Electronic Equipment, Instruments and Components
Company Overview of Microelectronic Packaging Dresden GmbH
Microelectronic Packaging Dresden GmbH engages in the development and production of microelectronic packaging and module solutions. It offers in-house development services, project management, and in-house sample production/prototyping services, as well as flexible manufacturing services. The company was founded in 1996 and is based in Dresden, Germany. As of September 16, 2005, Microelectronic Packaging Dresden GmbH is a subsidiary of Silicon Sensor International AG.
Founded in 2005
49 0351 21 36 100
49 0351 21 36 109
Key Executives for Microelectronic Packaging Dresden GmbH
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To contact Microelectronic Packaging Dresden GmbH, please visit www.mpd.de/eng/index.html. Company data is provided by Capital IQ. Please use this form to report any data issues.