Company Overview of Interuniversity MicroElectronics Center
Interuniversity MicroElectronics Center (IMEC) is a research and development center that offers microelectronics and nano-technology research solutions. The company focuses on new chips production processes; microsystems and new electronic components; development of solar cells and plastic electronics; and new packaging technologies. It also offers training through microelectronics training center. IMEC was founded in 1984 and is headquartered in Leuven, Belgium. It also has representatives in the US, China and Japan. Interuniversity MicroElectronics Center operates as a subsidiary of IMEC International.
Founded in 1984
Key Executives for Interuniversity MicroElectronics Center
Chief Operating Officer and Executive Vice President
Compensation as of Fiscal Year 2014.
Interuniversity MicroElectronics Center Key Developments
Synopsys, Inc. and Imec Expand TCAD Collaboration to 5 nm and Beyond
Dec 16 14
Synopsys Inc. announced the expansion of its collaboration with nanoelectronics research center imec to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond. The agreement enables Synopsys to deliver accurate, process-calibrated models for its Sentaurus™ TCAD (technology computer aided design) tools to semiconductor manufacturers for use during 5-nm technology node research and development. This latest agreement between imec and Synopsys follows successfully completed collaborations on FinFET and 3D-IC technologies for the 10-nm and 7-nm technology nodes. Working closely together, the joint Synopsys-imec team is investigating, among other topics, a vertical nanowire-nanosheet hybrid SRAM cell to target 5-nm technology. Early studies show the benefits of nanowire-nanosheet technology in density and performance compared to conventional FinFETs and lateral nanowires.
Imec Partners with Huawei on High-Bandwidth Optical Data Link Technology
Dec 4 14
imec and Huawei announced that they have taken a further step in their strategic partnership focusing on optical data link technology. The joint research on silicon-based optical interconnects is expected to deliver benefits including high speed, low power consumption and cost savings. Silicon photonics is a key enabling technology expected to revolutionise optical communications by paving the way for the creation of highly integrated, low power optical transceivers used for data transmission and telecommunications. Huawei has now joined imec's research programme which focuses on optimising bandwidth density, power consumption, thermal robustness and cost at the system level. Huawei engineers will work closely with imec's R&D team in Leuven, Belgium, with a view to achieving technological progress in this vital area for delivering connectivity matching the needs of the Europe.
Cartamundi NV, Holst Centre, and Imec Join Forces to Create Near Field Communication Chip of the Future
Nov 19 14
Cartamundi NV announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags. Partners will be Holst Centre, set up by the Belgian nanoelectronics research center imec, and the Dutch research institute TNO. All partners will develop new NFC tags using metal-oxide (IGZO) thin-film transistor (TFT) technology on plastic film. The flexible chips will be integrated into game cards as a part of Cartamundi’s larger strategy of developing game cards for the connected generation. Holst Centre, imec and Cartamundi engineers will look into NFC circuit design and TFT processing options, and will investigate routes for up-scaling of the production. By realizing the NFC tags using chips based on IGZO TFT technology on plastic film, the manufacturing cost can be kept low. Moreover, the ultra-thin and flexible form factor required for paper-embedded NFC applications can be realized. Currently, Cartamundi NV embeds silicon-based NFC chips in their game cards, connecting traditional game play with electronic devices such as smartphones and tablets. The advanced IGZO TFT technology that will be used addresses the game card industry call for much thinner, more flexible and virtually unbreakable NFC chips. Such chips are essential to improve and broaden the applicability of interactive technology for game cards, compared to the currently-used silicon based NFC chips. Next to technical specifications, this next-generation of NFC tags will better balance manufacturing cost and additional functionalities.
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