Bloomberg Anywhere Remote Login Bloomberg Terminal Demo Request


Connecting decision makers to a dynamic network of information, people and ideas, Bloomberg quickly and accurately delivers business and financial information, news and insight around the world.


Financial Products

Enterprise Products


Customer Support

  • Americas

    +1 212 318 2000

  • Europe, Middle East, & Africa

    +44 20 7330 7500

  • Asia Pacific

    +65 6212 1000


Industry Products

Media Services

Follow Us

November 30, 2015 5:43 PM ET

Technology Hardware, Storage and Peripherals

Company Overview of Kandou Bus SA

Company Overview

Kandou Bus SA engages in the design of high speed, pin-, and energy efficient serial links. The company’s technology is used for applications in a range of electronic devices, such as DRAM, where the links increase data transfer speed while lowering energy consumption; graphics cards, where the links lower heat dissipation and increase data throughput; server backplanes, where the links increase speed of data transfer and lower heat dissipation; mobile devices, where the links increase battery life; game consoles, where the links increase data transfer speeds. Its technology is also used for applications in routers, where the links increase of data transfer speeds and lower pin-count; and FP...


Lausanne,  1015


Founded in 2011


41 21 693 89 91


41 21 693 75 10

Key Executives for Kandou Bus SA

Co-Founder, Chairman of the Board and Chief Executive Officer
Co-Founder, Chief Technology Officer and Director
Compensation as of Fiscal Year 2015.

Kandou Bus SA Key Developments

Kandou Introduces High Bandwidth, Low Power, In-Package Chip Interconnect Enabling Lower Cost Semiconductor Solutions

Kandou Bus has announced the Glasswing(TM) family of chip interconnects targeted for in-package chip-to-chip links. Kandou introduced Chord(TM) Signaling in February 2014 and outlined how signals can be correlated across more than two wires to achieve higher bandwidth and lower power with excellent signal integrity and low latency. The Glasswing architecture optimizes Chord Signaling to address the unique challenges of both substrate and interposer in-package solutions. The cost to manufacture a transitor in the most advanced silicon process has increased compared to the previous generation. As a result, system architects are looking for more cost effective ways to partition and package silicon devices for optimal performance. Integrating several chips into a shared package can be attractive, but only if the in-package communication between chips allows for extremely high bandwidth and very low power.

Similar Private Companies By Industry

Company Name Region
Fujitsu Technology Solutions AG Europe
Mikrap AG Europe
exceet Group AG Europe
NagraID S.A. Europe
Keller Rüti AG Europe

Recent Private Companies Transactions

No transactions available in the past 12 months.

Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup

Most Searched Private Companies

Company Name Geographic Region
Lawyers Committee for Civil Rights Under Law United States
NYC2012, Inc. United States
Bertelsmann AG Europe
Rush University United States
Citizens Budget Commission United States

Sponsored Financial Commentaries

Sponsored Links

Request Profile Update

Only a company representative may request an update for the company profile. Documentation will be required.

To contact Kandou Bus SA, please visit Company data is provided by Capital IQ. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at