Semiconductors and Semiconductor Equipment
Company Overview of Ziptronix, Inc.
Ziptronix, Inc. designs, develops, and markets semiconductor integration technologies to the electronics industry. The company offers chip stacking, three dimensional integrated circuits, and silicon substrate applications. Ziptronix, Inc. has a strategic agreement with Tezzaron Semiconductor Corporation and Novati Technologies. The company was founded in 2000 and is based in Morrisville, North Carolina.
800 Perimeter Park Drive
Morrisville, NC 27560-7271
Founded in 2000
Key Executives for Ziptronix, Inc.
Chief Executive Officer and President
Chief Technology Officer and Vice President of Research & Development
Vice President of Market Development
Vice President of Marketing and Vice President of Business Development
Compensation as of Fiscal Year 2014.
Ziptronix, Inc. Key Developments
Ziptronix Inc. Announces Patent Licensing Agreement with Sony Corporation
Mar 18 15
Ziptronix Inc. announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix's hybrid bonding patents for high volume applications.
Fermilab Implements Ziptronix's DBI Hybrid Bonding in High-End 3D Image Sensors
Sep 9 14
Ziptronix Inc. announced that its Direct Bond Interconnect (DBI(R)) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.
Ziptronix Inc. and EV Group Successfully Achieves Submicron Post-Bond Alignment Accuracy on Customer-Provided 300mm DRAM Wafers
May 27 14
Ziptronix Inc. and EV Group announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix's DBI(R) Hybrid Bonding technology on an EVG Gemini(R) FB production fusion bonder and SmartView(R) NT bond aligner. This approach can be used to manufacture fine-pitch 3D ICs for a variety of applications including stacked memory, advanced image sensors and stacked systems-on-chip (SoCs). Pitch scaling on next-generation 3D technologies is expected to continue for many years to come. Fine-pitch hybrid bonding is already in use in high-performance 3D memory products, and has been announced for HVM of 3D image sensors. DBI Hybrid Bonding can be used at the die or wafer level; however, wafer-level bonding enables a great cost benefit by bonding all the die at once. With much of the processing for DBI Hybrid Bonding taking place at wafer scale, there is the added benefit of low cost-of-ownership. Ziptronix Direct Bond Interconnect (DBI(R)) Hybrid Bonding is a conductor/dielectric bonding technology that includes a variety of metal/oxide and/or nitride combinations, does not use adhesives and is currently the most suitable for volume manufacturing in the marketplace. It allows for strong, room temperature dielectric bonding, low temperature conductive bonding and finer-pitch interconnect over Cu/Cu or other metal bonding because the bond occurs between both the dielectric and the conductive surfaces, which effectively bonds the entire substrate interface area. EVG's SmartView(R) NT Automated Bond Alignment System for Universal Alignment offers a proprietary method of face-to-face wafer-level alignment, which is key to achieving the required accuracy in multiple wafer stacking for technologies. In addition to improving alignment capabilities on its SmartView(R) NT bond aligner to reach submicron accuracies, EVG has optimized it so that surfaces can be prepared simultaneously for bonding, electrical connectivity and mechanical strength. The companies will showcase this technology at ECTC 2014, from May 27-30, 2014, in Lake Buena Vista, Florida.
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