Technology Hardware, Storage and Peripherals
Company Overview of Kandou Bus SA
Kandou Bus SA engages in the design of high speed, pin-, and energy efficient serial links. The company’s technology is used for applications in a range of electronic devices, such as DRAM, where the links increase data transfer speed while lowering energy consumption; graphics cards, where the links lower heat dissipation and increase data throughput; server backplanes, where the links increase speed of data transfer and lower heat dissipation; mobile devices, where the links increase battery life; game consoles, where the links increase data transfer speeds. Its technology is also used for applications in routers, where the links increase of data transfer speeds and lower pin-count; and FP...
Founded in 2011
Key Executives for Kandou Bus SA
Co-Founder, Chairman of the Board and Chief Executive Officer
Co-Founder, Chief Technology Officer and Director
Compensation as of Fiscal Year 2015.
Kandou Bus SA Key Developments
Kandou Introduces High Bandwidth, Low Power, In-Package Chip Interconnect Enabling Lower Cost Semiconductor Solutions
Nov 3 14
Kandou Bus has announced the Glasswing(TM) family of chip interconnects targeted for in-package chip-to-chip links. Kandou introduced Chord(TM) Signaling in February 2014 and outlined how signals can be correlated across more than two wires to achieve higher bandwidth and lower power with excellent signal integrity and low latency. The Glasswing architecture optimizes Chord Signaling to address the unique challenges of both substrate and interposer in-package solutions. The cost to manufacture a transitor in the most advanced silicon process has increased compared to the previous generation. As a result, system architects are looking for more cost effective ways to partition and package silicon devices for optimal performance. Integrating several chips into a shared package can be attractive, but only if the in-package communication between chips allows for extremely high bandwidth and very low power.
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