Bloomberg the Company & Products

Bloomberg Anywhere Login

Bloomberg

Connecting decision makers to a dynamic network of information, people and ideas, Bloomberg quickly and accurately delivers business and financial information, news and insight around the world.

Company

Financial Products

Enterprise Products

Media

Customer Support

  • Americas

    +1 212 318 2000

  • Europe, Middle East, & Africa

    +44 20 7330 7500

  • Asia Pacific

    +65 6212 1000

Communications

Industry Products

Media Services

Follow Us


May 22, 2015 5:11 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of SMART Modular Technologies (WWH), Inc.

Company Overview

SMART Modular Technologies (WWH), Inc. designs, manufactures, and supplies electronic subsystems to OEMs engaged in computer, industrial, networking, telecommunications, and aerospace and defense markets worldwide. The company’s products include DRAM memory flash-based storage modules; embedded flash-based products that comprise embedded USB, embedded SATA, iSATA, uSATA, and mini-IDE drives; and removable flash memory products. Its products are also used in various applications, including computing, gaming, HPC, printers, servers, and storage. SMART Modular Technologies (WWH), Inc. was formerly known as SMART Modular Technologies, Inc. and changed its name to SMART Modular Technologies (WWH)...

39870 Eureka Drive

Newark, CA 94560-4809

United States

Founded in 1988

1,223 Employees

Phone:

510-623-1231

Fax:

510-623-1434

Key Executives for SMART Modular Technologies (WWH), Inc.

Chief Executive Officer, President and Director
Age: 56
Chief Financial Officer, Chief Operating Officer and Senior Vice President
Age: 54
Senior Vice President of Emerging Markets and President of Smart Brazil
Senior Vice President and General Manager of Memory Business Unit
Age: 54
Chief Legal and Chief Compliance Officer and Vice President
Age: 59
Compensation as of Fiscal Year 2014.

SMART Modular Technologies (WWH), Inc. Key Developments

SMART Modular Technologies, Inc. Announces DDR4 Industrial Grade Modules

SMART Modular Technologies, Inc. announced the availability of its DDR4 industrial grade modules. As with all of SMART's products, quality is paramount and SMART applies its unique and stringent testing processes to insure each of its DDR4 industrial grade modules, operating at DDR4-2133 1.2V, can reliably operate at industrial grade temperatures (-40 degrees C to +85 degrees C). Customized test programs, test flows and specialized equipment are used to eliminate weak bits and DRAMs likely to fail under temperature stress. SMART's industrial grade modules are 100% system tested at high speeds starting with a cold boot at -40 degrees C and ramping to +85 degrees C ambient operation. Testing durations vary depending on the density of the module. High utilization custom testing software insures that all cells in the DRAMs are fully stressed through the complete temperature cycle. SMART's DDR4 industrial grade modules can be used with confidence in a wide variety of stringent applications including: Base stations and telecom equipment exposed to the elements; Single board computers used in industrial, defense, aerospace, kiosk, and digital signage applications; and Densely configured computing applications with limited airflow. SMART supports a variety of DDR4 industrial grade module types including SO-DIMMs up to 16GB, unbuffered and registered DIMMs up to 16GB and 32GB respectively, and Mini-DIMMs up to 16GB.

Smart Modular Technologies Announces Expansion of its NVDIMM Product Line with its New 8GB and 16GB DDR4 NVDIMMs

SMART Modular Technologies, Inc. announced the expansion of its NVDIMM product line with its new 8GB and 16GB DDR4 NVDIMMs available in a single rank, four bit configuration. SMART's full lineup of DDR4 NVDIMMs now include two configurations; a single rank eight bit configuration in 4GB and 8GB densities, and the new 8GB and 16GB options. The new NVDIMMs are targeted for server and storage applications to improve performance. NVDIMMs transform main DRAM memory into persistent memory resulting in higher performing servers by allowing big data, transaction logs, and other latency and performance-sensitive data to be accessed at DRAM speeds without the risk of data loss. Rather than reading and writing big data or transaction logs to traditional storage media such as SATA SSDs, PCIe NVMe SSDs, or HDDs, they can be written to and read from main memory without the risk of data being lost due to any sudden power loss (SPL) event. Server performance in terms of lower latency, higher IOPS, and greater endurance all increase dramatically with the use of SMART's NVDIMMs. SMART now supports a complete lineup of DDR4-2133 NVDIMMs ranging from 4GB to 16GB configured as 1-rank x8 and 1-rank x4. SMART's DDR4 NVDIMMs are targeted to support a wide range of industry standard and OEM server and storage platforms from Intel(r), Supermicro(r), Lenovo(r), HP(r) and others. NVDIMM industry adoption is being driven by JEDEC standardization and the growth of In-Memory Computing (IMC) where entire databases need to be loaded in main memory for real-time analytics. SMART is further entrenched in supporting DDR4 NVDIMM standardization with its work in coordination with JEDEC. Working closely with its customers over many years, SMART has developed and incorporated into its DDR4 NVDIMMs, SafeStor(TM) technology, a feature-rich, mature command and control register interface. SMART's DDR4 NVDIMMs also have an integrated DRAM and flash controller with end-to-end data integrity protection including internal CRC-32 and parity protection for FPGA SRAM. Backup power can be provided by the host system through a JEDEC-standard 12V power rail or by a tethered Backup Power Module (BMP). SMART provides several intelligent tethered BMP options including a 2.5" SSD form factor supercap module and several other hybrid solutions that are currently developed or in development.

