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May 06, 2015 10:09 PM ET

Capital Markets

Company Overview of Enterprise Ventures Limited

Company Overview

Enterprise Ventures Limited is a private equity and venture capital firm specializing in investment in high growth unquoted companies if the form of debt and equity. The firm seeks to invest at all stages of investment with a focus on early, mid and late venture; management buyouts and buyins; growth capital; expansion; mezzanine; replacement capital; development capital; and early stage technology opportunities. It also considers investments in startup stage in small and medium enterprises. It seeks to invest in all sectors but focuses on coal and consumable fuels; real estate; consumer staples; outdoor wear; service companies; transportation; telecommunication services; information techno...

Preston Technology Management Centre

Marsh Lane

Preston,  PR1 8UQ

United Kingdom

Founded in 1996

Phone:

44 1772 880 729

Fax:

44 845 948887

Key Executives for Enterprise Ventures Limited

Chief Executive Officer and Non-Executive Director
Age: 61
Finance Director and Director
Investment Director and Investment Manager
Investment Director
Investment Director
Compensation as of Fiscal Year 2014.

Enterprise Ventures Limited Key Developments

Enterprise Ventures Limited Presents at BVCA's LP Summit 2014, Oct-08-2014 02:15 PM

Enterprise Ventures Limited Presents at BVCA's LP Summit 2014, Oct-08-2014 02:15 PM. Venue: The Landmark London, 222 Marylebone Road, London NW1 6JQ, United Kingdom. Speakers: Jonathan B. Diggines, Chief Executive Officer and Non-Executive Director.

GT Advanced Technologies Enters into Memorandum of Understanding with EV Group

GT Advanced Technologies has entered into a memorandum of understanding with EV Group to work together in various collaborative arrangements including jointly developing high volume production processes and equipment necessary to bond the ultra-thin sapphire and SiC lamina, produced by GT's Hyperion technology, to engineered substrates such as glass, silicon, and plastics. Additionally, GT announced it will begin working with a leading glass substrate producer to develop specially engineered substrate materials that can be bonded to ultra-thin sapphire lamina to create unique composite solutions that expand the reach of sapphire into a broader set of applications. The company also announced that it has acquired patent-pending technology for producing low-cost, scratch-resistant aluminum oxide coatings for various substrates including glass and plastics. These coatings are expected to provide some of the durability and scratch-resistant properties of crystalline sapphire at a lower price point to address market opportunities where cost is paramount and not all of the properties of sapphire are required.

EV Group Introduces Latest Version of its EVG(R) 40NT Automated Measurement System

EV Group introduced the latest version of its EVG(R) 40NT automated measurement system, which is designed to work in concert with the company's GEMINI(R) FB fusion wafer bonding system to support the manufacture of next-generation 3D-integrated CMOS image sensors. The enhanced EVG40NT measures wafer-to-wafer alignment accuracy to within 40 nm (3 sigma), while its seamless software integration with the GEMINI FB provides a closed-loop fusion bonding control system that enables the manufacture of ultra-fine-pitch (less than two micron) through-silicon vias (TSVs). These tighter specifications are necessary for enabling the production of 3D-integrated image sensors, and pave the way for accelerating 3D-integration with other device types, such as stacked memory. Fusion wafer bonding is ideally suited for 3D-integrated image sensors and other stacked devices because it is a room-temperature bonding process, which eliminates misalignment due to thermal expansion mismatch between the wafers. Having the ability to inspect the quality of the wafer bond and measure alignment accuracy prior to the final annealing step provides an easy rework path, thereby enabling 100% yield for wafer stacking.

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