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October 06, 2015 8:32 AM ET

Electronic Equipment, Instruments and Components

Company Overview of Viasystems Corporation

Company Overview

Viasystems Corporation manufactures multilayer rigid printed circuit boards for use in electronic equipment. It offers high-performance materials, quick-turn prototypes, pre-production, and volume production services for PCB fabrication, including HDI solutions, signal integrity, RoHS compliant and lead-free assembly, surface finishes, thermal management, and RF/microwave applications in Asia, Europe, and North America. The company also offers design and engineering support to aid in material selection, fabrication options, and modeling and design activities. The company serves automotive, communications, computer peripherals, consumer, computing and storage, medical, military/aerospace, and...

1521 Poplar Lane

Forest Grove, OR 97116

United States

Founded in 1994

2,950 Employees





Key Executives for Viasystems Corporation

Chief Financial Officer and Executive Vice President of Finance
Age: 53
Chief Executive Officer of Viasystems Group Inc
Age: 57
President of Viasystems Group Inc
Age: 63
Vice President of North American Operations
Age: 53
Vice President of Asia Operations
Age: 49
Compensation as of Fiscal Year 2015.

Viasystems Corporation Key Developments

Viasystems, DDI Cleveland, Coretec Building and Trumauga Properties Announce Amendments to Credit Agreement

On December 31, 2013, in order to extend the maturity date, increase the maximum credit limit, and effect other updates to the subject credit facility, Viasystems Technologies Corp., L.L.C., Viasystems Corporation, Viasystems Sales, Inc., DDi Cleveland Holdings Corp., Coretec Building Inc., and Trumauga Properties, Ltd. as borrowers (the Borrowers), and Viasystems, Inc. as guarantor (the Guarantor), entered into Amendment No. 8 to Loan and Security Agreement (Amendment No. 8) by and among the Borrowers, the Guarantor, and Wells Fargo Capital Finance, LLC, as Agent and Lenders, in respect of the Loan and Security Agreement dated as of February 16, 2010, by and among the borrowers, the Guarantor, the Agent and the Lenders named therein.

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