July 26, 2017 3:16 PM ET

Professional Services

Company Overview of Interuniversity MicroElectronics Center

Company Overview

Interuniversity MicroElectronics Center (IMEC) is a research and development center that offers microelectronics and nano-technology research solutions. The company focuses on new chips production processes; microsystems and new electronic components; development of solar cells and plastic electronics; and new packaging technologies. It also offers training through microelectronics training center. IMEC was founded in 1984 and is headquartered in Leuven, Belgium. It also has representatives in the US, China and Japan. Interuniversity MicroElectronics Center operates as a subsidiary of IMEC International.

Kapeldreef 75

Leuven,  3001

Belgium

Founded in 1984

Phone:

32 1 628 12 11

Fax:

32 1 622 94 00

Key Executives for Interuniversity MicroElectronics Center

Chief Executive Officer and President
Age: 57
Chief Financial Officer
Executive Vice President
Senior Vice President
Compensation as of Fiscal Year 2017.

Interuniversity MicroElectronics Center Key Developments

imec Presents at Sensors Expo & Conference, Jun-27-2017 11:00 AM

imec Presents at Sensors Expo & Conference, Jun-27-2017 11:00 AM. Venue: McEnery Convention Center, San Jose, California, United States. Speakers: Arye Lipman, Alliances Manager.

imec Presents at SEMICON West 2017, Jul-11-2017

imec Presents at SEMICON West 2017, Jul-11-2017 . Venue: San Francisco Marriott Marquis Hotel, room Foothill E, 2nd level, San Francisco, California, United States. Speakers: An Steegen, Executive Vice President.

imec and Synopsys Inc. Unveil an Interconnect Resistivity Model

imec, and Synopsys Inc. have unveiled an interconnect resistivity model to support the screening and selection of alternative interconnect metals and liner-barrier materials at the 7nm node and beyond. With the continued scaling of advanced process nodes, the impact of parasitic interconnect resistance on the switching delay of standard cells rises considerably. The new model developed through this collaboration enables the evaluation of interconnect material and process options through simulations in the early stages of technology development, when wafer data is not available, and in the process optimization and integration stages of technology development, where it reduces expensive and time-consuming wafer-based iterations.

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Recent Private Companies Transactions

Type
Date
Target
No transactions available in the past 12 months.
 

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