Electronic Equipment, Instruments and Components
Company Overview of Comtech Xicom Technology, Inc.
Comtech Xicom Technology, Inc. supplies high power indoor and outdoor amplifier products for satellite communications worldwide. The company offers traveling wave tube amplifiers, klystron power amplifiers, AC and DC powered solid state power amplifiers, block up converters, controllers, and klystron power amplifiers for commercial and military broadcast and broadband applications around the world. Its products are used in commercial, direct to home, broadcast, SNG, military communications, airborne, shipboard, and on-the-move applications. The company offers its products through distributors in Argentina, Brazil, Chile, Peru, Italy, the Russian Federation and CIS territories, Spain, Austral...
3550 Bassett Street
Santa Clara, CA 95054-2704
Founded in 1991
Key Executives for Comtech Xicom Technology, Inc.
President of Xicom Technology Europe Ltd
Administration Manager and Account Manager
Compensation as of Fiscal Year 2016.
Comtech Xicom Technology, Inc. Key Developments
Comtech Xicom Technology Receives USD 2.0 Million Contract High Throughput Satellite (HTS) System Amplifiers
Jun 30 16
Comtech Telecommunications Corp. announced that its subsidiary Comtech Xicom Technology Inc, part of Comtech's Commercial Solutions segment, has won a Ka-band high-power amplifier contract for over USD 2.0 million from a leading satellite communications (SATCOM) operator. Amplifiers will be deployed on three continents to launch a major new High Throughput Satellite (HTS) system. Comtech Xicom Technology provides its products for both military and commercial satellite uplink applications.
Anta Clara, Comtech Xicom Technology Inc Wins $11.8 Million Order for Solid-State Power Amplifiers for In-Flight Connectivity Application
Jun 29 16
Comtech Telecommunications Corp. announced that its Santa Clara, Comtech Xicom Technology Inc., received an $11.8 million follow-on production order for Solid-State Power Amplifiers (SSPAs) to be used in an airborne, In-Flight Connectivity application.
Comtech Xicom Technology, Inc. Announces New GaN-Based Solid-State X-Band Block upconverter
May 2 16
Comtech Xicom Technology, Inc. announced a new GaN-based solid-state X-band block upconverter (BUC) that packs a tremendous amount of power into a 5.3-pound (2.4 kg) antenna-mount outdoor unit. This compact, lightweight and highly capable BUC provides 20 watts of linear output power in a 5.8” x 5.1” x 3.9” (147mm x 130mm x 99mm) feed-mountable package designed to handle tough environments and meet stringent X-band RF requirements, while drawing very little power for extended battery operation. Model XTSLIN-20X-B1 features approximately 50W of saturated output power, 25W of linear power using MIL-STD-188-164 definition at mid-band, and more than 20W of linear power across the 500 MHz frequency band (7.9 - 8.4 GHz) over a temperature range of -40°C to +60°C. This high linear output power level is achieved at less than 120W prime power consumption across all conditions, and comes in a self-cooled feed-mount package that can handle the toughest environments. The key to this unit’s compact size and light weight is its efficiency. It operates as a Class AB amplifier with DC prime power draw ranging from 108W at 20W linear RF power output, down to 60W at 2W linear power output. Optional proprietary features offer even greater efficiency at lower output power levels with Battery Saver mode to extend battery life when conditions allow, making this the most flexible BUC of its kind for manpack and transportable terminals. The new X-band BUC accepts a 950-1450 MHz L-band input, upconverts it to 7.9 – 8.4 GHz X-band. The all solid-state unit uses GaN transistors to amplify the signal to achieve full output power. Additional features include temperature compensation, gain control, harmonic filtering, tight gain variation and stability, a serial RS-232 digital monitor and control interface, and options for operating with +24 or +48 VDC prime power, provided over the IF line or through a separate connector.
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