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February 07, 2016 5:04 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Ziptronix, Inc.

Company Overview

Ziptronix, Inc. develops low-temperature direct bonding technologies for wafer-level or die-level bonding. The company offers ZiBond, a direct oxide bonding technology for 3D scalable stacking solutions; and Direct Bond Interconnect (DBI), a conductor/dielectric hybrid bonding technology that includes a various metal/oxide/nitride combinations to interconnect structures. Its technologies are used for semiconductor applications, including chip stacking, silicon substrates, backside-illuminated sensors, RF front ends, pico-projectors, memories, and 3D integrated circuits; die-to-wafer bonding; wafer-to-wafer bonding; and wafer-scale, hermetic encapsulation solutions for advanced MEMS devices. ...

5400 Glenwood Avenue

Suite G-05

Raleigh, NC 27612

United States

Founded in 2000

Phone:

919-459-2400

Fax:

919-459-2411

Key Executives for Ziptronix, Inc.

Chief Executive Officer and President
Chief Financial Officer
Chief Technology Officer and Vice President of Research & Development
Director of Business Development
Director of Business Development and Licensing
Compensation as of Fiscal Year 2015.

Ziptronix, Inc. Key Developments

Ziptronix, Inc. and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions

Ziptronix, Inc. announced that it has entered into a development agreement with Fraunhofer IZM-ASSID. The companies will work together to integrate Ziptronix Direct Bond Interconnect (DBI®) technology into Fraunhofer's 300mm wafer production line and demonstrate DBI as the industry's finest pitch, thinnest and lowest total cost-of-ownership 3D integration solution.

Ziptronix Inc. Announces Patent Licensing Agreement with Sony Corporation

Ziptronix Inc. announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix's hybrid bonding patents for high volume applications.

Fermilab Implements Ziptronix's DBI Hybrid Bonding in High-End 3D Image Sensors

Ziptronix Inc. announced that its Direct Bond Interconnect (DBI(R)) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

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