Company Overview of Neoconix, Inc.
Neoconix, Inc. engages in the development, manufacture, and supply of electrical connectors and interconnects. The company offers board-to-board, flex-to-board, device-to-board, and multi-layer interposers; and LGA sockets, embedded contacts, and custom products. Its products and technologies are used in various electronics markets, including computing, military, mobile electronics, telecommunications, and test equipment. The company offers its product through sales representatives in the United States and Canada. Neoconix, Inc. was formerly known as Epic Technology, Inc. and changed its name to Neoconix, Inc. in December 2004. The company was founded in 2002 and is headquartered in Sunnyval...
715 North Pastoria Avenue
Sunnyvale, CA 94085
Founded in 2002
Key Executives for Neoconix, Inc.
President, Chief Operating Officer and Director
Senior Director of Product Marketing
Intellectual Property Counsel
Compensation as of Fiscal Year 2015.
Neoconix, Inc. Key Developments
Neoconix Announces the Availability of its Innovative USB 3.1 X-Beam Bridge Connector Solution
Dec 2 15
Neoconix announced the availability of its innovative USB 3.1 X-Beam Bridge connector solution. As the newest member of the FPConnectedTM family, the product features superior signal integrity, repairability, and cost savings for mobile platforms. Featuring a seamlessly integrated jumper and connector assembly, the USB 3.1 X-Beam Bridge includes an ultra-low profile USB3.1 Type C receptacle, a high speed FPC (Flexible Printed Circuit), and a low profile X-Beam FPC-to-Board interposer. The USB 3.1 X-Beam Bridge provides mobile designers and manufacturers with the ideal solution to reliably and rapidly implement their next generation high speed platforms and is available in a variety of length options for design flexibility. The product can be independently mounted thereby eliminating the costly and time consuming manufacturing issues associated with main PCB (printed circuit board) mounting. Designers can now directly route signals which minimizes the required shielding, PCB layers, copper thickness, thermal considerations, and circuit protection necessary if utilizing the main PCB. The USB 3.1 X-Beam Bridge delivers improved signal integrity versus standard board to board or traditional FPC connectors. Additionally, repair ability is simplified since it's easier to remove or replace the assembly. Neoconix is also in the process of developing USB 3.1 Modular Assemblies by leveraging its unique PCBeam technology.
Neoconix, Samtec Renew Technology License Agreement
Aug 31 15
Neoconix, Inc. announced that Samtec, Inc. has renewed their Neoconix PCBeam(TM) technology license agreement to continue their dual source arrangement on the Samtec Z-Ray(R) product line. This dual source arrangement allows Samtec to support new customers with an additional variety of fine pitch, high density array products including board-to-board and high speed interposers.
Neoconix Releases New Low-Profile X-Beam Electrical Connector Family
Jun 8 15
Neoconix announced immediate availability of its new X-Beam family of electrical connectors. Featuring an ultra-low-profile form factor and a simplified SMT assembly process, the X-Beam product family is the latest Neoconix offering specifically developed for mobile and communications applications. Key electrical capabilities include high current capacity (up to 12 amps) in combination with excellent high-speed signal capabilities (up to 20 Gbps). The first set of products within this family, X-Beam Mobile FPC Battery Products, is comprised of three part numbers (XBM-G016A, XBM-G028A, XBM-D048A). With up to 12 amps of current carrying capacity and four additional signal contacts for temperature and over voltage sensing, these connectors are capable of supporting even the most demanding mobile applications. This power-performance is achieved in a total height of approximately 1.0mm and PCB area of less than 80mm2. The X-Beam technology also offers the ability to have either internally ganged of discrete contacts. Internal ganging is connecting all the positive (+) contacts together and the negative (-) contacts together within the connector. The redundancy lowers the terminal resistance to less than 3 milliohms to reduce temperature rise and improve battery life. An X-Beam product with discrete contacts in a battery application will rely on contact redundancy on the corresponding FPC contact pads, but adds versatility in combining power and high speed signaling within the same connector.
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