Semiconductors and Semiconductor Equipment
Company Overview of Isola Group Ltd.
Isola Group Ltd., a material sciences company, engages in the design, development, manufacture, and sale of copper-clad laminates and dielectric prepregs used to fabricate multilayer printed circuit boards. Its material-based printed circuit boards provide physical platforms for semiconductors, passive components, and connection circuitry that power and control various types of electronic products, including computers, networking and communications equipment, and high-end consumer electronics, as well as products designed for use in automotive, aerospace, military, and medical markets. It also offers RF/microwave/high-speed material for applications, such as power amplifier boards for 4G LTE...
3100 West Ray Road
Chandler, AZ 85226
Founded in 1912
Key Executives for Isola Group Ltd.
Interim Chief Executive Officer and Director
Interim Chief Financial Officer and Director
Global Supply Chain Officer and President of Asia
Compensation as of Fiscal Year 2015.
Isola Group Ltd. Key Developments
Isola Group Announces Management Changes
Jun 15 15
Isola Group announced the decision of its current President and Chief Executive Officer Ray Sharpe to retire. Mr. Sharpe will stay with Isola until his successor has joined to ensure a smooth transition. Separately, the company announced the retirement of its Executive Vice-President and Chief Financial Officer, F. Gordon Bitter. Mr. Donald Colvin, a member of Isola's board of directors and the former Chief Financial Officer of ON Semiconductor and Caesars Entertainment, has been named as interim Chief Financial Officer.
Isola Expands its Portfolio of Halogen-Free Materials for High-End Mobile Applications
May 11 15
Isola Group announced the introduction of IS350MD that expands its portfolio of halogen-free laminates and prepregs for high-end mobile applications. IS350MD fits nicely between Isola's well-established standard dielectric constant (Dk) material, DE156, and the company's ultralow Dk material, IS300MD, which was introduced in 2014 and quickly gained momentum in the High Density Interconnect (HDI) market. The demand for faster processing and more efficient designs in smartphones and tablets is driving the need for thinner, more powerful PCBs. These thin PCBs require low-Dk laminate materials to meet the impedance requirements of these advanced designs. IS350MD with a Dk of 3.51 was engineered specifically for these types of ultrathin dielectric applications. IS350MD is an FR-4 type base material with a resin matrix; it is based on a modified epoxy resin reinforced with conventional E-glass fabric. The requirements of flammability class V-0 per UL-94 are met without the addition of antimony compounds. As the IS350MD material does not contain halogens, it displays greater thermal stability than a standard FR-4, as demonstrated in its Time to Delamination (T288) measurements.
Isola Group Announces the Introduction of Chronon to Mitigate Skew in High-Speed Electronic Designs
Feb 24 15
Isola Group announced the introduction of Chronon(TM), the company's latest ultra-low loss, high-speed laminate and prepreg materials engineered to mitigate skew issues in high-speed designs that have differential pairs. The introduction of Chronon expands the company's portfolio of PCB materials to mitigate skew in high-speed designs. Independent testing has confirmed the ability of Chronon materials to reduce weave-induced skew. Skew caused by the glass-weave effect can be as high as 130 picoseconds when trace lengths exceed 20 inches. Using test vehicles from Speeding Edge, the maximum skew on a horizontal 14-inch trace using Chronon materials was five picoseconds. The maximum skew on a proprietary test vehicle from a original equipment manufacturer was 1.79 picoseconds. Chronon laminates and prepreg are in the same UL family as Isola's Tachyon(R)-100G, I-Tera(R) MT and Astra(R) MT materials. PCBs manufactured from Chronon materials use the same parameters as Tachyon and Tachyon 100G products. Chronon materials are available with Reverse Treat Foil (RTF) and very low profile copper with 2-micrometer surface roughness (Rz) copper foil, otherwise known as VLP-2 foil.
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