March 01, 2015 2:22 PM ET

Electronic Equipment, Instruments and Components

Company Overview of Hypres, Inc.

Company Overview

Hypres, Inc., a superconducting electronics company, engages in the design, development, fabrication, testing, and packaging of superconducting microelectronics, including superconducting integrated circuits for metrology laboratories, and government and commercial markets worldwide. It offers cryogenic analog RF modules, integrated cryogenic electronics test-beds, primary voltage standard Josephson junction arrays, primary voltage standard cryocooler (closed-cycle refrigerator) systems, primary voltage standard liquid helium systems, digital-RF receivers, multi-channel programmable current sources, digital amplifier modules, wide band amplifiers, and shield degaussers. The company was found...

175 Clearbrook Road

Elmsford

New York, NY 10523

United States

Founded in 1983

Phone:

914-592-1190

Fax:

914-347-2239

Key Executives for Hypres, Inc.

Chief Executive Officer, President and Director
Chief Financial Officer
Age: 66
Chief Technology Officer and Senior Executive Vice President
Executive Vice President of RF Circuits & Systems
Vice President of Engineering
Compensation as of Fiscal Year 2014.

Hypres, Inc. Key Developments

Hypres Inc. Wins $1.25 Million Federal Contract

Hypres Inc. won a $1,249,700 federal contract from the U.S. Space and Naval Warfare Systems Command, San Diego, for research and development.

Hypres Announces Commercial Availability of New Chip Fabrication Process for Next Generation Superconducting Electronics Circuits

Hypres, Inc. announced the commercial availability of its newest six-layer planarized chip fabrication process. This new process increases the integration level of superconducting ICs and critical current density of Josephson junctions, making it ideal for customers developing high performance, energy efficient solutions for high-end computing, advanced wireless communications and instrumentation. The six-layer fabrication process, developed over several years, features many new processes and techniques included in provisional patent application Rapid Integrated Planarized Process for Layer Extension (RIPPLE). This new optimized process was offered to customers after the completion and thorough evaluation of several internal design iterations and successful production of working circuits. HYPRES' new fabrication process is open and available for broad commercial use.

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