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February 09, 2016 11:00 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of United Test and Assembly Center Ltd.

Company Overview

United Test and Assembly Center Ltd. provides semiconductor assembly and testing services for a range of integrated circuits, including mixed-signal, analog, and memory for integrated device manufacturers, fabless companies, and wafer foundries worldwide. It offers package portfolio, design, package characterization, technical library, package and test development, and engineering services. The company was formerly known as United Test and Assembly Center (S) Pte Ltd. and changed its name to United Test and Assembly Center Ltd. in May 2000. United Test and Assembly Center Ltd. was incorporated in 1997 and is headquartered in Singapore with manufacturing facilities in Singapore; Thailand; Tai...

22 Ang Mo Kio Industrial Park 2

Singapore,  569506


Founded in 1997

12,097 Employees


65 6481 0033


65 6551 1521

Key Executives for United Test and Assembly Center Ltd.

Chief Executive Officer, Group President and Director
Age: 61
Chief Financial Officer and Principal Accounting Officer
Age: 45
Senior Vice President of Operations
Age: 52
President of UTAC (Taiwan) Corporation
Age: 67
Chief Procurement Officer and Senior Vice President of Worldwide Customer Service & Demand Management
Age: 54
Compensation as of Fiscal Year 2015.

United Test and Assembly Center Ltd. Key Developments

UTAC Holdings Ltd Introduces Two New Offerings to Bolster its Quad Flat No-Lead Portfolio

UTAC Holdings Ltd. has introduced two new offerings to bolster its quad flat no-lead portfolio, a 0.3mm thin QFN package and a side lead plating process that improves QFN solder joints for automotive, aerospace and other harsh environmental applications. Both offerings are qualified with major customers and scheduled to go into mass production in the second half of 2015. This latest member of UTAC's thin QFN portfolio will allow customers to meet increasing market demand for slimmer, lighter products, such as smartphones, smart watches, fitness bands, and smart cards; while retaining the same QFN product features of low power, high performance and value. UTAC has been qualified by major automotive customers for its QFN side lead plated solutions, also termed a wettable flank solution, which improves QFN solder joints for improved printed circuit board assembly throughput and solder joint reliability. This solution is commonly used for a wide range of automotive devices, such as airbags, car distance sensors, and rear view mirror camera processors.

Amkor Technology Inc Files Amended Complaint Against United Test and Assembly Center Ltd

United Test and Assembly Center Ltd. previously announced that the Superior Court of Arizona, Maricopa County had on January 5, 2015 issued a ruling in relation to the company's motion to dismiss Amkor Technology Inc.'s complaint. Subject to the applicable rules of court, the court granted the dismissal of seven out of nine claims made by Amkor. On February 13, 2015, Amkor filed an amended complaint in which it reasserted the two claims that had not been dismissed and reasserted one claim that the court had dismissed relating to Amkor's claim that it has a right to purchase certain patents belonging to ASAT Ltd. (now UTAC Hong Kong Ltd). Amkor's amended complaint confirmed that it is not seeking to reassert six of the claims that were dismissed, but is reserving a right to appeal the dismissal of those claims.

UTAC Plans IPO In 2015

United Test and Assembly Center Ltd. (UTAC) is planning an initial public offering (IPO). It is talks with bankers about a possible relisting. An IPO would capitalize on an unfolding upturn in its business, and enable the company to address its debt load of some $1.2 billion. UTAC's Chief Executive Officer, John ¬Nelson told The Edge Singapore: "Do we want to be sitting on a 10% bond? I don't think so. Obviously, at some point, we have to look at options. Since we feel the company is healthy, what opportunities do we have to correct that, to fix that financial burden?" He added that an IPO could take place next year. He further stated that any cash raised in an IPO is likely to be used to "restructure" the group's debt. "Based on our discussions with them, we don't believe there is an intention to use that cash themselves," he said.

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