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October 06, 2015 10:48 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of Ziptronix, Inc.

Company Overview

Ziptronix, Inc. develops low-temperature direct bonding technologies for wafer-level or die-level bonding. The company offers ZiBond, a direct oxide bonding technology for 3D scalable stacking solutions; and Direct Bond Interconnect (DBI), a conductor/dielectric hybrid bonding technology that includes a various metal/oxide/nitride combinations to interconnect structures. Its technologies are used for semiconductor applications, including chip stacking, silicon substrates, backside-illuminated sensors, RF front ends, pico-projectors, memories, and 3D integrated circuits; die-to-wafer bonding; wafer-to-wafer bonding; and wafer-scale, hermetic encapsulation solutions for advanced MEMS devices. ...

5400 Glenwood Avenue

Suite G-05

Raleigh, NC 27612

United States

Founded in 2000





Key Executives for Ziptronix, Inc.

Chief Executive Officer and President
Chief Financial Officer
Chief Technology Officer and Vice President of Research & Development
Director of Business Development
Director of Business Development and Licensing
Compensation as of Fiscal Year 2015.

Ziptronix, Inc. Key Developments

Ziptronix Inc. Announces Patent Licensing Agreement with Sony Corporation

Ziptronix Inc. announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix's hybrid bonding patents for high volume applications.

Fermilab Implements Ziptronix's DBI Hybrid Bonding in High-End 3D Image Sensors

Ziptronix Inc. announced that its Direct Bond Interconnect (DBI(R)) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

Ziptronix Inc. and EV Group Successfully Achieves Submicron Post-Bond Alignment Accuracy on Customer-Provided 300mm DRAM Wafers

Ziptronix Inc. and EV Group announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix's DBI(R) Hybrid Bonding technology on an EVG Gemini(R) FB production fusion bonder and SmartView(R) NT bond aligner. This approach can be used to manufacture fine-pitch 3D ICs for a variety of applications including stacked memory, advanced image sensors and stacked systems-on-chip (SoCs). Pitch scaling on next-generation 3D technologies is expected to continue for many years to come. Fine-pitch hybrid bonding is already in use in high-performance 3D memory products, and has been announced for HVM of 3D image sensors. DBI Hybrid Bonding can be used at the die or wafer level; however, wafer-level bonding enables a great cost benefit by bonding all the die at once. With much of the processing for DBI Hybrid Bonding taking place at wafer scale, there is the added benefit of low cost-of-ownership. Ziptronix Direct Bond Interconnect (DBI(R)) Hybrid Bonding is a conductor/dielectric bonding technology that includes a variety of metal/oxide and/or nitride combinations, does not use adhesives and is currently the most suitable for volume manufacturing in the marketplace. It allows for strong, room temperature dielectric bonding, low temperature conductive bonding and finer-pitch interconnect over Cu/Cu or other metal bonding because the bond occurs between both the dielectric and the conductive surfaces, which effectively bonds the entire substrate interface area. EVG's SmartView(R) NT Automated Bond Alignment System for Universal Alignment offers a proprietary method of face-to-face wafer-level alignment, which is key to achieving the required accuracy in multiple wafer stacking for technologies. In addition to improving alignment capabilities on its SmartView(R) NT bond aligner to reach submicron accuracies, EVG has optimized it so that surfaces can be prepared simultaneously for bonding, electrical connectivity and mechanical strength. The companies will showcase this technology at ECTC 2014, from May 27-30, 2014, in Lake Buena Vista, Florida.

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