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February 11, 2016 4:43 AM ET

Professional Services

Company Overview of Interuniversity MicroElectronics Center

Company Overview

Interuniversity MicroElectronics Center (IMEC) is a research and development center that offers microelectronics and nano-technology research solutions. The company focuses on new chips production processes; microsystems and new electronic components; development of solar cells and plastic electronics; and new packaging technologies. It also offers training through microelectronics training center. IMEC was founded in 1984 and is headquartered in Leuven, Belgium. It also has representatives in the US, China and Japan. Interuniversity MicroElectronics Center operates as a subsidiary of IMEC International.

Kapeldreef 75

Leuven,  3001

Belgium

Founded in 1984

Phone:

32 1 628 12 11

Fax:

32 1 622 94 00

Key Executives for Interuniversity MicroElectronics Center

Chief Executive Officer
Age: 69
Chief Financial Officer
Chief Operating Officer and Executive Vice President
Executive Vice President
Compensation as of Fiscal Year 2015.

Interuniversity MicroElectronics Center Key Developments

imec Presents at SEMI South America Semiconductor Strategy Summit, Nov-12-2015 10:45 AM

imec Presents at SEMI South America Semiconductor Strategy Summit, Nov-12-2015 10:45 AM. Venue: Sheraton Rio Hotel and Resort, Rio de Janeiro, Brazil. Speakers: Cor Claeys, Director Business Growth & Emerging Markets.

Imec and Cadence Design Systems Complete Tapeout of First 5nm Test Chip

Imec and Cadence Design Systems Inc. announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as well as 193 immersion (193i) lithography. To produce this test chip, imec and Cadence optimized design rules, libraries and place-and-route technology to obtain optimal power, performance and area (PPA) scaling via Cadence Innovus Implementation System. Using a processor design, imec and Cadence successfully taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning (SAQP) for 193i lithography, where metal pitches were scaled from the nominal 32nm pitch down to 24nm to push the limit of patterning. The Innovus Implementation System is a next-generation physical implementation solution that enables system-on-chip (SoC) developers to deliver designs with best-in-class PPA while accelerating time to market. Driven by a massively parallel architecture with breakthrough optimization technologies, the Innovus Implementation System provides typically 10% to 20% better PPA and up to 10X full-flow speedup and capacity gain.

Semiconductor Manufacturing International Corp., Huawei, imec, and Qualcomm Global Trading Pte. Ltd. to Announces Joint Investment on SMIC's New Research and Development Company

Semiconductor Manufacturing International Corp. Huawei, imec and Qualcomm Global Trading Pte. Ltd., to announced the formation of SMIC Advanced Technology Research & Development (Shanghai) Corporation, an equity joint venture company. The joint venture company will focus on R&D towards next generation CMOS logic technology and build China's most advanced integrated circuit (IC) development R&D platform. SMIC Advanced Technology R&D (Shanghai) Corporation will be majority owned by SMIC, while Huawei, imec, and Qualcomm will be minority shareholders. The current focus will be on developing 14nm logic technology. Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC will be the legal representative, Dr. Yu Shaofeng, Vice President of SMIC will be the general manager. This project is a major breakthrough in the cooperation model for IC manufacturers, international trade companies and research institutions. This project will facilitate closer cooperation between upstream and downstream companies, R&D, and other synergies in the industry's global eco-system. With the joint venture company oriented on innovation, it can target the demands of the industry more quickly and effectively through its R&D and manufacturing resources. Meanwhile, by enabling fabless semiconductor companies to join the development process as shareholders, the product development cycle can be shortened and the advanced process node tape out time can be accelerated. In the first phase, the joint venture company will develop 14 nanometer CMOS technology for mass production, which will be based on imec's knowhow in advanced semiconductor processing technology. The new R&D project will be done at SMIC's production line. SMIC will have the rights to license the required intellectual property rights on the mass production technologies of advanced nodes developed by the joint venture company, enabling these technologies to be applied to SMIC's current and future range of products and serve SMIC's business with other companies. This can improve the overall level of China's IC technologies, and is expected to facilitate the mass production of 16/14nm ICs in China by 2020, which is one of the goals set by the National IC Industry Development Outline. In the future, companies in China's IC manufacturing industry, universities and colleges, and research institutions will continue working together on this platform to further enhance the core competitiveness of the industry.

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