September 29, 2016 1:49 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Cascade Microtech Inc.

Company Overview

Cascade Microtech, Inc. designs, develops, manufactures, and markets wafer probing, thermal, and reliability solutions for the electrical measurement and testing of high performance semiconductor devices. The company operates through two segments, Systems and Probes. It offers probe stations, which are used in conjunction with analytical probes to test chips in wafer form, together forming a probing system; thermal chuck systems used in probe stations, as well as specific systems for testing electronic components, hybrids, PCBs, or other assemblies at the test site; and reliability test systems, which are used in various reliability test applications. The company also provides production pro...

9100 SW Gemini Drive

Beaverton, OR 97008

United States

Founded in 1983

502 Employees





Key Executives for Cascade Microtech Inc.

Chief Executive Officer, President and Director
Age: 57
Chief Financial Officer, Vice President of Finance, Treasurer and Secretary
Age: 56
Director of Worldwide Sales and Service -Engineering Products Division
Vice President and General Manager of Integrated Measurement Systems
Age: 52
Vice President and General Manager of Systems Business Unit
Compensation as of Fiscal Year 2016.

Cascade Microtech Inc. Key Developments

Cascade Microtech Announces the Launch of the CM300xi Probe System with Contact Intelligence Technology

Cascade Microtech announced the launch of the CM300xi probe system with Contact Intelligence technology. This new technology allows the CM300xi to sense, learn and react to extremely complex environments characterized by multiple temperatures and small pad layouts. The CM300xi adjusts automatically to provide highly accurate probe-to-pad alignment and measurement for a broad array of wafers, materials and devices enabling customers to reliably collect large amounts of electrical data faster, to improve yields and reduce time to market. Semiconductor feature sizes, scribe lines and pad sizes continue to shrink, increasing the need to contact devices accurately under difficult conditions such as changing temperatures. The effective characterization of new technologies and materials also requires more data than in the past, in part to build accurate statistical models. Coupled with increasing pressures to accelerate product and node ramps, test managers need to gather huge amounts of accurate data they can trust. The CM300xi with Contact Intelligence technology directly addresses these challenges. The CM300xi is the latest enhancement to the 300 mm probe system offering from Cascade Microtech. The CM300xi provides the lab automation capabilities needed to make critical precision electrical measurements for device characterization and high-volume engineering. It is also ideally suited for customized solutions and niche production applications. The Contact Intelligence technology adapts to temperature variance, and provides automated drift correction for unattended testing on small pads over time and temperature. A number of significant features enable the Contact Intelligence capability. Motorized positioners with frictionless EMI shielding allow the CM300xi precise compensation of thermally-induced drift without compromising low-noise environment conditions. An on-axis probe needle tracking capability makes it easier to measure on small pads at multiple temperatures. Contact accuracy is achieved with consistent and reliable measurement results on smallest pad sizes. Thermal management enhancements provide for shorter soak times and faster thermal transitions—reducing soak time to a minimum and integrating thermal transition in a single command.

Cascade Microtech Introduces Breakthrough Wafer-Level Electromigration Test System

Cascade Microtech announced the launch of the Estrada-EM system to offer high-performance electromigration (EM) wafer-level reliability (WLR) testing of copper lines and vias in an oxygen-depleted environment. The Estrada-EM system delivers important WLR benefits to a test industry which has traditionally been limited to package-level reliability (PLR) test methods alone for EM. By overcoming several long-standing technical hurdles, this new product enables semiconductor reliability test programs to produce faster test results and assure high data integrity. Electromigration is widely recognized to be a critical reliability issue for semiconductor technologies, and expected to become an even greater challenge at the 10 nm node and beyond. Proper evaluation of EM reliability necessitates the testing of many samples, under many conditions. By eliminating the packaging steps required for PLR, which delay the start of every test, the Estrada-EM WLR solution provides the same electromigration reliability answers days, or even weeks, sooner. In addition to eliminating the packaging delays, the system further boosts test program throughput with an extended-range thermal system for test acceleration, high-parallel test capacity, and unique features for unattended test which include automated in-situ probe alignment and autonomous dynamic thermal test profiles. The result is quicker technology evaluation cycles and faster fab process qualifications, for reduced time to market and increased profitability. These benefits are extended to the full reliability test market by Cascade Microtech’s revolutionary PureZone oxygen-purging chamber system, which carefully wraps the wafer in an inert gas environment to prevent oxidation of copper pads and structures. This innovation enables, for the first time, direct testing of all wafers with copper interconnect technologies, including those without pad capping or passivation and even partially-processed wafers.

Cascade Microtech Releases 1/F Measurement Solution with Keysight Technologies

Cascade Microtech announced the release of a comprehensive low-frequency noise measurement solution for device modeling, characterization and reliability testing with MeasureOne solution partner Keysight Technologies. As the semiconductor industry has moved to smaller devices with lower power consumption, modern semiconductor processes have put devices where noise plays a bigger role in overall circuit system performance. Measuring and modeling low-frequency noise becomes imperative, as this noise can impair signal processing circuitry in both signal generation and receiver circuitry. Furthermore, the industry has now adopted 1/f and random telegraph noise (RTN) metrics as leading indicators for reliability, embracing these measurements for process control in semiconductor production. True noise immunity is essential in a measurement environment that seeks precise 1/f data from 0.03 Hz to 40 MHz. One of the biggest challenges in measuring component noise is avoiding data corruption by other noise sources in the system. Creating a noise-free measurement environment remains a costly and time-consuming pursuit for device and circuit researchers to develop on their own. Additionally, when equipment is sourced from multiple suppliers, it can be challenging to specify test system integration and performance. Measurement functionality must be validated and proven on-site before the first device can be tested, often requiring data correlation between different locations. It can take weeks, or even months to arrive at the first measurements.

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