Semiconductors and Semiconductor Equipment
Company Overview of Toppan Photomasks, Inc.
Toppan Photomasks, Inc. provides micro imaging solutions worldwide. It develops and produces photomasks, a technology used in the manufacture of semiconductor and other microelectronic devices. The company’s photomasks are quartz or glass plates that contain precision images of integrated circuits and are used as masters by semiconductor manufacturers to optically transfer these images onto semiconductor wafers. The company, through its wholly owned subsidiary, BindKey Technologies, Inc., develops electronic design automation software that is used by integrated circuit (IC) design engineers to design an IC, which can then be transferred onto photomasks. Its customers include integrated devic...
131 Old Settlers Boulevard
Round Rock, TX 78664
Founded in 1985
Key Executives for Toppan Photomasks, Inc.
Chief Executive Officer, President and Director
Chief Financial Officer and Executive Vice President of Finance
Acting President of the Software Business Unit
Executive Vice President, Secretary and General Counsel
Chief Technology Officer and Executive Vice President
Compensation as of Fiscal Year 2016.
Toppan Photomasks, Inc. Key Developments
Toppan Photomasks, Inc. Approves Next Phase of Investment for its Recently Expanded Factory in Shanghai, China
Aug 10 16
Toppan Photomasks, Inc. (TPI) has announced the approval of the next phase of investment for its recently expanded factory in Shanghai, China operated under Toppan Photomasks Company Limited, Shanghai (TPCS). TPI's new USD 80 million investment in this factory further demonstrates Toppan's long-term commitment to its customers in China's rapidly growing semiconductor industry. This comes after the company's previous USD 20 million investment in the expansion of TPCS Shanghai II, which is now operational and ramping as the only available commercial mask shop with a full range of technology product offerings in China. The recent expansion of the Shanghai facility, a sub-class 1 clean room located in a new manufacturing facility adjacent to the company's existing operation, was constructed to allow for phased growth. The next phase of technology focus will be on 65-nm to 14-nm logic and advanced memory (DRAM and NAND) design features using industry standard equipment for proven capability and reliable supply. Upon completion of today's announced project, 40% of the clean room space will remain available for future expansion.
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