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September 04, 2015 7:00 AM ET

Electronic Equipment, Instruments and Components

Company Overview of Micralyne, Inc.

Company Overview

Micralyne, Inc. develops and manufactures smallest actuators, sensors, and 3D mechanical structures. It also provides micro-electromechanical systems (MEMS) fabrication services to various application areas, including optical MEMS devices, microfluidics, and MEMS sensors; and MicraSilQ, a fabrication design kit for the development and supply of complex MEMS focused on vibration, motion, rotation, and shock detection. The company serves telecommunications, energy, life sciences, automotive, aerospace, and defense markets worldwide. Micralyne, Inc. was founded in 1982 and is based in Edmonton, Canada. As of January 28, 2015, Micralyne, Inc. operates as a subsidiary of FTC Technologies Inc.

94 Street

Suite 1911

Edmonton, AB T6N 1E6


Founded in 1982





Key Executives for Micralyne, Inc.

Acting Chief Executive Officer and Director
Chief Financial Officer
Vice President of Operations
Vice President of Engineering
Vice President of Engineering
Compensation as of Fiscal Year 2015.

Micralyne, Inc. Key Developments

Micralyne Inc. Announces MicraSilQ™ Fabrication Design Kit

Micralyne Inc.’s new MicraSilQ™ fabrication Design Kit cuts costs and speeds product introduction for industrial customers supplying and developing advanced inertial sensors. MicraSilQ™ offers an established fabrication process built for reliable operation and value, and eliminates costly discrete packaging. MicraSilQ™ is ideal for the development and supply of complex micro-electro-mechanical systems (MEMS) focused on vibration, motion, rotation and shock detection. It enables MEMS design professionals to create functionally and reliable devices utilizing a well-established process flow with design rules. MicraSilQ™ supports the production of high volume accelerometer and gyro fabrication in an all-in-one solution integrating wafer level fabrication, hermetic packaging and through-silicon-via (TSV) architecture. For high attachment reliability, the microchip package is completed with lead-free solder with specially-designed under-bump metallization. The standard 60 micron device layer allows for the large capacitive comb finger overlap area widely used in inertial sensor designs. Custom device layer thicknesses greater or less than 60 microns are also available. MicraSilQ™ moves new sensors from prototype to market with optimum performance, device reliability and speed. Micralyne is showcasing the MicraSilQ™ Platform and Design Kit in Booth 240 at the Sensors Expo 2015 trade show in Long Beach, California, June 9-11, 2015.

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