Semiconductors and Semiconductor Equipment
Company Overview of Toshiba America Electronic Components, Inc.
Toshiba America Electronic Components, Inc. designs, develops, manufactures, and markets semiconductors, electronic components, and storage products. It offers products in the categories of amorphous, analog and peripheral ICs, automotive, battery charger ICs, custom SoC/ASIC, diodes, electron tubes, imaging solutions, LCD technology, LED lighting, linear ICs, logic ICs, materials, memory, and motor controllers. The company also provides microprocessors, microwave, motor controller and driver ICs, optical semiconductor devices, radio frequency devices, wireless, and storage products. Its products are used in automotive, mobile, wireless, industrial, multimedia, LED solid-state lighting, and ...
9740 Irvine Boulevard
Irvine, CA 92618
Founded in 1989
Key Executives for Toshiba America Electronic Components, Inc.
Chief Executive Officer and President
Senior Vice President and Technology Executive of System Lsi Group
Vice President of Business Development - Discrete Business Unit
Vice President of Display Devices & Components Business Unit
Senior Vice President of Memory Marketing
Compensation as of Fiscal Year 2014.
Toshiba America Electronic Components, Inc. Key Developments
Toshiba America Electronic Components, Inc. Expands Range of Ultra-Small Photorelays
Jan 14 15
Toshiba America Electronic Components, Inc. announced the expansion of its lineup of ultra-small photorelays with the addition of four products: the TLP3417, LP3420, TLP3440 and TLP3475. The new products are suited for system solutions in various applications, including semiconductor testers, measurement equipment, probe cards and medical equipment. The new products are housed in the smallest package for photorelays, the Toshiba-developed VSON4 package. The VSON4 package enables high-density assembly and, by replacing USOP4 packages, can shrink the assembly area by 50% and the assembly volume by 60%. The TLP3440 has improved leakage characteristics against high frequency at off-state, while the TLP3475 has improved high speed signal transmission characteristics at on-state. For high voltage measurement requirements, including SoC testing, the TLP3417 supports 80V, while the TLP3420 supports 100V. The new products have the same electrical characteristics as the conventional Toshiba USOP4 series products, making it easier to evaluate them as replacement products. All devices achieve 3mA (max) trigger LED currents and 300Vrms (min) isolation voltages.
eInfochips and Toshiba America Electronic Components, Inc. Unveil Development Kits to Accelerate Development of Google Project Ara Modular Smartphones
Jan 14 15
eInfochips and Toshiba America Electronic Components, Inc. unveiled the ARTOS12 Development Kit at the Project Ara Module Developers Conference 2015. Devices on Google Project Ara specifications are expected to transform the smartphone experience. Ara modular smartphone users will be able to pick the camera they like, rather than picking a phone for its camera. They could add a sensor to test if water is clean. They could have a battery that lasts for days. They could have a louder speaker, gaming console, or use the smartphone as their car key. The possibilities are endless. To enable modular smartphones, eInfochips and TAEC offer the ARTOS12 Google Ara Development Kit for the 1x2 Module that uses Toshiba bridge chip technology and eInfochips engineering services.
Toshiba America Electronic Components, Inc. Introduces Newest IC Enabling Wireless Mobile Device Charging
Jan 9 15
Toshiba America Electronic Components, Inc. introduced its newest IC enabling wireless mobile device charging. The TC7765WBG wireless power receiver controller IC effectively manages the 12-watt power transfer necessary for wireless charging of tablet devices. Compatible with the Qi low-power specification version 1.1 defined by the Wireless Power Consortium (WPC), the new IC delivers a user experience comparable to that of conventional wired charging for tablets, as well as smartphones and other portable devices. TAEC will demonstrate the new receiver IC this week at CES 2015 in Las Vegas, Nevada. ABI Research(1) forecasts that the installed base of mobile devices - tablets, smartphones, wearables, notebooks and basic mobile phones - will reach 8 billion by 2019. This will, in turn, create a huge installed base for rechargeable batteries and charging solutions, including wireless solutions enabled by the Toshiba controller IC portfolio. The TC7765WBG wireless power receiver controller IC is built with Toshiba's mixed-signal process using a high-performance MOSFET design that maximizes power efficiency and thermal performance. The IC combines modulation and control circuitry with a rectifier power pickup, I(2)C interface and circuit protection functions. Compliance with the "Foreign Object Detection" (FOD) aspect of the Qi specification prevents heating of any metal objects in the path of wireless power transfer between the receiver and the transmitter.
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