September 25, 2017 6:37 AM ET

Electronic Equipment, Instruments and Components

Company Overview of Micralyne, Inc.

Company Overview

Micralyne, Inc. develops and manufactures smallest actuators, sensors, and 3D mechanical structures. It also provides micro-electromechanical systems (MEMS) fabrication services to various application areas, including optical MEMS devices, microfluidics, and MEMS sensors; and MicraSilQ, a fabrication design kit for the development and supply of complex MEMS focused on vibration, motion, rotation, and shock detection. The company serves telecommunications, energy, life sciences, automotive, aerospace, and defense markets worldwide. Micralyne, Inc. was founded in 1982 and is based in Edmonton, Canada. As of January 28, 2015, Micralyne, Inc. operates as a subsidiary of FTC Technologies Inc.

94 Street

Suite 1911

Edmonton, AB T6N 1E6

Canada

Founded in 1982

Phone:

780-431-4400

Fax:

780-431-4422

Key Executives for Micralyne, Inc.

Chief Executive Officer
Chief Operating Officer
Chief Revenue Officer and Vice President of Business Development
Age: 57
Vice President of Technology
Vice President of Engineering
Compensation as of Fiscal Year 2017.

Micralyne, Inc. Key Developments

Micralyne, Inc. Announces Availability of Standard Silicon Process Technologies and Process Modules for Development and Production of Gas Sensors

Micralyne Inc. announced the availability of standard silicon process technologies and process modules for the development and production of gas sensors. These new capabilities expand existing standard MEMS building blocks and provide the designer with miniaturized, low-power gas sensing structures required to address current Gas Sensors market trends. Micralyne started providing standard processes and MEMS building blocks in 2006 with an effort to lower the development costs and accelerate time to market of sensor products. With the 2012 introduction of MicraGem-Si and subsequent release of MicraSilQ, Micralyne has maintained a focused commitment to enable MEMS process standardization for silicon-on-insulator (SOI) and wafer level packaging (WLP).

Micralyne, Inc. Announces Collaboration with Microplex in Placentia, California to Develop and Manufacture Custom Wafers

Micralyne Inc. announced a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV).  The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications. The companies engaged in the development of the TSV offering in 2016 and are pleased to offer full volume production capability starting July 2017. The companies have agreed to work jointly to deliver standalone TSV wafers as well as integrated TSV solutions with metal layers for interposer and redistribution layers.  Micralyne will also offer multilayer Wafer Level Packaging (WLP) with metal TSV technologies for ball grid array sensors. Minimum via hole diameters as small as 40um, and 70um pitches are currently being fabricated. The diameter to depth ratio of the via holes can exceed 20:1 providing a flexible and robust wafer thickness.  Conductive via fills are available in Gold, Silver. and Copper metals. Optimized via processing and unique formulations assures effective performance in high frequency device applications while maintaining the purity of the base silicon microstructures.

Micralyne Inc. and Microplex Partner to Deliver Metal 'Through Silicon Via' Wafers

Micralyne Inc. announced a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV). The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications. The companies engaged in the development of the TSV offering in 2016 and are pleased to offer full volume production capability starting July 2017. The companies have agreed to work jointly to deliver standalone TSV wafers as well as integrated TSV solutions with metal layers for interposer and redistribution layers. Micralyne will also offer multilayer Wafer Level Packaging (WLP) with metal TSV technologies for ball grid array sensors.

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