Semiconductors and Semiconductor Equipment
Company Overview of eASIC Corporation
eASIC Corporation operates as a fabless semiconductor company that delivers custom integrated circuits (ICs). The company’s eASIC solution consists of eASIC platform, which incorporates a versatile, pre-defined, and re-usable base array and customizable single-mask layer. Its application specific integrated circuits (ASIC), delivered using its easicopy, or standard ASIC methodologies, as well as its proprietary design tools. The company is also involved in the design and development of ICs for customers and related design services and prototypes. Its products are used in communications infrastructure, storage and data processing, and industrial applications. The company operates in the Unite...
2585 Augustine Drive
Santa Clara, CA 95054
Founded in 1999
Key Executives for eASIC Corporation
Chief Executive Officer, President and Director
Chief Financial Officer and Senior Vice President of Finance
Chief Technology Officer and Senior Vice President of Engineering
Compensation as of Fiscal Year 2014.
eASIC Corporation Key Developments
eASIC Corporation and Comcores Announce Availability of CPRI v6.1
Mar 2 15
eASIC Corporation and Comcores ApS announced the immediate availability of the Common Public Radio Interface (CPRI) v6.1 for eASIC’s Nextreme-3 28nm devices. With an increased line rate up to 12.165Gbps and improved line coding efficiency, CPRI v6.1 supports an increased RF signal bandwidth of up to 240MHz needed for the proliferation of C-RAN fronthaul networks. When combined with the new ETSI (European Telecommunications Standards Institute) ORI (Open Radio Interface) ISG (Industry Specifications Group) standard for 2:1 LTE lossless compression algorithm, the effective RF signal bandwidth for CPRI v6.1 can be increased to 480MHz bandwidth while meeting 3GPP LTE RF performance and latency requirements. The new CPRI v6.1 IP with integrated ORI compliant compression engine in an eASIC Nextreme-3 custom IC platform allow developers to implement more efficient digital DAS (Distributed Antenna Systems) and remote radio head solutions in a zero-footprint form factor. As an example a 2x2 low power radio can be deployed using a 240MHz signal bandwidth per antenna either in contiguous or non-contiguous spectrum applications making it ideal for high performance neutral-host multi-operator and multi-band DAS applications. Alternatively, a 4x4 radio head can be implemented using 120MHz bandwidth per antenna. The combination of eASIC Nextreme-3 custom IC platforms with 12.5Gbps serial transceivers and Comcores highly integrated CPRI v6.1 IP with compression engine compliant to ORI standard provides a compelling solution that consumes a fraction the power of alternatives, enabling zero-footprint radio modules and drastically reducing the amount of optic fiber connectivity.
eASIC Corporation Seeks Acquisitions
Feb 19 15
eASIC Corporation is looking for acquisition opportunities. eASIC has filed an Initial Public Offering in the amount of $75 million and eASIC may use a portion of the net proceeds to acquire complementary businesses, products, services or technologies; however, we do not have agreements or commitments for any specific acquisitions at this time.
eASIC Mulls IPO
Feb 19 15
eASIC Corporation announced that it has publicly filed a registration statement on Form S-1 with the U.S. Securities and Exchange Commission (SEC) relating to a proposed initial public offering (IPO) of its common stock. The number of shares to be offered and the price range for the proposed offering have not been determined. eASIC intends to apply to list its common stock on the Nasdaq Global Select Market under the ticker symbol “EASI”. Morgan Stanley & Co. LLC and Deutsche Bank Securities Inc. will act as joint book-running managers for the offering. Raymond James & Associates, Inc., Robert W. Baird & Co. Incorporated, William Blair & Company, L.L.C., Roth Capital Partners, LLC and Northland Securities, Inc. will act as co-managers.
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