Semiconductors and Semiconductor Equipment
Company Overview of eASIC Corporation
eASIC Corporation, a fabless semiconductor company, manufactures eASIC platforms that reduce the cost of ownership and time to production of customized silicon devices. The company offers Nextreme family of devices that reduce development cost and turn-around times compared to standard cell ASICs, while reducing power consumption and unit cost for designs; Nextreme-3, a fourth generation eASIC platform; and Nextreme-2, a third generation eASIC platform. It also provides easicopy ASIC that provides OEMs with a path from Nextreme-3, Nextreme-2, or Nextreme devices to a cell-based easicopy ASIC, thereby enabling OEMs to further reduce device cost and power consumption, or increase performance; ...
2585 Augustine Drive
Santa Clara, CA 95054
Founded in 1999
Key Executives for eASIC Corporation
Chief Executive Officer, President and Director
Chief Financial Officer and Senior Vice President of Finance
Chief Technology Officer and Senior Vice President of Engineering
Vice President of Legal, General Counsel and Corporate Secretary
Director of Circuit Design
Compensation as of Fiscal Year 2016.
eASIC Corporation Key Developments
eASIC Corp. Enables Improved Real-Time Hardware Acceleration Performance for ASOCS’ Fully Virtualized Ran (Vran) Solution
Feb 23 16
eASIC Corp. and ASOCS Ltd. announced that the eASIC Nextreme-3 platform was used by ASOCS to deliver significantly higher performance in its third generation modem processing unit (MPU) Hardware Acceleration (HWA). The delivery of the eASIC Nextreme-3 platform is part of a definitive agreement to develop custom silicon devices for the acceleration of next-generation network virtualization using the eASIC Nextreme-3 platform. The unique ASOCS architecture enables the software of all layers and functions of a base station to run in virtual machines, on standard commercial-off-the-shelf, Intel Xeon-processors-based high volume IT servers, with a network attached multi-RAT hardware acceleration device based on the eASIC platform.
eASIC Partners with ASOCS to Develop a Custom Silicon Device
Aug 30 15
eASIC Corp. and ASOCS reported that they have signed a definitive agreement to develop a custom silicon device for the acceleration of next-generation network virtualization applications utilizing the eASIC Nextreme-3 platform.
eASIC Corp. and Tamba Networks Announce Immediate Availability of 100 Gigabit Ethernet Solution for Data Center, Core and Access Network Switching Applications
Aug 17 15
eASIC Corp. and Tamba Networks announced the immediate availability of a 100 Gigabit Ethernet MAC (media access controller) and PCS (physical coding sublayer) solution for high bandwidth applications, such as data center, and core and access network switching. The combination of the eASIC Nextreme-3 silicon platform and Tamba’s flexible, ultra-low-latency Gigabit Universal Ethernet MAC/PCS cores gives designers a single integrated platform for building IEEE802.3-compliant communications equipment that supports 100G Ethernet and 40GE-KR4, including FEC (forward error correction), link training and auto negotiation.
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