Electronic Equipment, Instruments and Components
Company Overview of Teledyne LeCroy, Inc.
Teledyne LeCroy, Inc., together with its subsidiaries, develops, manufactures, sells, and licenses oscilloscopes and communication protocol analyzers in the Americas, Europe, the Middle East, and the Asia Pacific. Its oscilloscopes are tools used by designers and engineers to measure and analyze electronic signals; and protocol analyzers are used to monitor communications traffic and diagnose operational problems in various communications devices. The company offers seven families of oscilloscopes comprising WaveExpert, a line of sampling oscilloscopes and modules; WaveMaster, a high performance oscilloscope product family; WavePro for the mid-to high-performance sector; WaveRunner for the m...
700 Chestnut Ridge Road
Chestnut Ridge, NY 10977-6499
Founded in 1964
Key Executives for Teledyne LeCroy, Inc.
Chief Executive Officer, President and Director
Founder and Honarary Chairman
Chief Financial Officer, Principal Accounting Officer, Vice President and Treasurer
Chief Technology Officer and Vice President
Chief Information Officer and Vice President
Compensation as of Fiscal Year 2015.
Teledyne LeCroy, Inc. Key Developments
Teledyne LeCroy Releases Power Delivery Compliance Suite
Jan 21 16
Teledyne LeCroy has announced the release of the Power Delivery Compliance Suite for the Voyager M310C SuperSpeed USB 3.1 protocol verification platform. Based on the Power Delivery (PD) Compliance Plan v1.0, this automated test suite, allows developers to verify functionality, error recovery, and compliance for PD chipsets and end-products. Integrated in Teledyne LeCroy's Voyager M310C USB 3.1 test platform, the Power Delivery Compliance Suite utilizes emulation scripts to mimic PD link partner behaviors. The system initiates and responds to PD messages while analyzing the real response from the device-under-test. It communicates directly over Type-C cabling and generates pass/fail reports to provide a fully automated test suite for Power Delivery protocol. Built on the same open architecture as Teledyne LeCroy's USB 3.1 Link Layer test suite, the PD Compliance Suite includes full source code for all PD test cases. This provides developers with a comprehensive library of test scripts that can be easily re-purposed for custom test development. The Power Delivery Compliance Suite addresses chapter 5 physical layer, chapter 6 protocol layer, and chapter 7 power supply test cases from the USB Power Delivery 2.0 Specification. As the test specifications are updated for Power Delivery 3.0, any software updates will be provided at no cost to PD Compliance Suite end-users. The first protocol analyzer solution to feature native USB Type-C connectors, the Voyager M310C combined with the Power Delivery Compliance Suite can test PD enabled electronic markers as well as full-featured PD chipset implementations. The exerciser can emulate a full 100 Watt source or 100 Watt sink (with added programmable load). It can precisely direct devices into PD role swap and alternate mode behaviors. The system provides real-time voltage and power monitoring to provide continuous VBUS measurements for verifying power transitions and timing. USB Protocol Suite Version 7.26 is also now released for the Voyager M310C system. This release adds support for numerous Power Delivery enhancements including ability to inject and trigger on errors in PD message frames. To simplify Power Delivery debug, this release automatically reports PD errors in the Traffic Summary; and provides a new real-time PD Status View showing state transitions on the USB Type-C Communication Channel.
Teledyne LeCroy Introduces HDA125 High-Speed Digital Analyzer
Jan 20 16
Teledyne LeCroy significantly expands the capabilities of its oscilloscopes with the introduction of the HDA125 High-speed Digital Analyzer. The HDA125 digital acquisition system captures 18 channels of digital data at 12.5 GS/s. Adding it to Teledyne LeCroy oscilloscopes by means of the LBUS interface architecture results in the most flexible, highest-performance mixed-signal solution available. Also announced is the QuickLink probing system, featuring low-cost, high-fidelity probe tips that work with both the HDA125 and Teledyne LeCroy WaveLink probes using the new Dxx30-QL QuickLink adapter. The HDA125 samples 18 input signals at 80 ps intervals (12.5 GS/s) for accurate characterization of the fast signals. However, sample rate is only half the story - high-speed embedded systems testing often poses challenging signal amplitude conditions. The High-speed Digital Analyzer meets these challenges with a 3-GHz digital leadset, ultra-low probe loading, and sensitivity (150 mV minimum signal swing). The system ensures the most precise digital signal interpretation with a unique hysteresis adjustment capability, and three times better threshold accuracy than competing mixed-signal instruments. The QuickLink probe tip system is designed from the ground up to be compatible with both the HDA125 High-speed Digital Analyzer and with Teledyne LeCroy's WaveLink series of differential analog probes. This cross-connection capability allows a device under test (DUT) to be equipped with QuickLink Solder-In (QL-SI) tips at all desired test points, enabling swapping of connections between digital and analog acquisition systems as needed. The HDA125 is available in two models. The HDA125-18-LBUS is supplied with a full 18-channel leadset (including 18 QL-SI probe tips), and is priced at $20,900. For applications requiring fewer channels, the HDA125-09-LBUS is supplied with a 9-channel leadset (including 9 QL-SI probe tips), and is priced at $17,900. The HDA125 will initially be compatible with WaveMaster, SDA, and DDA 8Zi series oscilloscopes; compatibility with other instruments will follow. The Dxx30-QL connects QL-SI probe tips to Dxx30 8-13 GHz WaveLink differential probe series and is priced at $850. A QuickLink starter pack, the Dxx30-QL-3SI, is priced at $1,390 and consists of one Dxx30-QL adapter and three QL-SI tips. Support for the QL-SI tip on 4-6 GHz WaveLink differential probes will be added in the spring of 2016.
