July 25, 2017 9:04 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Pac Tech USA - Packaging Technologies, Inc.

Company Overview

Pac Tech USA - Packaging Technologies, Inc. offers services, equipment, and processes for semiconductor wafer bumping. The company provides wafer lumping and bumping services such as electroless nickel plating, solder bumping, and backend and assembly services. Additionally, the company distributes ATV Microelectronics Equipment such as LTCC Sintering, Press Benchtop Furnace, Thermo Compression Bonders, Diamond Scribers, Manual Die Mounter, Hot Plate in Line Ovens, Atomic Layer Deposition System, Perfect Soldering/RTA Systems, and Hot Plates/Chucks in the United States. The company was founded in 2001 and is based in Santa Clara, California. Pac Tech USA - Packaging Technologies, Inc. operat...

328 Martin Avenue

Santa Clara, CA 95050

United States

Founded in 2001





Key Executives for Pac Tech USA - Packaging Technologies, Inc.

President and Chief Technology Officer
Compensation as of Fiscal Year 2017.

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