Company Overview of Danfoss A/S
Danfoss A/S develops, manufactures, sells, and services engineering solutions worldwide. It operates through four segments: Danfoss Power Solutions, Danfoss Cooling, Danfoss Drives, and Danfoss Heating. The Danfoss Power Solutions segment designs, manufactures, and sells engineered hydraulic and electronic components for system solutions, including hydrostatic transmissions, mobile electronics and software, orbital motors, steering components, and proportional valves. This segment provides its products and solutions to original equipment manufacturers (OEMs) and distributors for market segments, such as agriculture, construction, road building, material handling, turf care, and specialty. Th...
Founded in 1933
Key Executives for Danfoss A/S
Chief Executive Officer and President
Chief Financial Officer and Executive Vice President
Chief Operations Officer and Executive Vice President
Segment President of Danfoss Heating
President of Danfoss Global Services
Compensation as of Fiscal Year 2016.
Danfoss A/S Key Developments
Danfoss A/S Reports Earnings Results for the First Half Year of 2016; Provides Ebit Margin Guidance for the Year 2016
Aug 25 16
Danfoss A/S reported earnings results for the first half year of 2016. For the period, the company reported net sales of DKK 19,395 million against DKK 19,239 million in the same period last year. The improvement corresponds to 4% growth in local currency. The Group's earnings (EBIT) was DKK 2,212 million against DKK 1,868 million last year, equal to an improvement of 18%. Net profit growth was 28%.
The company confirmed the full year 2016 expectations. Accordingly, the group expects to maintain or expand its market share while maintaining EBIT margin at level with 2015.
Heraeus and Danfoss Conclude Agreement for Die Top System
Aug 8 16
Heraeus and Danfoss have concluded an exclusive cooperation agreement to market the Heraeus's Die Top System. The Die Top System, developed from Danfoss Bond Buffer technology, offers new assembly and joining technology for silicon and silicon carbide semiconductors. With its new design, the Die Top System not only increases the power module's current carrying capability, it also boosts its power cycling capability by a factor of ten or more. This makes it possible to have junction temperatures of up to 200°C. A highly conductive copper foil is applied to the semiconductor chip using a sinter paste. This distributes the current evenly across the semiconductor chip, reducing heat and better balancing hot spots in the semiconductor. The foil also strengthens the chip during production for the power module. As a result, more efficient copper bonding wires can be used in place of traditional aluminum bonding wires.
Danfoss to Open New Regional Service Center in Germany
May 16 16
Danfoss Group has announced that it will open a new regional service center in April 2016, near Frankfurt, Germany to provide service and support for customers in Europe, where over 20,000 Danfoss Turbocor Compressors are installed. This is the first time that Danfoss bundles service, aftermarket sales, and root cause capability for Turbocor Compressors on European soil.
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