technologies' kerfless, drop-in 156mm multi-crystalline wafers, Hanwha Q CELLS has been applying its proprietary Q.ANTUM cell process on the pilot line in its Technology & Innovation Headquarters in Germany.

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