Semiconductors and Semiconductor Equipment
Company Overview of Advanced Micro-Fabrication Equipment Inc.
Advanced Micro-Fabrication Equipment Inc. manufactures and markets wafer micro-fabrication equipment to semiconductor manufacturers and high-tech sectors. It offers dielectric and TSV Etch tools; and dielectric Etch systems for 300-mm production of devices at 65-45 nm. The company’s products include Primo D-RIE, a high frequency de-coupled reactive ion Etch tool for building 65/45/28-nm Etch applications covering a range of etch and stop-layer films; Primo AD-RIE, a dielectric Etch product for FEOL and BEOL applications; Primo TSV200E, an ultra high-productivity etch tool for 200mm wafer-level packaging, MEMS, and 3DIC applications; and Prismo D-Blue, a solution for the production of wafers....
188 Taihua Road
Jinqiao Export Processing Zone (South Area)
5001 Huadong Road
Founded in 2004
Key Executives for Advanced Micro-Fabrication Equipment Inc.
Executive Chairman and Chief Executive Officer
Chief Financial Officer and Vice President
Senior Vice President of Product, Vice President of Corporate Operations and Director
Vice President of Legal and General Counsel
Executive Vice President and Executive Director
Compensation as of Fiscal Year 2014.
Advanced Micro-Fabrication Equipment Inc. Key Developments
Advanced Micro-Fabrication Equipment Inc. Introduces Primo Integrated Dual-Station Etch and Plasma Downstream Asher
Jul 7 14
Advanced Micro-Fabrication Equipment Inc. (AMEC) introduced the Primo Integrated Dual-Station Etch and plasma downstream Asher (Primo iDEA(TM)), an industry-first semiconductor processing tool that integrates dual-station dielectric etch and photoresist strip chambers onto the same platform. Targeted for 2xnm and below etch applications, the Primo iDEA leverages AMEC's proven D-RIE etch technology and the Primo platform to reduce the risk of plasma-induced damage (PID), improve process flexibility, lower COO, improve productivity and optimize valuable fab space. Devices being manufactured using 2xnm and smaller etch applications run an increased risk of building up surface charges that can result in plasma induced device damage (PID). The Primo iDEA incorporates four dielectric etch stations and two strip stations into a single system. It replaces four tools: two dielectric etchers, a resist stripper and a wet cleaning station. AMEC's unique integrative approach enables the optimization of each process step to improve overall PID performance. It significantly increases throughput, reduces processing cost and minimizes equipment foot print. With dedicated dielectric etch and downstream ashing (DSA) capabilities, the new offering is optimal for FEOL and BEOL applications involved in volume-producing complex, extremely small devices that are highly sensitive to manufacturing stresses. The downstream asher design used in the Primo iDEA employs a cost-effective dual-chamber concept and remote plasma source (RPS). The RPS is mounted on top of the DSA, enabling reactive species to be delivered to the wafer surface without direct exposure to the plasma source. This helps minimize the risk of PID.
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