Semiconductors and Semiconductor Equipment
Company Overview of GLOBALFOUNDRIES Inc.
GLOBALFOUNDRIES Inc. provides semiconductor manufacturing services to high tech customers worldwide. It offers direct and indirect supplementary, post-wafer-manufacturing, prototyping, mask, manufacturing, 300mm, 200mm, lean manufacturing, APM framework, supply chain management, and turnkey services. The company was founded in 2009 and is based in Milpitas, California with manufacturing centers in Germany; Malta, New York; and Singapore. It has regional sales and support offices in Shanghai, Yokohama, Hsinchu, Austin, London, and Munich. The company also has research, development, and design enablement facilities in San Francisco, California; and Dresden, Germany.
840 North McCarthy Boulevard
Milpitas, CA 95035
Founded in 2009
Key Executives for GLOBALFOUNDRIES Inc.
Chief Financial Officer and Executive Vice President of Finance & Administration
Chief Technology Officer and Senior Vice President
Chief Legal Officer, Senior Vice President and Secretary
Head of Strategy & Corporate Development and Senior Vice President
Compensation as of Fiscal Year 2015.
GLOBALFOUNDRIES Inc. Key Developments
Silicon Storage Technology and Globalfoundries Announce Qualification of Automotive Grade 55NM Embedded Flash Memory Technology
May 5 15
Microchip Technology Inc., through its Silicon Storage Technology subsidiary, and GLOBALFOUNDRIES announced the full qualification and availability of SST's 55nm embedded SuperFlash® non-volatile memory (NVM) on GLOBALFOUNDRIES' 55nm Low Power Extended (LPx)/RF enabled platform. The qualification of GLOBALFOUNDRIES' 55nm, split-gate-cell SuperFlash technology-based process was performed according to JEDEC standards. This process technology also met the requirements of AEC-Q100 Grade 1 qualification with an ambient temperature range of -40°C to 125°C, and demonstrated endurance of 100K program/erase cycles with more than 20 years of data retention at 150°C.
GLOBALFOUNDRIES and Cadence Deliver First Soc Enablement Solution Featuring ARM Cortex-A17 Processor
Dec 17 14
Cadence Design Systems Inc. announced the delivery of quad-core silicon built around the ARM® Cortex®-A17 processor implemented using GLOBALFOUNDRIES’ 28nm Super Low Power (28nm-SLP) process with High-k Metal Gate (HKMG) technology. GLOBALFOUNDRIES utilized Cadence® tools exclusively to achieve 2.0GHz processor performance at typical operating conditions, which matched pre-silicon design performance predicted by Cadence Tempus™ Timing Signoff Solution analysis. The Cadence tools used in this successful design include Encounter® Digital Implementation System, Encounter RTL Compiler, Quantus™ QRC Extraction Solution, Tempus Timing Signoff Solution, Encounter Conformal® Equivalence Checker, Physical Verification System and Litho Physical Analyzer. The flow incorporated physical IP technology from the ARM POP™ IP suite to leverage the full performance range of the 28nm-SLP process. Based on the success of this design, Cadence and GLOBALFOUNDRIES have also completed the tapeout of a second chip using the latest ARM Cortex-A17 processor RTL, achieving a 23% single-core area reduction versus the previous tapeout, while meeting the 2.0GHz maximum frequency signoff target. The second tapeout included the full suite of ARM POP IP, including the optimized memory instances for Cortex-A17. In addition, the Cadence Voltus™ IC Power Integrity solution was used throughout the design of the next-generation quad-core tapeout to guide and validate the power grid and enable the implementation of advanced power shutoff technologies. Encounter Conformal Low Power was used to verify the power-intent specification for the design. GLOBALFOUNDRIES’ 28nm-SLP technology is ideally suited for the next generation of mobile devices and low power Internet of Things (IoT) solutions, enabling designs with faster processing speeds, smaller feature sizes, lower standby power and longer battery life. The technology is based on GLOBALFOUNDRIES’ "Gate First" approach to HKMG, which has been in volume production for nearly four years. The technology offers a combination of performance, power efficiency and cost that is ideally suited for the mobile and IoT market.
GLOBALFOUNDRIES Announces Executive Changes
Sep 4 14
GLOBALFOUNDRIES announced that Louis 'Lou' Lupin has joined the company as senior vice president and chief legal officer. In this role, Lupin is responsible for the company's global legal affairs including litigation, intellectual property and corporate matters and will oversee all compliance programs. Lupin has also assumed the role as secretary to the GLOBALFOUNDRIES board of directors. Lupin succeeds Alexie Lee, who had served as GLOBALFOUNDRIES' general counsel since the inception of the company and who has recently taken on the role of chief of staff to the CEO. Before joining GLOBALFOUNDRIES, Lupin was a legal consultant to Qualcomm Incorporated since 2008. Prior to that, he served as Qualcomm's executive vice president, general counsel, and assistant secretary to the board, and as a member of the executive committee. He also sits on the advisory boards of a number of public and private companies.
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