January 25, 2015 5:37 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Sonics, Inc.

Company Overview

Sonics, Inc. designs, develops, and delivers on-chip communication solutions for system-on-chips (SoC). The company offers interconnect solutions for the development of complex, multicore, and multi-subsystem SoCs; random access memory schedulers; MemMax AMP, a standalone memory scheduler that optimizes memory bandwidth/DRAM scheduling on-chip in a single IP block; and platform solutions for SoC designers and developers. It also provides components to enable debugging, performance tuning, and validation of the intellectual property cores, as well as offers memory subsystems. In addition, Sonics, Inc. offers Sonics Network for AMBA Protocol, a turn-key solution designed to streamline the on-c...

890 North McCarthy Boulevard

Suite 200

Milpitas, CA 95035

United States

Founded in 1996

78 Employees

Phone:

408-457-2800

Fax:

408-457-2899

Key Executives for Sonics, Inc.

Chairman
Age: 58
Senior Vice President of Development Programs
Chief Financial Officer and Principal Accounting Officer
Age: 54
Vice President of Marketing
Vice President of Strategic Programs
Compensation as of Fiscal Year 2014.

Sonics, Inc. Key Developments

Toshiba Selects Sonics, Inc. for New ApP Lite TZ2000 Series

Sonics, Inc. announced that long-time customer Toshiba has finished the system-on-chip (SoC) design using Sonics' on-chip network IP for its new TZ2100 group of application processors. The TZ2100 group of applications processors are the newest addition to Toshiba's ApP Lite TZ2000 series. With this group of ApP Lite devices, sound and image communications can be securely processed at high speeds, making them well-suited for applications such as smart appliances, industrial CPUs, panel-control systems, and machine-to-machine [M2M] communication modules. The relationship between Sonics and Toshiba spans more than 12 years of design success. Toshiba's design history using Sonics' NoCs covers SoCs for gaming, digital TV, mobile, and automotive applications, and with the recent introduction of the TZ2000 series, application processors. The company's designs have progressed significantly in terms of complexity (number of IP blocks integrated) and performance (clock speed and process nodes). In aggregate, Toshiba has shipped more than 200 million SoCs with Sonics' NoCs serving as the communication fabric for heterogeneous, multi-core integration.

Nexell Licenses Sonics, Inc.'s SonicsGN On-Chip Network to Integrate Customer-Specific Application Processor Design

Sonics, Inc. announced that Nexell has licensed SonicsGN and adopted the SonicsStudio Director development environment for creation of a customer-specific application processor design targeted to the digital consumer and communication systems market segments. The company plans to target its new application processor design, which includes the SonicsGN NoC, for manufacturing in Samsung’s 28nm low-power Gate First High-k Metal Gate (HKMG) foundry process technology. Nexell will use SonicsStudio Director as its SoC integration environment to drive design and verification within the Samsung EDA tool and manufacturing flows. SonicsGN is Sonics’ NoC product that provides the communication fabric speeds and scalability. Nexell is using SonicGN for its advanced NoC capabilities that enable rapid integration of the company’s heterogeneous, multi-core SoCs containing many power and timing domains. With SonicsStudio Director, Nexell designers of every level of experience are performing the steps necessary-from architectural exploration to RTL generation-to easily integrate IP blocks and configure an optimal network fabric for its complex SoCs. SonicsStudio Director streamlines interaction with widely adopted tools for SystemC and logic simulation, performance analysis, and includes support for logic synthesis, power partitioning, top-level chip assembly, and IP-XACT import and export.

Sonics, Inc. Appoints Randy Smith as Vice President of Marketing

Sonics, Inc. announced that Randy Smith has joined the company as its Vice President of Marketing. In his new role, Smith will support the full marketing and partnership objectives for Sonics’ NoC technology, including responsibility for corporate marketing, product marketing, and strategic involvement in customer relations and business development. Smith is also Sonics’ primary spokesperson leading its thought leadership campaign around the need for change in IC design methodology. Prior to moving to marketing, Smith was an EDA engineering pioneer at Hewlett-Packard, Trilogy Systems, and Tangent Systems (co-founder).

Similar Private Companies By Industry

Company Name Region
Zarlink Semiconductor V.N. Inc. United States
California Micro Devices Corporation United States
Emosyn LLC United States
MegaWatt Solar, Inc. United States
SolarBridge Technologies, Inc. United States

Recent Private Companies Transactions

Type
Date
Target
No transactions available in the past 12 months.
 

Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup

Most Searched Private Companies

Company Name Geographic Region
Bertelsmann AG Europe
Lawyers Committee for Civil Rights Under Law United States
NYC2012, Inc. United States
Rush University United States
Citizens Budget Commission United States

Sponsored Financial Commentaries

Sponsored Links

Report Data Issue

To contact Sonics, Inc., please visit www.sonicsinc.com. Company data is provided by Capital IQ. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at bwwebmaster@businessweek.com.