Semiconductors and Semiconductor Equipment
Company Overview of CEC Huada Electronic Design Co., Ltd.
CEC Huada Electronic Design Co., Ltd. designs integrated circuits for electronic devices in China. The company offers IC card chips, wireless LAN chips, electronic design automation systems, USB-key chips, contact IC card chips, contact less IC card chips, dual interface chips, and solutions for set top boxes. It also provides design and project management services. The company was founded in 2002 and is based in Beijing, China. As of September 9, 2009, CEC Huada Electronic Design Co., Ltd. operates as a subsidiary of China Electronics Corporation Holdings Company Limited.
Founded in 2002
Key Executives for CEC Huada Electronic Design Co., Ltd.
CEC Huada Electronic Design Co., Ltd. does not have any Key Executives recorded.
CEC Huada Electronic Design Co., Ltd. Key Developments
Semiconductor Manufacturing International Corp and CEC Huada Electronic Design Co Ltd Launches First 55nm Smart Card Chip
Aug 26 14
Semiconductor Manufacturing International Corp. or SMIC and CEC Huada Electronic Design Co Ltd. have jointly launched China's first 55nm smart card chip based on SMIC's 55nm LL eFlash platform in August. The new chip has entered mass production and is being widely recognized by customers for its smaller size, lower power consumption and high performance.
CEC Huada Electronic Design Launches 55nm Smart Card Chip on SMIC's 55nm LL eFlash Platform
Aug 4 14
Semiconductor Manufacturing International Corporation and CEC Huada Electronic Design Co., Ltd. jointly announced that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL (low leakage) eFlash (embedded flash) platform. With the benefits of being smaller in size, lower power consumption and faster performance, it has been put into mass production and is being widely recognized by customers. SMIC's 55nm LL eFlash platform offers high-performance and low-cost solutions to customers. The platform has complete logic compatibility and all of extensive 1.2V logic library IPs can be applied to this embedded platform. The lower logic voltage of the 1.2V core device reduces the chips' power consumption and maximizes their performance. In addition, the performance and reliability has been made more efficient with the use of Cu-BEoL (Back-end of Line). This allows a higher electric current density in the existing design by having a lower electrical resistance caused by Copper's electro-migration. The surface area of the chips has shrunk significantly and the smaller cell size allows the application of large flash memory possible. As the flash cell continues to shrink, the chip area will be further optimized to make it more economical. At present, the technology platform has passed the product reliability test and can meet the application requirements of standard smart cards. Based on this platform, HED has successfully launched China's first advanced 55nm smart card chip to market.
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