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July 06, 2015 11:26 PM ET


Company Overview of Dow Corning Corporation

Company Overview

Dow Corning Corporation discovers, develops, manufactures, markets, and distributes silicon-based materials worldwide. The company offers approximately 7,000 products in various forms comprising fluids, gels, greases, elastomeric materials, resins, and other rigid materials. Its silicon-based materials are used in a range of products and applications in various sectors, such as electronics, automotive, construction, textiles, and healthcare. In addition, the company manufactures and sells polycrystalline silicon used in semiconductor and solar applications. Dow Corning Corporation was founded in 1943 and is headquartered in Midland, Michigan.

Corporate Center

PO Box 994

Midland, MI 48686

United States

Founded in 1943



Key Executives for Dow Corning Corporation

Chairman, Chief Executive Officer and President
Age: 55
Chief Financial Officer and Executive Vice President
Director, Chairman of the Board-Corning Incorporated, Chief Executive Officer-Corning Incorporated, President-Corning Incorporated and Chief Operating Officer-Corning Incorporated
Age: 76
Director, President of Corning Technologies, Co-Chief Operating Officer of Corning Incorporated, Director of Corning Incorporated and Director of Dow Corning
Age: 73
Greater China President and Global Vice President of Sales for XIAMETER Brand
Compensation as of Fiscal Year 2015.

Dow Corning Corporation Key Developments

Dow Corning Unveils Dow Corning TC-3040

Dow Corning Corporation has unveiled new Dow Corning TC-3040 thermally conductive gel, a next-generation thermal interface material, or TIM-1. Developed through the help of IBM, this new material offers more effective and reliable thermal management, reduced stress and excellent under-die coverage for demanding flip chip applications. TIM-1 solutions are a class of high-purity, thermal interface materials that are applied between the chip surface and a heat spreader to help dissipate damaging heat to the exterior of a semiconductor package. However, as applications from data centers to consumer devices to automotive electronics all demand higher functioning integrated semiconductor devices with increasing processing power, the temperatures within chip packages are rapidly increasing and testing the limits of conventional TIM-1 solutions.

Dow Corning Introduces New EA-7100 Adhesive

Dow Corning has introduced the new Dow Corning EA-7100 Adhesive. The new Dow Corning EA-7100 Adhesive is a breakthrough silicone chemistry that greatly expands design options for automotive electronics by enabling strong bonds to a wide variety of substrates. This one-part, heat-cure adhesive also cures rapidly and at lower temperatures from the "inside out" to greatly accelerate processing, lower energy use and reduce material costs.

Dow Corning Corporation Reports Unaudited Consolidated Earnings Results for the First Quarter Ended March 31, 2015

Dow Corning Corporation reported unaudited consolidated earnings results for the first quarter ended March 31, 2015. For the quarter, the company reported net sales of $1,363.5 million against $1,524.2 million a year ago. Net income attributable to the company was $185.4 million against $190.9 million a year ago. Adjusted net income was $101.1 million against $109.3 million a year ago. First quarter results decreased due to fewer polysilicon shipments to long-term contract customers. These contracts have a degree of variability when customers take their product and recent order patterns have resulted in customer orders being concentrated in the fourth quarter.

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