January 28, 2015 12:36 PM ET

Communications Equipment

Company Overview of 3S Photonics S.A.S.

Company Overview

3S PHOTONICS S.A.S. designs, develops, manufactures, and sells optical products and solutions for CATV/FTTH, defense and security, industrial, medical, scientific, telecommunication, sensing, and laser markets in France and internationally. It offers active and passive optical components and modules, including fiber Bragg gratings (FBG), FBG based sensors, passive multimode components, passive singlemode components, phase demodulators, pump laser modules, seed laser modules, and transmission laser modules. The company also offers high-performance and high-power erbium and ytterbium doped fiber amplifiers; fiber lasers in CW or pulsed regime; and a range of OEM telecom and industrial amplifie...

Route de Villejust


Nozay,  91625


Founded in 1994

15,017 Employees


33 1 69 80 57 50


33 1 69 80 58 83

Key Executives for 3S Photonics S.A.S.

Chief Executive Officer
Chief Financial Officer
Chief Operating Officer and Chief R&D Officer
Executive Vice President of Sales and Business Development
Compensation as of Fiscal Year 2014.

3S Photonics S.A.S. Key Developments

3S Photonics SAS and Finisar Corp. Announces their Formal Agreement to Launch a Partnership for the Development of a New Packaging Platform for 980nm Cooled Laser Pump Modules

3S Photonics SAS and Finisar Corp. announced their formal agreement to launch a partnership for the development of a new packaging platform for 980nm cooled laser pump modules. Under this agreement, 3S PHOTONICS will be the exclusive supplier of the 980nm laser chips used for this platform, and Finisar will implement a manufacturing line based on this platform in its newly expanded facilities in Wuxi, China. Finisar will use these 980nm pump modules in their EDFA and Line Card products for the telecom market. 3S PHOTONICS will use the packaging platform to serve its own customers. The 980nm lasers supplied by 3SPGroup are already fully qualified with outstanding field reliability. The availability of the modules resulting from this new packaging platform is expected by mid-2013.

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