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April 25, 2015 3:50 AM ET

Electronic Equipment, Instruments and Components

Company Overview of Sensata Technologies, Inc.

Company Overview

Sensata Technologies, Inc. designs, manufactures, and distributes sensors and controls. It offers airflow, analytical, pressure, and automotive sensors, as well as automotive switches; and control and protection products, such as battery protection, circuit breakers and protectors, motor controls and protection, semiconductor burn-in test sockets, solar controls and protection, switches, thermal controls, and thermostats. The company also provides DC to AC power converters, and ground fault circuit interrupters and equipment leakage circuit interrupters. It serves aircraft and military, automotive, electronics, HVAC/R and appliance, heavy vehicle and off-road, industrial, motors and rotating...

529 Pleasant Street

P.O. Box 2964

Attleboro, MA 02703-0964

United States

Founded in 2006





Key Executives for Sensata Technologies, Inc.

Chief Executive Officer, President and Director
Age: 57
Executive Chairman
Age: 64
Chief Financial Officer and Executive Vice President
Age: 48
Chief Operating Officer, Executive Vice President and Executive Director
Age: 47
Chief Accounting Officer and Vice President
Age: 50
Compensation as of Fiscal Year 2014.

Sensata Technologies, Inc. Key Developments

Sensata Technologies Prices an Offering of $700 Million in Aggregate Principal Amount of 5.00% Senior Notes Due 2025

Sensata Technologies Holding reported that its indirect subsidiary, Sensata Technologies has priced an offering of $700 million in aggregate principal amount of 5.00% senior notes due 2025. The company said that the notes will be issued at par and are being offered in a private offering that is exempt from registration under the Securities Act of 1933, as amended. The notes will be guaranteed on a senior unsecured basis by substantially all of the issuer’s existing and future wholly-owned subsidiaries that guarantee the Issuer’s senior secured credit facilities. The notes and the guarantees will be the issuer’s and the guarantors' senior unsecured obligations and will rank equally in right of payment to all existing and future senior indebtedness of the Issuer or the guarantors, including the issuer’s 4.875% senior notes due 2023 and 5.625% senior notes due 2024. The notes and the guarantees will be senior to all of the issuer’s and the guarantors' future indebtedness that is expressly subordinated to the notes and the guarantees. The notes and the guarantees will be effectively junior to the issuer’s and the guarantors' secured indebtedness to the extent of the assets securing that indebtedness, including obligations under the issuer’s senior secured credit facilities, and will be structurally subordinated to all of the existing and future obligations of any of the issuer’s subsidiaries that do not guarantee the notes. Sensata intends to use the net proceeds from the offering of the notes together with cash on hand to (1) purchase any and all of the issuer’s $700 million 6.5% senior notes due 2019 that are validly tendered (and not validly withdrawn), in the tender offer for the 6.5% notes that Sensata commenced, (2) pay all accrued interest on the 6.5% notes and (3) pay all fees and expenses in connection with the sale of the notes and the tender offer.

Chip Packaging Solutions LLC Enters into Settlement and License Agreement with Texas Instruments, Inc

Acacia Research Corporation announced that its Chip Packaging Solutions LLC has entered into a settlement and license agreement with Texas Instruments, Inc. This agreement resolves patent litigation that was pending in the United States District Court for the Central District of California.

Sensata Technologies, Inc. Presents at Barclay's High Yield Bond and Syndicated Loan Conference, May-21-2013 08:10 AM

Sensata Technologies, Inc. Presents at Barclay's High Yield Bond and Syndicated Loan Conference, May-21-2013 08:10 AM. Venue: JW Marriott Chicago, 151 W. Adams Street, Chicago, Illinois, United States. Speakers: Jacob Sayer, VP Investor Relations & Global Communications.

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