January 30, 2015 6:18 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of eASIC Corporation

Company Overview

eASIC Corporation, a fabless semiconductor company, manufactures eASIC platforms that reduce the cost of ownership and time to production of customized silicon devices. The company offers Nextreme family of devices that reduce development cost and turn-around times compared to standard cell ASICs, while reducing power consumption and unit cost for designs; Nextreme-3, a fourth generation eASIC platform; and Nextreme-2, a third generation eASIC platform. It also provides easicopy ASIC that provides OEMs with a path from Nextreme-3, Nextreme-2, or Nextreme devices to a cell-based easicopy ASIC, thereby enabling OEMs to further reduce device cost and power consumption, or increase performance; ...

2585 Augustine Drive

Suite 100

Santa Clara, CA 95054

United States

Founded in 1999

Phone:

408-855-9200

Fax:

408-855-9201

Key Executives for eASIC Corporation

Chief Executive Officer
Chief Financial Officer and Senior Vice President of Finance
Age: 56
Chief Operating Officer
President of eASIC Japan
Age: 78
Chief Technology Officer and Senior Vice President of Engineering
Compensation as of Fiscal Year 2014.

eASIC Corporation Key Developments

eASIC Announces 12.5Gbps JESD204B Interoperability Testing with Texas Instruments

eASIC Corporation announced that it has successfully completed JESD204B interoperability at 12.5Gbps between its eASIC Nextreme-3 28nm Platform and the dual-channel, 16-bit, 2.5-GSPS DAC38J82 digital-to-analog converter (DAC) from Texas Instruments (TI). JESD204B is the next-generation high-speed serial interface standard that enables high throughput using low pin count for delay-aware and power-efficient radio applications. The high bandwidth demanded by broadband and multi-channel LTE-Advanced radio equipment is challenging the interconnect between the digital signal processing device, DAC and analog-to-digital converter (ADC), and often requires trade-offs between bandwidth and power. The serial nature of the JESD204B interface enables less complex printed circuit board design and more flexible operations when dealing with evolving radio platforms. The eASIC Nextreme-3 devices and TI’s DAC38J82 are now interoperable using JESD204B at 12.5Gbps.

Huawei Selects eASIC for Transport Network Backhaul

eASIC Corporation announced that Huawei is using eASIC’s Nextreme-3 28 nm devices to meet the increased system performance and aggressive costs required by Transport Network Products. Due to the increased throughput, Transport Networks require twice the clock performance of traditional communications. Huawei investigated multiple options to meet the demanding performance, power and total cost of ownership targets set by the global operators, eASIC’s 28 nm Single Mask Adaptable devices enabled Huawei to meet all the operator requirements.

eASIC Corporation Appoints Richard Deranleau as Chief Financial Officer and Senior Vice President of Finance

eASIC Corporation announced the immediate appointment of Richard Deranleau as the company's Chief Financial Officer and Senior Vice President of Finance. Mr. Deranleau was recently SVP, Finance and CFO for a $1.1 Billion North American operating company of Fujitsu Ltd. and was previously CFO of Brocade Communications Systems Inc. Prior to Fujitsu, Mr. Deranleau was the VP of Finance and CFO for Brocade Communications Systems Inc.

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