Semiconductors and Semiconductor Equipment
Company Overview of Ziptronix, Inc.
Ziptronix, Inc. develops low-temperature direct bonding technologies for wafer-level or die-level bonding. The company offers ZiBond, a direct oxide bonding technology for 3D scalable stacking solutions; and Direct Bond Interconnect (DBI), a conductor/dielectric hybrid bonding technology that includes a various metal/oxide/nitride combinations to interconnect structures. Its technologies are used for semiconductor applications, including chip stacking, silicon substrates, backside-illuminated sensors, RF front ends, pico-projectors, memories, and 3D integrated circuits; die-to-wafer bonding; wafer-to-wafer bonding; and wafer-scale, hermetic encapsulation solutions for advanced MEMS devices. ...
5400 Glenwood Avenue
Raleigh, NC 27612
Founded in 2000
Key Executives for Ziptronix, Inc.
Chief Executive Officer and President
Chief Technology Officer and Vice President of Research & Development
Director of Business Development
Director of Business Development and Licensing
Compensation as of Fiscal Year 2015.
Ziptronix, Inc. Key Developments
Ziptronix, Inc. and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions
Oct 29 15
Ziptronix, Inc. announced that it has entered into a development agreement with Fraunhofer IZM-ASSID. The companies will work together to integrate Ziptronix Direct Bond Interconnect (DBI®) technology into Fraunhofer's 300mm wafer production line and demonstrate DBI as the industry's finest pitch, thinnest and lowest total cost-of-ownership 3D integration solution.
Ziptronix Inc. Announces Patent Licensing Agreement with Sony Corporation
Mar 18 15
Ziptronix Inc. announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix's hybrid bonding patents for high volume applications.
Fermilab Implements Ziptronix's DBI Hybrid Bonding in High-End 3D Image Sensors
Sep 9 14
Ziptronix Inc. announced that its Direct Bond Interconnect (DBI(R)) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.
Similar Private Companies By Industry
Recent Private Companies Transactions
August 27, 2015
Most Searched Private Companies
Sponsored Financial Commentaries