Company Overview of Interuniversity MicroElectronics Center
Interuniversity MicroElectronics Center (IMEC) is a research and development center that offers microelectronics and nano-technology research solutions. The company focuses on new chips production processes; microsystems and new electronic components; development of solar cells and plastic electronics; and new packaging technologies. It also offers training through microelectronics training center. IMEC was founded in 1984 and is headquartered in Leuven, Belgium. It also has representatives in the US, China and Japan. Interuniversity MicroElectronics Center operates as a subsidiary of IMEC International.
Founded in 1984
Key Executives for Interuniversity MicroElectronics Center
Chief Operating Officer and Executive Vice President
Compensation as of Fiscal Year 2014.
Interuniversity MicroElectronics Center Key Developments
JSR Corporation to Form Joint Venture with IMEC
May 12 15
JSR Corporation has signed a letter of intent (LOI) to form a joint venture (JV) with IMEC to manufacture and quality control of EUV lithography materials for the semiconductor industry.
Synopsys, Inc. and Imec Expand TCAD Collaboration to 5 nm and Beyond
Dec 16 14
Synopsys Inc. announced the expansion of its collaboration with nanoelectronics research center imec to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond. The agreement enables Synopsys to deliver accurate, process-calibrated models for its Sentaurus™ TCAD (technology computer aided design) tools to semiconductor manufacturers for use during 5-nm technology node research and development. This latest agreement between imec and Synopsys follows successfully completed collaborations on FinFET and 3D-IC technologies for the 10-nm and 7-nm technology nodes. Working closely together, the joint Synopsys-imec team is investigating, among other topics, a vertical nanowire-nanosheet hybrid SRAM cell to target 5-nm technology. Early studies show the benefits of nanowire-nanosheet technology in density and performance compared to conventional FinFETs and lateral nanowires.
Imec Partners with Huawei on High-Bandwidth Optical Data Link Technology
Dec 4 14
imec and Huawei announced that they have taken a further step in their strategic partnership focusing on optical data link technology. The joint research on silicon-based optical interconnects is expected to deliver benefits including high speed, low power consumption and cost savings. Silicon photonics is a key enabling technology expected to revolutionise optical communications by paving the way for the creation of highly integrated, low power optical transceivers used for data transmission and telecommunications. Huawei has now joined imec's research programme which focuses on optimising bandwidth density, power consumption, thermal robustness and cost at the system level. Huawei engineers will work closely with imec's R&D team in Leuven, Belgium, with a view to achieving technological progress in this vital area for delivering connectivity matching the needs of the Europe.
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