Semiconductors and Semiconductor Equipment
Company Overview of Sonics, Inc.
Sonics, Inc. designs, develops, commercializes, and supplies on-chip network (NoC) technology solutions for semiconductor and electronics product companies. It offers system IP solutions, which include security, power, and memory subsystems; development tools; performance analysis solutions; and topology structures for the network design. The company also provides SonicsLX (SLX), a NoC that provides systems-on-chip designers with the connectivity needed for CPUs and other processing engines to memory. Its products are used in smartphones, HDTV, digital cameras, PSPs, E-Books, sensors, automotive, microcontrollers, Wi-Fi, 4G/LTE, CPE/BS/Femto APs, routers, and other markets in the United Stat...
670 North McCarthy Boulevard
Milpitas, CA 95035
Founded in 1996
Key Executives for Sonics, Inc.
Chairman, Chief Executive Officer and President
Senior Vice President of Development Programs
Chief Financial Officer and Principal Accounting Officer
Senior Vice President of Operations
Vice President of Marketing
Compensation as of Fiscal Year 2014.
Sonics, Inc. Key Developments
Toshiba Selects Sonics, Inc. for New ApP Lite TZ2000 Series
Jan 13 15
Sonics, Inc. announced that long-time customer Toshiba has finished the system-on-chip (SoC) design using Sonics' on-chip network IP for its new TZ2100 group of application processors. The TZ2100 group of applications processors are the newest addition to Toshiba's ApP Lite TZ2000 series. With this group of ApP Lite devices, sound and image communications can be securely processed at high speeds, making them well-suited for applications such as smart appliances, industrial CPUs, panel-control systems, and machine-to-machine [M2M] communication modules. The relationship between Sonics and Toshiba spans more than 12 years of design success. Toshiba's design history using Sonics' NoCs covers SoCs for gaming, digital TV, mobile, and automotive applications, and with the recent introduction of the TZ2000 series, application processors. The company's designs have progressed significantly in terms of complexity (number of IP blocks integrated) and performance (clock speed and process nodes). In aggregate, Toshiba has shipped more than 200 million SoCs with Sonics' NoCs serving as the communication fabric for heterogeneous, multi-core integration.
Nexell Licenses Sonics, Inc.'s SonicsGN On-Chip Network to Integrate Customer-Specific Application Processor Design
Dec 18 14
Sonics, Inc. announced that Nexell has licensed SonicsGN and adopted the SonicsStudio Director development environment for creation of a customer-specific application processor design targeted to the digital consumer and communication systems market segments. The company plans to target its new application processor design, which includes the SonicsGN NoC, for manufacturing in Samsung’s 28nm low-power Gate First High-k Metal Gate (HKMG) foundry process technology. Nexell will use SonicsStudio Director as its SoC integration environment to drive design and verification within the Samsung EDA tool and manufacturing flows. SonicsGN is Sonics’ NoC product that provides the communication fabric speeds and scalability. Nexell is using SonicGN for its advanced NoC capabilities that enable rapid integration of the company’s heterogeneous, multi-core SoCs containing many power and timing domains. With SonicsStudio Director, Nexell designers of every level of experience are performing the steps necessary-from architectural exploration to RTL generation-to easily integrate IP blocks and configure an optimal network fabric for its complex SoCs. SonicsStudio Director streamlines interaction with widely adopted tools for SystemC and logic simulation, performance analysis, and includes support for logic synthesis, power partitioning, top-level chip assembly, and IP-XACT import and export.
Sonics, Inc. Appoints Randy Smith as Vice President of Marketing
Nov 12 14
Sonics, Inc. announced that Randy Smith has joined the company as its Vice President of Marketing. In his new role, Smith will support the full marketing and partnership objectives for Sonics’ NoC technology, including responsibility for corporate marketing, product marketing, and strategic involvement in customer relations and business development. Smith is also Sonics’ primary spokesperson leading its thought leadership campaign around the need for change in IC design methodology. Prior to moving to marketing, Smith was an EDA engineering pioneer at Hewlett-Packard, Trilogy Systems, and Tangent Systems (co-founder).
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