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August 31, 2015 7:02 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Plasma-Therm, LLC

Company Overview

Plasma-Therm, LLC manufactures and supplies etch and thin film deposition equipment for global compound semiconductor and related specialty markets. It offers open-load etch and deposition systems, large area plasma enhanced chemical vapor deposition platforms, cassette-to-cassette handling cluster based platforms, and photomask production systems. The company also provides EndpointWorks, an endpoint detection system that utilizes multiple inputs to determine process endpoints; and MicroDieSingulator systems that deliver plasma-based singulation of semiconductor dies. It also provides service, repair, retrofits, spare parts kits, training, and part returns/replacement. The company serves MEM...

10050 16th Street North

St. Petersburg, FL 33761

United States

Founded in 2009

Phone:

727-577-4999

Fax:

888-531-5067

Key Executives for Plasma-Therm, LLC

Chief Executive Officer
Chief Financial Officer
Chief Operating Officer
Chief Technology Officer
Executive Vice President of Marketing and Sales
Compensation as of Fiscal Year 2015.

Plasma-Therm, LLC Key Developments

ON Semiconductor Corporation Signs Cross Licensing Agreement with Plasma-Therm LLC

ON Semiconductor Corporation has entered into a cross licensing agreement with Plasma-Therm LLC to use the Plasma-Therm's MDS-100 die singulation solution for production of its semiconductor devices.

Plasma-Therm, LLC Launches Plasma-Based Die-Singulation System

Plasma-Therm announced the launch of its new MicroDieSingulator (MDS) systems. These revolutionary systems deliver plasma-based singulation of semiconductor dies from 4-inch, 6-inch, and 8-inch wafers mounted on industry-standard tape frames. The announcement was made at IMAPS, the 46th International Symposium on Microelectronics, being held this week in Orlando, Florida. By utilizing energized plasma, rather than mechanical saws or lasers to cut between dies, the MDS system allows singulation of individual dies with separation lines of 20 microns or less far smaller than most existing equipment can achieve. In addition to allowing maximum utilization of valuable silicon-wafer real estate by reducing street size, Plasma-Therm’s exclusive MicroDieSingulator technology separates dies without causing lateral damage from stress-induced cracking, overheating, or re-deposition of ablated material. Scanning-electron microscope images confirm that Plasma-Therm’s MDS process produces separated dies with smooth, vertical sidewalls. MDS systems allow integrated device manufacturers to produce more wafers per hour, as well as more individual dies per wafer. The MDS plasma process also results in dies that are less likely to be chipped during separation and are less prone to fracture during packaging.

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