SMART Modular Technologies, Inc. Announces Introduction of Second Generation eMMC Product Family

SMART Modular Technologies, Inc. announced the introduction of its second generation eMMC product family which includes the addition of a new 153-ball, 11.5mm x 13mm, 0.5mm pitch JEDEC standard BGA package form factor. SMART's portfolio of eMMC solutions target automotive and industrial embedded applications. The second generation eMMC spec. v4.51 compliant devices utilize the same controller and firmware code base as previous generation products while incorporating the latest technology node NAND die for cost competitiveness. Retaining the same controller and firmware enables customers to make an easy transition from previous generation eMMC. The new NAND die makes possible the smaller 153-ball package which has become the de facto industry standard 0.5mm pitch eMMC package. Also available in 100-ball, 14mm x 18mm, 1.0mm pitch BGA package, SMART's eMMC offerings include automotive-grade (-40 degrees C to +85 degrees C), industrial-temp (-40 degrees C to +85 degrees C) and extended-temp (-25 degrees C to +85 degrees C) versions in 8GB to 64GB capacities. 8GB, 16GB and 32GB eMMC devices support additional v5.01 features with the exception of the HS400 interface speed mode. SMART's eMMC products are manufactured in ISO-9001, ISO-14001 and TS-16949 certified facilities to the stringent requirements and certifications as mandated by automotive and industrial OEM's; such as AEC-Q100 compliance. SMART also adheres to PPAP BOM control and documentation requirements. NAND Flash memory adoption in the automotive and industrial embedded applications is increasing tremendously. SMART, with its Flash storage solutions, has a long tradition in helping system designers deal with NAND technology limitations by making the complexity of the underlying NAND Flash architecture invisible to the host system. As with the previous eMMC generation, the newly introduced eMMC is designed from the ground up to meet requirements of mission critical applications. Leveraging on this capability with the second generation eMMC, SMART will continue to drive easy eMMC adoption in the automotive and industrial application markets by mitigating NAND Flash technology scaling issues, reducing time to market and product longevity. In addition, with the 153-ball device heading up the second generation introduction, SMART is participating in industrial designs requiring a small form factor and solder down storage solution aligning to the miniaturization trend with System on Module and Single Board Computer. System designs can also benefit from additional features available in SMART's eMMC products such as: large boot partition size, configurable user area to pseudo-SLC mode, robust power loss protection and device health status reporting. SMART's new 153-ball eMMC products are available for sampling immediately, with volume production expected to begin in the second quarter of 2015.

Similar Private Companies By Industry

Company Name Region
VisionFlow, Inc. United States
Plasma-Therm, LLC United States
AdvancedIO Systems, Inc. United States
SEMES America Inc. United States
Semilab USA, LLC United States

Recent Private Companies Transactions

Type
Date
Target
No transactions available in the past 12 months.
 

Stock Quotes

Market data is delayed at least 15 minutes.

Company Lookup

Most Searched Private Companies

Company Name Geographic Region
Lawyers Committee for Civil Rights Under Law United States
Bertelsmann AG Europe
NYC2012, Inc. United States
Rush University United States
Citizens Budget Commission United States

Sponsored Financial Commentaries

Sponsored Links

Report Data Issue

To contact SMART Modular Technologies (WWH), Inc., please visit www.smartm.com. Company data is provided by Capital IQ. Please use this form to report any data issues.

Please enter your information in the following field(s):
Update Needed*

All data changes require verification from public sources. Please include the correct value or values and a source where we can verify.

Your requested update has been submitted

Our data partners will research the update request and update the information on this page if necessary. Research and follow-up could take several weeks. If you have questions, you can contact them at bwwebmaster@businessweek.com.