Semiconductors and Semiconductor Equipment
Company Overview of Ziptronix, Inc.
Ziptronix, Inc. develops low-temperature direct bonding technologies for wafer-level or die-level bonding. The company offers ZiBond, a direct oxide bonding technology for 3D scalable stacking solutions; and Direct Bond Interconnect (DBI), a conductor/dielectric hybrid bonding technology that includes a various metal/oxide/nitride combinations to interconnect structures. Its technologies are used for semiconductor applications, including chip stacking, silicon substrates, backside-illuminated sensors, RF front ends, pico-projectors, memories, and 3D integrated circuits; die-to-wafer bonding; wafer-to-wafer bonding; and wafer-scale, hermetic encapsulation solutions for advanced MEMS devices. ...
5400 Glenwood Avenue
Raleigh, NC 27612
Founded in 2000
Key Executives for Ziptronix, Inc.
Chief Technology Officer and Vice President of Research & Development
Director of Business Development
Director of Business Development and Licensing
Compensation as of Fiscal Year 2016.
Ziptronix, Inc. Key Developments
Ziptronix, Inc. and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions
Oct 29 15
Ziptronix, Inc. announced that it has entered into a development agreement with Fraunhofer IZM-ASSID. The companies will work together to integrate Ziptronix Direct Bond Interconnect (DBI®) technology into Fraunhofer's 300mm wafer production line and demonstrate DBI as the industry's finest pitch, thinnest and lowest total cost-of-ownership 3D integration solution.
Ziptronix Inc. Announces Patent Licensing Agreement with Sony Corporation
Mar 18 15
Ziptronix Inc. announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix's hybrid bonding patents for high volume applications.
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