Teledyne LeCroy Announces New PCIe External Cable 3.0 Interposer and Adapter
Jan 19 16
Teledyne LeCroy announced the availability of an interposer probe for analysis of PCIe External Cable 3.0 ports that utilize the new PCI Express External Cabling Specification Revision 3.0, developed by the PCI-SIG. The PCIe External Cable 3.0 Interposer, which is used with Summit Protocol Analyzers, enables PCIe bus traffic between a system board and storage devices using PCIe External Cable 3.0 cables to be monitored, captured and recorded for protocol analysis. The PCIe External Cable 3.0 interposer will support analysis for PCIe host interfaces such as SATA Express (AHCI/PCIe) and NVM Express (NVMe) at data rates from 2.5 GT/s up to 8 GT/s, and link widths from x1 to x8. For x16 link widths two PCIe External Cable 3.0 interposers can be used together with two synced protocol analyzers to show all transaction data. The new PCIe External Cable 3.0 class cables are becoming the new standard for external cables for storage and enterprise systems. This cable type is defined in the PCI Express External Cabling Specification Revision 3.0, developed by the PCI-SIG. One cable can manage link widths from x1 to x4. Larger link widths can be achieved by adding additional cables. For example, a x8 link combines two x4 links. The technology supports PCIe 3.0 speeds, enabling high I/O throughput while providing the necessary cable management demanded by next generation systems. This cable also uses the Cable Management Interface (CMI) which is important to storage systems because it allows in-band host software to communicate with an NVM subsystem through sideband signaling to provide out-of-band control and monitoring of device specifics. The PCI Express External Cabling Specification 3.0 uses an I2C interface to enable: discovery of the cabling characteristics, allow passage of sideband signals such as PERST# and WAKE#, and to enable future functionality such as NVME-MI, the Non-Volatile Memory Management Interface. The PCIe External Cable 3.0 Cable Interposer supports I2C side band signaling by passing it electrically through the link. The sideband signaling PERST# and WAKE# and other functionality can be monitored by the protocol analyzer through the interposer, where protocol issues and performance metrics can be analyzed and debugged. RefCLK# signals external to the cable are available on the PCIe External Cable 3.0 interposer for use with the protocol analyzer. In addition to the new interposer, an adapter is also available for testing devices that use the SFF-8644 connector with PCIe External Cable 3.0 class cables. The adapter is a PCIe half-width CEM form factor plug-in card that allows connection of a PCIe External Cable 3.0 device to a standard PCIe slot. The adapter supports x1 to x16 link widths (using up to four PCIe External Cable 3.0 class cables) at speeds up to 8 GT/s. In 2010, Teledyne LeCroy was the first company to introduce a PCI Express protocol analyzer supporting NVM Express (NVMe), a new PCI Express storage decoding standard. Since that time Teledyne LeCroy has added decoding for both SCSI Express (SOP/PQI) and SATA Express (AHCI/PCIe), and also specific probing for SFF-8639 connector-based storage system and devices. Integrating all three PCIe SSD technologies into a single protocol analyzer and adding targeted storage probing solutions gives developers versatile tools that can show essential details regarding proper data transmission and bus performance. These tools have been critical for much of the PCIe SSD interoperability testing that has occurred over the last few years. The PCIe External Cable 3.0 Interposer and PCIe External Cable 3.0 Adapter are each available to order now.
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